GB2265374B - Curable epoxy resin systems - Google Patents
Curable epoxy resin systemsInfo
- Publication number
- GB2265374B GB2265374B GB9304274A GB9304274A GB2265374B GB 2265374 B GB2265374 B GB 2265374B GB 9304274 A GB9304274 A GB 9304274A GB 9304274 A GB9304274 A GB 9304274A GB 2265374 B GB2265374 B GB 2265374B
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy resin
- curable epoxy
- resin systems
- systems
- curable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
- C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
- C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2461/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4206642 | 1992-03-03 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9304274D0 GB9304274D0 (en) | 1993-04-21 |
GB2265374A GB2265374A (en) | 1993-09-29 |
GB2265374B true GB2265374B (en) | 1996-05-22 |
Family
ID=6453100
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9304274A Expired - Lifetime GB2265374B (en) | 1992-03-03 | 1993-03-03 | Curable epoxy resin systems |
Country Status (3)
Country | Link |
---|---|
FR (1) | FR2688794A1 (en) |
GB (1) | GB2265374B (en) |
IT (1) | IT1261171B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3447015B2 (en) * | 1993-04-23 | 2003-09-16 | 三井化学株式会社 | Epoxy resin composition |
BRPI0817220A2 (en) | 2007-09-21 | 2016-05-03 | Saint Gobain Abrasifs Sa | method of forming a modified phenolic resin composition, modified phenolic resin composition, abrasive product and the method of manufacture thereof |
US9546243B2 (en) | 2013-07-17 | 2017-01-17 | Air Products And Chemicals, Inc. | Amines and polymeric phenols and usage thereof as curing agents in one component epoxy resin compositions |
GB201509525D0 (en) | 2015-06-02 | 2015-07-15 | Cytec Ind Inc | Fast cure epoxy resin compositions |
EP3263628A1 (en) * | 2016-06-27 | 2018-01-03 | Hexcel Composites Limited | Particulate curing components |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4966928A (en) * | 1986-06-05 | 1990-10-30 | Somar Corporation | Epoxy resin based powder coating composition |
EP0496618A2 (en) * | 1991-01-25 | 1992-07-29 | Somar Corporation | Powder epoxy resin coating composition |
EP0506359A2 (en) * | 1991-03-29 | 1992-09-30 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin compositions and semiconductor devices encapsulated therewith |
EP0506360A2 (en) * | 1991-03-29 | 1992-09-30 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin compositions and semiconductor devices encapsulated therewith |
EP0523001A1 (en) * | 1991-06-20 | 1993-01-13 | Ciba-Geigy Ag | Curable epoxy resin composition containing a blocked accelerator |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA1259897A (en) * | 1985-04-02 | 1989-09-26 | Madan M. Bagga | Bonding process using curable epoxide resin adhesive |
GB8622998D0 (en) * | 1986-09-24 | 1986-10-29 | Ciba Geigy Ag | Curable compositions |
GB8824391D0 (en) * | 1988-10-18 | 1988-11-23 | Ciba Geigy Ag | Compositions |
-
1993
- 1993-01-29 IT ITRM930048A patent/IT1261171B/en active IP Right Grant
- 1993-03-03 GB GB9304274A patent/GB2265374B/en not_active Expired - Lifetime
- 1993-03-03 FR FR9302458A patent/FR2688794A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4966928A (en) * | 1986-06-05 | 1990-10-30 | Somar Corporation | Epoxy resin based powder coating composition |
EP0496618A2 (en) * | 1991-01-25 | 1992-07-29 | Somar Corporation | Powder epoxy resin coating composition |
EP0506359A2 (en) * | 1991-03-29 | 1992-09-30 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin compositions and semiconductor devices encapsulated therewith |
EP0506360A2 (en) * | 1991-03-29 | 1992-09-30 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin compositions and semiconductor devices encapsulated therewith |
EP0523001A1 (en) * | 1991-06-20 | 1993-01-13 | Ciba-Geigy Ag | Curable epoxy resin composition containing a blocked accelerator |
Also Published As
Publication number | Publication date |
---|---|
IT1261171B (en) | 1996-05-09 |
ITRM930048A0 (en) | 1993-01-29 |
ITRM930048A1 (en) | 1994-07-29 |
FR2688794A1 (en) | 1993-09-24 |
GB9304274D0 (en) | 1993-04-21 |
GB2265374A (en) | 1993-09-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PE20 | Patent expired after termination of 20 years |
Expiry date: 20130302 |