KR970704578A - 실리콘 수지 및 점토를 함유하는 중합성 막(Polymeric Film Containing Silicone Resin and Clay) - Google Patents

실리콘 수지 및 점토를 함유하는 중합성 막(Polymeric Film Containing Silicone Resin and Clay) Download PDF

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KR970704578A
KR970704578A KR1019970700035A KR19970700035A KR970704578A KR 970704578 A KR970704578 A KR 970704578A KR 1019970700035 A KR1019970700035 A KR 1019970700035A KR 19970700035 A KR19970700035 A KR 19970700035A KR 970704578 A KR970704578 A KR 970704578A
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silicone resin
layer
weight
particles
resin particles
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KR100354097B1 (ko
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폴 데이빗 앨런 밀스
주네이드 아메드 시디퀴
안톤 리차드 올렉
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마틴 험프리
임페리얼 케미칼 인더스트리즈 피엘씨
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B32B2250/244—All polymers belonging to those covered by group B32B27/36
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/40—Closed containers
    • B32B2439/62—Boxes, cartons, cases
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31786—Of polyester [e.g., alkyd, etc.]

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)

Abstract

중합성 물질의 제1층 및 그의 적어도 한 표면상의, 제2층내의 중합체의 중량을 기준하여 (a) 부피 분포된 중앙 입경이 1.5 내지 12.5㎛인 실리콘 수지 입자 및 (또는 ) 소성된 실리콘 수지 입자 0.05중량% 내지 2.0중량%,및 (b) 부피 분포된 중앙 입경이 0.1 내지 2.0㎛인 고령토 입자 0.005중향% 내지 1.0중량%로 이루어지는 중합성 물질의 제2층으로 이루어지는 중합성 막. 상기 막은 바람직하게는 폴리에스테르 막이다. 상기 막은 광학적 특성 및 취급 특성이 개선된다.

Description

실리콘 수지 및 점토를 함유하는 중합성 막(Polymereic Film Containing Silicone Resin and Clay)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 제1층 기재의 제1표면에 직접적으로 부착된 제2층으로 이루어진 중합성 막의 실제 크기가 아닌 도식적인 단면의 정면도이다.
제2도는 제1층으로부터 먼 제2층의 표면에 부착된 추가의 정진 방지 코팅층이 있는 제1도에 나타낸 중합성 막의 유사한 도식적인 정면도이다.
제3도는 제1층의 제2표면에 부착된 추가의 부착성 증진층이 있는 제2도에 나타낸 중합성 막의 유사한 도식적인 정면도이다.

Claims (10)

  1. 중합성 물질의 제1층 및 그의 적어도 한 표면상의 제2층내의 중합체의 중량을 기준하여 (a) 부피 분포된 중앙 입경이 1.5 내지 12.5㎛인 실피콘 수지 입자 및(또는) 소성된 실리콘 수지 입자 0.05중량% 내지 2.0중량%, 및 (b) 부피 분포된 중앙 입명이 0.1내지 20㎛인 고령토 입자 0.005중량% 내지 1.0중량%로 이루어지는 중합성 물질의 제2층으로 이루어지는 중합성 막.
  2. 제1항에 있어서, 실리콘 수지 입자가 하기 식의 3차원 중합체 쇄 구조로 이루어지는 막.
    RxSio₂­(ｘ/₂)
    상기 식에서, x는 1 이상이고, R은 유기기를 나타낸다.
  3. 제1항 또는 제2항에 있어서, 소성된 시리콘 수지 입자가 하기 식의 3차원 중합체 쇄 구조로 이루어지는 막.
    Rx(oH)y SiO₂-((x+y)/2)
    상기 식에서, x는 O 내지 0.9이고 y는 O 내지 1.2이다.
  4. 제1항 내지 제3항 중 어느 한 항에 있어서, 실리콘 수지 입자 및(또는) 소성된 실피콘 수지 입자의 BET 비표적이 80㎡/g 미만인 막.
  5. 제1항 내지 제4항 중 어느 한 항에 있어서, 실리콘 수지 입자 및(또는) 소성된 실리콘 수지 입자의 부피 분포된 중앙 입경이 2.8 내지 5.0㎛인 막.
  6. 제1항 내지 제5항 중 어느 한 항에 있어서, 제2층이 0.2중량% 내지 0.5중량%의 실리콘 수지 입자 및(또는) 소성된 실리콘 수지 입자로 이루어지는 막.
  7. 제1항 내지 제6항 중 어느 한 항에 있어서, 고령토 입자의 부피 분포된 중앙 입경이 0.2 내지 0.6㎛인 막.
  8. 제1항 내지 제7항 중 어느 한 항에 있어서, 제2층이 0.015중량%내지 0.1중량%의 고령토 입자로 이루어지는 막.
  9. 제1항 내지 제8항 중 어느 한 항에 있어서, 제1층 또는 제2층 중 하나 이상이 결정성 또는 반결정성 폴리에틸렌 테레프탈레이트 및(또는) 폴리에틸렌 나프탈레이트로 이루어지는 막.
  10. 중합성 물질의 제1층 기재 및 그의 적어도 한 표면상의, 제2층내의 중합체의 중량을 기준하여 (a) 부피 분포된 중앙 입경이 1.5 내지 12.5㎛인 실리콘 수지 입자 및(또는) 소성된 실리콘 수지 입자 0.05중량% 내지 2.0중량%, 및 (b) 부피 분포된 중앙 입경이 0.1 내지 2.0㎛인 고령토 입자 0.005중량% 내지 1.0중량%로 이루어지는 중합성 물질의 제2층을 형성 시키는 것으로 이루어지는 중합성 막의 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970700035A 1994-07-07 1995-07-06 실리콘수지및점토를함유하는중합체필름 KR100354097B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/271,448 1994-07-07
US08/271,448 US5614313A (en) 1994-07-07 1994-07-07 Polymeric film having a layer comprising calcined silicone particles and china clay particles

Publications (2)

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KR970704578A true KR970704578A (ko) 1997-09-06
KR100354097B1 KR100354097B1 (ko) 2003-03-15

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US (1) US5614313A (ko)
EP (1) EP0768952B1 (ko)
JP (2) JP4205160B2 (ko)
KR (1) KR100354097B1 (ko)
CN (1) CN1078846C (ko)
AT (1) ATE172151T1 (ko)
AU (1) AU2985195A (ko)
CA (1) CA2193619A1 (ko)
DE (1) DE69505388T2 (ko)
TW (1) TW412570B (ko)
WO (1) WO1996001739A1 (ko)

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JP2004330791A (ja) 2004-11-25
CN1078846C (zh) 2002-02-06
KR100354097B1 (ko) 2003-03-15
TW412570B (en) 2000-11-21
DE69505388D1 (de) 1998-11-19
AU2985195A (en) 1996-02-09
CA2193619A1 (en) 1996-01-25
JPH10502587A (ja) 1998-03-10
US5614313A (en) 1997-03-25
ATE172151T1 (de) 1998-10-15
EP0768952A1 (en) 1997-04-23
JP4347758B2 (ja) 2009-10-21
DE69505388T2 (de) 1999-05-06
JP4205160B2 (ja) 2009-01-07
EP0768952B1 (en) 1998-10-14
WO1996001739A1 (en) 1996-01-25
CN1151714A (zh) 1997-06-11

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