KR970077301A - 기판 폴리싱 장치 - Google Patents
기판 폴리싱 장치 Download PDFInfo
- Publication number
- KR970077301A KR970077301A KR1019970016955A KR19970016955A KR970077301A KR 970077301 A KR970077301 A KR 970077301A KR 1019970016955 A KR1019970016955 A KR 1019970016955A KR 19970016955 A KR19970016955 A KR 19970016955A KR 970077301 A KR970077301 A KR 970077301A
- Authority
- KR
- South Korea
- Prior art keywords
- grooves
- polishing
- substrate
- parallel grooves
- parallel
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract 47
- 239000000758 substrate Substances 0.000 title claims abstract 22
- 239000000126 substance Substances 0.000 claims abstract 6
- 238000000034 method Methods 0.000 claims 2
- 238000007517 polishing process Methods 0.000 claims 2
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US64305496A | 1996-05-02 | 1996-05-02 | |
| US8/643,054 | 1996-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077301A true KR970077301A (ko) | 1997-12-12 |
Family
ID=24579176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019970016955A KR970077301A (ko) | 1996-05-02 | 1997-05-02 | 기판 폴리싱 장치 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0806267A1 (ja) |
| JP (1) | JPH1071561A (ja) |
| KR (1) | KR970077301A (ja) |
| TW (1) | TW349896B (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3056714B2 (ja) * | 1997-10-06 | 2000-06-26 | 松下電子工業株式会社 | 半導体基板の研磨方法 |
| US6287174B1 (en) | 1999-02-05 | 2001-09-11 | Rodel Holdings Inc. | Polishing pad and method of use thereof |
| US6234875B1 (en) | 1999-06-09 | 2001-05-22 | 3M Innovative Properties Company | Method of modifying a surface |
| DE60232497D1 (de) * | 2001-01-05 | 2009-07-16 | Seiko Epson Corp | Poliervorrichtung und -verfahren |
| US6612917B2 (en) | 2001-02-07 | 2003-09-02 | 3M Innovative Properties Company | Abrasive article suitable for modifying a semiconductor wafer |
| US6632129B2 (en) | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
| RU190145U1 (ru) * | 2018-10-15 | 2019-06-21 | Акционерное общество "Опытное Конструкторское Бюро Машиностроения имени И.И. Африкантова" (АО "ОКБМ Африкантов") | Притир |
| CN117733662B (zh) * | 2024-02-19 | 2024-04-16 | 南方科技大学 | 一种基于等离子体刻蚀和改性作用的金刚石抛光方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2639278B1 (fr) * | 1988-11-22 | 1991-01-11 | Lam Plan Sa | Plateau de polissage |
| US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
| US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
| JP2985490B2 (ja) * | 1992-02-28 | 1999-11-29 | 信越半導体株式会社 | 研磨機の除熱方法 |
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US6019672A (en) * | 1994-09-08 | 2000-02-01 | Struers A/S | Grinding/polishing cover sheet for placing on a rotatable grinding/polishing disc |
-
1997
- 1997-04-30 TW TW086105712A patent/TW349896B/zh not_active IP Right Cessation
- 1997-05-01 EP EP97302999A patent/EP0806267A1/en not_active Withdrawn
- 1997-05-01 JP JP14841097A patent/JPH1071561A/ja not_active Withdrawn
- 1997-05-02 KR KR1019970016955A patent/KR970077301A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| TW349896B (en) | 1999-01-11 |
| EP0806267A1 (en) | 1997-11-12 |
| JPH1071561A (ja) | 1998-03-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |