KR970707199A - 붕산 및 이의 동족체에 의해 촉진되는 경화성 에폭시 수지(Curable epoxy resin accelerated by boric acid and its analogs) - Google Patents

붕산 및 이의 동족체에 의해 촉진되는 경화성 에폭시 수지(Curable epoxy resin accelerated by boric acid and its analogs) Download PDF

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Publication number
KR970707199A
KR970707199A KR1019970702607A KR19970702607A KR970707199A KR 970707199 A KR970707199 A KR 970707199A KR 1019970702607 A KR1019970702607 A KR 1019970702607A KR 19970702607 A KR19970702607 A KR 19970702607A KR 970707199 A KR970707199 A KR 970707199A
Authority
KR
South Korea
Prior art keywords
boric acid
epoxy resin
catalyst
phr
acid compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019970702607A
Other languages
English (en)
Korean (ko)
Inventor
제임스 엘. 버트람
루이스 엘. 워커
게라 알 간트
조셉 강
Original Assignee
그레이스 스티븐 에스
더 다우 케미칼 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 그레이스 스티븐 에스, 더 다우 케미칼 캄파니 filed Critical 그레이스 스티븐 에스
Publication of KR970707199A publication Critical patent/KR970707199A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W74/47—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H10W70/69—
    • H10W70/695—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C08K5/19—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/55—Boron-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1019970702607A 1994-10-21 1995-10-13 붕산 및 이의 동족체에 의해 촉진되는 경화성 에폭시 수지(Curable epoxy resin accelerated by boric acid and its analogs) Withdrawn KR970707199A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9421407A GB9421407D0 (en) 1994-10-21 1994-10-21 Curable epoxy resin accelerated by boric acid and its analogs
GB9421407.9 1994-10-21
PCT/US1995/013360 WO1996012752A2 (en) 1994-10-21 1995-10-13 Curable epoxy resin accelerated by boric acid and its analogs

Publications (1)

Publication Number Publication Date
KR970707199A true KR970707199A (ko) 1997-12-01

Family

ID=10763298

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970702607A Withdrawn KR970707199A (ko) 1994-10-21 1995-10-13 붕산 및 이의 동족체에 의해 촉진되는 경화성 에폭시 수지(Curable epoxy resin accelerated by boric acid and its analogs)

Country Status (7)

Country Link
EP (1) EP0787162A2 (enExample)
JP (1) JPH10507481A (enExample)
KR (1) KR970707199A (enExample)
BR (1) BR9509395A (enExample)
GB (1) GB9421407D0 (enExample)
TW (1) TW294700B (enExample)
WO (1) WO1996012752A2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9421405D0 (en) 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
KR100431440B1 (ko) * 2001-05-04 2004-05-14 주식회사 엘지화학 에폭시 수지 조성물
KR100431439B1 (ko) * 2001-05-08 2004-05-14 주식회사 엘지화학 에폭시 수지 조성물
US7919567B2 (en) 2006-06-07 2011-04-05 Dow Global Technologies Llc Oligomeric halogenated chain extenders for preparing epoxy resins
US20080039595A1 (en) * 2006-06-07 2008-02-14 Joseph Gan Oligomeric halogenated chain extenders for preparing epoxy resins
EP2385962B1 (en) * 2009-01-06 2015-09-02 Dow Global Technologies LLC Metal stabilizers for epoxy resins and advancement process
DE102009027826A1 (de) 2009-04-29 2010-11-04 Evonik Degussa Gmbh Katalyse von Epoxidharzformulierungen
JP2014523451A (ja) * 2011-05-02 2014-09-11 ダウ グローバル テクノロジーズ エルエルシー エポキシ樹脂中のホウ酸トリメチル
DE102022118570A1 (de) * 2022-07-25 2024-01-25 Alzchem Trostberg Gmbh Verfahren zur Herstellung einer Epoxidharz-Zusammensetzung zur Vorimprägnierung von Werkstoffen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050371B2 (ja) * 1981-10-30 1985-11-08 株式会社東芝 エポキシ樹脂組成物
JPH02103224A (ja) * 1988-10-12 1990-04-16 Three Bond Co Ltd エポキシ樹脂用潜在性硬化剤
JPH0340459A (ja) * 1989-07-07 1991-02-21 Nitto Denko Corp 半導体装置
SG43193A1 (en) * 1990-05-21 1997-10-17 Dow Chemical Co Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom
JPH04284652A (ja) * 1991-03-13 1992-10-09 Nitto Denko Corp 半導体装置およびそれに用いる半導体封止用エポキシ樹脂組成物ならびにその製法

Also Published As

Publication number Publication date
EP0787162A2 (en) 1997-08-06
TW294700B (enExample) 1997-01-01
WO1996012752A2 (en) 1996-05-02
WO1996012752A3 (en) 1996-07-18
GB9421407D0 (en) 1994-12-07
BR9509395A (pt) 1997-09-30
JPH10507481A (ja) 1998-07-21

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 19970421

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid