KR970077287A - 반도체재료의 처리방법 - Google Patents

반도체재료의 처리방법 Download PDF

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Publication number
KR970077287A
KR970077287A KR1019970017714A KR19970017714A KR970077287A KR 970077287 A KR970077287 A KR 970077287A KR 1019970017714 A KR1019970017714 A KR 1019970017714A KR 19970017714 A KR19970017714 A KR 19970017714A KR 970077287 A KR970077287 A KR 970077287A
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KR
South Korea
Prior art keywords
semiconductor material
liquid
processing
liquid tank
material according
Prior art date
Application number
KR1019970017714A
Other languages
English (en)
Inventor
쾨플 프란즈
스테이드텐 프리드리히
테우스 슈안츠 마
Original Assignee
에리히 프랑크
와커-헤미 게엠베하
칼-하인즈 림빅
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에리히 프랑크, 와커-헤미 게엠베하, 칼-하인즈 림빅 filed Critical 에리히 프랑크
Publication of KR970077287A publication Critical patent/KR970077287A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Abstract

본 발명은 액조내에서 반도체재료를 처리하는 방법에 관한 것이다. 그 처리는 캐비테이션(cavitation)의 발생이 액조내에서 현저하다.

Description

반도체재료의 처리방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
첨부도면은 본 발명에 의한 방법을 실시하기에 적합한 장치의 개략단면도이다.

Claims (6)

  1. 액조내에서의 반도체재료의 처리방법에 있어서, 캐비테이션(cavitation)의 발생이 액조내에서 이루어짐을 특징으로 하는 반도체재료의 처리방법.
  2. 제1항에 있어서, 그 액조내에서 캐비테이션이 발생하도록 함을 특징으로 하는 반도체재료의 처리방법.
  3. 제2항에 있어서, 반도체재료는 그 분사액이 용기의 경계면에 투과할 수 있는 용기내에 설정되어 있음을 특징으로 하는 반도체재료의 처리방법.
  4. 제1항에 있어서, 반도체재료를 처리할때, 액조에서의 액체 일부가 새로운 액체로 대치되고, 또 그 액체일부는 액조에서 제거시켜 여과하여 그 여액을 액조로 복귀하도록 함을 특징으로 하는 반도체재료의 처리방법.
  5. 제1항에 있어서, 물, 세척제수용액 및 수용성에칭액(etchants)으로 구성되는 그룹에서 선정된 액체가 사용됨을 특징으로 하는 반도체재료의 처리방법.
  6. 제1항에 있어서, 반도체재료가 단결정성 실리콘 및 다결정성 실리콘으로 이루어진 그룹에서 선정됨을 특징으로 하는 반도체재료의 처리방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970017714A 1996-05-10 1997-05-08 반도체재료의 처리방법 KR970077287A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE96-19618974.8 1996-05-10
DE19618974A DE19618974A1 (de) 1996-05-10 1996-05-10 Verfahren zur Behandlung von Halbleitermaterial

Publications (1)

Publication Number Publication Date
KR970077287A true KR970077287A (ko) 1997-12-12

Family

ID=7794008

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970017714A KR970077287A (ko) 1996-05-10 1997-05-08 반도체재료의 처리방법

Country Status (5)

Country Link
US (1) US5820688A (ko)
JP (1) JPH1041271A (ko)
KR (1) KR970077287A (ko)
DE (1) DE19618974A1 (ko)
IT (1) IT1290599B1 (ko)

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US6118289A (en) * 1997-03-10 2000-09-12 Canon Kabushiki Kaisha Cleaning method and cleaning device and cleaning tool for board electrical-test probes, and board electrical-test device and method
US6502591B1 (en) * 2000-06-08 2003-01-07 Semitool, Inc. Surface tension effect dryer with porous vessel walls
US8021483B2 (en) * 2002-02-20 2011-09-20 Hemlock Semiconductor Corporation Flowable chips and methods for the preparation and use of same, and apparatus for use in the methods
US6874713B2 (en) 2002-08-22 2005-04-05 Dow Corning Corporation Method and apparatus for improving silicon processing efficiency
GB2418347A (en) * 2004-09-23 2006-03-29 Univ Sheffield Fluid agitation or cavitation cleansing of particles
JP4559288B2 (ja) * 2005-04-28 2010-10-06 京セラキンセキ株式会社 エッチング装置
JP4762822B2 (ja) 2006-08-03 2011-08-31 東京エレクトロン株式会社 薬液混合方法および薬液混合装置
DE102007040851A1 (de) * 2007-08-29 2009-03-05 Wacker Chemie Ag Verfahren zum Reinigen von polykristallinem Silicium
WO2010073725A1 (ja) * 2008-12-26 2010-07-01 三菱マテリアル株式会社 多結晶シリコンの洗浄方法及び洗浄装置並びに多結晶シリコンの製造方法
US9242340B1 (en) * 2013-03-12 2016-01-26 Western Digital Technologies, Inc. Method to stress relieve a magnetic recording head transducer utilizing ultrasonic cavitation
US20220184670A1 (en) * 2020-12-16 2022-06-16 The Boeing Company Flexible cavitation apparatus

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US3031363A (en) * 1959-09-24 1962-04-24 Sylvania Electric Prod Method and apparatus for treating bodies of semiconductor material
US3997358A (en) * 1976-02-19 1976-12-14 Motorola, Inc. Cleaning process for semiconductor die
GB2005147B (en) * 1977-09-15 1982-03-10 Rolls Royce Fluid operated nozzles for generation of vibrations in liquid
DE3317286A1 (de) * 1983-05-11 1984-11-22 Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen Verfahren zur reinigung von silicium durch saeureeinwirkung
WO1987006862A1 (en) * 1986-05-16 1987-11-19 Eastman Kodak Company Ultrasonic cleaning method and apparatus
US5217163A (en) * 1990-12-18 1993-06-08 Nlb Corp. Rotating cavitating jet nozzle
US5327921A (en) * 1992-03-05 1994-07-12 Tokyo Electron Limited Processing vessel for a wafer washing system
US5316591A (en) * 1992-08-10 1994-05-31 Hughes Aircraft Company Cleaning by cavitation in liquefied gas
US5384989A (en) * 1993-04-12 1995-01-31 Shibano; Yoshihide Method of ultrasonically grinding workpiece
DE4316626A1 (de) * 1993-05-18 1994-11-24 Wacker Chemitronic Verfahren und Vorrichtung zur Zerkleinerung von Halbleitermaterial
JP2504916B2 (ja) * 1993-09-20 1996-06-05 株式会社芝浦製作所 基板洗浄装置
US5656097A (en) * 1993-10-20 1997-08-12 Verteq, Inc. Semiconductor wafer cleaning system
US5368054A (en) * 1993-12-17 1994-11-29 International Business Machines Corporation Ultrasonic jet semiconductor wafer cleaning apparatus
WO1996022844A1 (en) * 1995-01-27 1996-08-01 Trustees Of Boston University Acoustic coaxing methods and apparatus

Also Published As

Publication number Publication date
DE19618974A1 (de) 1997-11-13
US5820688A (en) 1998-10-13
JPH1041271A (ja) 1998-02-13
ITRM970253A1 (it) 1998-10-30
ITRM970253A0 (it) 1997-04-30
IT1290599B1 (it) 1998-12-10

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