KR970701227A - 방사 경화성 실리콘 이형 조성물과 코팅된 기판(radiation curable sili one release compositions and coated substrates) - Google Patents

방사 경화성 실리콘 이형 조성물과 코팅된 기판(radiation curable sili one release compositions and coated substrates)

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KR970701227A
KR970701227A KR1019960704746A KR19960704746A KR970701227A KR 970701227 A KR970701227 A KR 970701227A KR 1019960704746 A KR1019960704746 A KR 1019960704746A KR 19960704746 A KR19960704746 A KR 19960704746A KR 970701227 A KR970701227 A KR 970701227A
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substrate
release
composition
release composition
organopolysiloxane
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윌리엄 이. 키돈
탄흐 브이. 응무겐
텐흥 브이. 리
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케이.에이. 칼드웰
애버리 데니슨 코포레이션
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Publication of KR970701227A publication Critical patent/KR970701227A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/334—Applications of adhesives in processes or use of adhesives in the form of films or foils as a label
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/28—Presence of paper
    • C09J2400/283—Presence of paper in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/005—Presence of (meth)acrylic polymer in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/005—Presence of polysiloxane in the release coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2839—Web or sheet containing structurally defined element or component and having an adhesive outermost layer with release or antistick coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Abstract

(A) 하기 식으로 특징되는 오르가노폴리실록산 혼합물로서
RSi(CH3)2-O-(Si(CH3)2O)n(Si(CH3) (R)O)mSi(CH3)2R (Ⅰ)
(A-1) 각 R이 -R1-O(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 15까지의 수 그리고 n은 약 50에서 300까지의 수인 식 Ⅰ으로 특징되는 적어도 하나의 오르가노폴리실록산 약 25∼95wt%, (A-2) R이 -R1-OCH2CH(OH)CH2O-(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 25까지의 수, 그리고 n은 약 50에서 300까지의 수인 식 Ⅰ으로 특징되는 적어도 하나의 또다른 오르가노폴리실록산 약 5∼75wt%를 포함하는 혼합물 및 (B) 광개시제 약 0∼5wt%를 포함하는 방사경화성 실리콘 이형 조성물이 기술된다. 실리콘 이형 코팅된 기판을 제조하는 방법, 이 방법에 의해 제조된 이형 코팅된 제품 그리고 실리콘 이형층이 도입된 다층제품 또는 구조물도 기술된다. 실리콘 조성물이 전자빔 방사선 같은 것에 의해 경화되었을 때 경화된 조성물은 라벨 제조과정에 사용되는 것과 같은 고속에서 바람직한 고도의 제어된 이형력을 나타낸다.

Description

방사 경화성 실리콘 이형 조성물과 코팅된 기판 (RADIATION CURABLE SILI ONE RELEASE COMPOSITIONS AND COATED SUBSTRATES)
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (16)

  1. (A) 하기 식으로 특징되는 오르가노폴리실록산 혼합물로서
    RSi(CH3)2-O-(Si(CH3)2O)n(Si(CH3) (R)O)mSi(CH3)2R (Ⅰ)
    (A-1) 각 R이 -R1-O(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 15까지의 수, 및 n은 약 50에서 300까지의 수인 식 Ⅰ으로 특징되는 적어도 하나의 오르가노폴리실록산 약 25∼95wt%, (A-2)각 R이 -R1-OCH2CH(OH)CH2O-(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 25까지의 수, 및 n은 약 50에서 300까지의 수인 식 Ⅰ로 특징되는 적어도 하나의 또다른 오르가노폴리실록산 약 5∼75wt%를 포함하는 물, 및 (B) 광개시제 약 0∼5wt%를 포함하는 방사경화성 실리콘 이형 조성물.
  2. 제1항에 있어서, 약 40∼80wt%의 (A-1) 및 약 20∼60wt%의 (A-2)를 포함하는 이형 조성물.
  3. 제1항에 있어서, R1이 약 1∼10개의 탄소원자를 포함하는 2가의 알킬렌기인 이형 조성물.
  4. 제1항에 있어서, 각각의 R2가 수소인 이형 조성물.
  5. 제1항에 있어서, 하나 이상의 아크릴화 또는 메타크릴화된 유기 폴리하이드록시 화합물 또는 폴리아미노 화합물(C)을 더 함유하는 이형 조성물.
  6. 제1항에 있어서, 하나 이상의 아크릴화 또는 메타크릴화된 폴리하이드록시 화합물을 더 함유하는 이형 조성물.
  7. 제6항에 있어서, 하나 이상의 액체 유기 모노아크릴레이트 에스테르 화합물을 더 함유하는 이형 조성물.
  8. 제1항에 있어서, 전자 빔 조사에 의해 경화가능한 이형 조성물.
  9. (A) 하기 식으로 특징되는 오르가노폴리실록산 혼합물로서
    RSi(CH3)2-O-(Si(CH3)2O)n(Si(CH3)(R)O)|mSi(CH3)2R (Ⅰ)
    (A-1) 각 R이 -R1-O(O)C-C(R2)=CH2이고, R1은 1∼10의 탄소원자를 함유하는 하이드로카르빌렌기, R2는 수소, m은 약 1에서 15까지의 수, 및 n은 약 50에서 300까지의 수인 식 Ⅰ으로 특징되는 적어도 하나의 오르가노폴리실록산 약 40∼80wt%, (A-2) 각 R이 -R1-OCH2CH(OH)CH2O-(O)C-C(R2)=CH2이고, R1은 하이드로카르빌렌기, R2는 수소 또는 메틸기 또는 에틸기, m은 약 1에서 25까지의 수 및 n은 약 50에서 300까지의 수인 식 Ⅰ로 특징되는 적어도 하나의 또다른 오르가노폴리실록산 약 20∼60wt%를 포함하는 혼합물을 포함하는 전자빔 경화성 실리콘 이형 조성물.
  10. 제9항에 있어서, 유기 폴리하이드록시 화합물 중 하나 이상의 디-, 트리-, 또는 테트라-아크릴레이트 에스테르(C)를 더 함유하는 이형 조성물.
  11. (A) 제1항의 조성물로 이루어진 코팅물을 기판에 도포하고, (B) 방사선에 코팅물을 노출시키므로서 기판위의 코팅물을 경화하는 것을 포함하는 실리콘 이형 코팅된 기판을 제조하는 방법.
  12. 제11항에 있어서, 조성물이 전자빔으로 경화되는 방법.
  13. 제1항의 이형 코팅조성물로 코팅되고 방사선에 노출됨으로서 경화된 기판을 포함하는 이형 코팅 제품.
  14. 제13항에 있어서, 기판이 종이인 이형 코팅 제품.
  15. (A) 제1기판; (B) 제2기판; (C) 방사선에 노출됨으로서 경화된, 제1항의 실리콘 이형 조성물을 포함하는 실리콘 이형 층; 및 (D) 압력 민감성 접착제 층을 포함하며, 여기에서 실리콘 이형층(C)은 제1기판과 압력 민감성 접착제의 층(D) 사이에 놓여서 바람직하게는 제1기판에 부착되며, 압력 민감성 접착제 층(D)은 이형층과 제2기판 사이에 놓여서 바람직하게는 두 번째 기판에 부착되는 것을 특징으로 하는 다층 제품.
  16. 제15항에 있어서, 제1기판과 제2기판이 종이인 다층 제품.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960704746A 1994-03-02 1995-02-27 방사 경화성 실리콘 이형 조성물과 코팅된 기판(radiation curable sili one release compositions and coated substrates) KR970701227A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20477294A 1994-03-02 1994-03-02
US08/204,772 1994-03-02
PCT/US1995/002414 WO1995023694A1 (en) 1994-03-02 1995-02-27 Radiation curable silicone release compositions and coated substrates

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KR970701227A true KR970701227A (ko) 1997-03-17

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US (2) US5494945A (ko)
KR (1) KR970701227A (ko)
CN (1) CN1143346A (ko)
AU (1) AU1933095A (ko)
BR (1) BR9507124A (ko)
DE (1) DE19581563T1 (ko)
GB (1) GB2301369B (ko)
MX (1) MX9603759A (ko)
WO (1) WO1995023694A1 (ko)

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AU1933095A (en) 1995-09-18
BR9507124A (pt) 1997-09-30
GB2301369A (en) 1996-12-04
US5654093A (en) 1997-08-05
CN1143346A (zh) 1997-02-19
WO1995023694A1 (en) 1995-09-08
US5494945A (en) 1996-02-27
MX9603759A (es) 1997-12-31
GB2301369B (en) 1997-08-13
DE19581563T1 (de) 1997-02-27

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