KR970074833A - 포토레지스트층 지지체 필름 및 포토레지스트 필름 적층체 - Google Patents

포토레지스트층 지지체 필름 및 포토레지스트 필름 적층체 Download PDF

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Publication number
KR970074833A
KR970074833A KR1019970019585A KR19970019585A KR970074833A KR 970074833 A KR970074833 A KR 970074833A KR 1019970019585 A KR1019970019585 A KR 1019970019585A KR 19970019585 A KR19970019585 A KR 19970019585A KR 970074833 A KR970074833 A KR 970074833A
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KR
South Korea
Prior art keywords
support film
photoresist
film
melting point
weight
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KR1019970019585A
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English (en)
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KR100287237B1 (ko
Inventor
다까후미 구도
데쓰오 요시다
유끼히꼬 미나미히라
가즈따까 마사오까
요우지 다나까
노리요 기무라
Original Assignee
이따가끼 히로시
데이진 가부시끼가이샤
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Priority claimed from JP12457796A external-priority patent/JP3364380B2/ja
Priority claimed from JP12457696A external-priority patent/JP3150902B2/ja
Application filed by 이따가끼 히로시, 데이진 가부시끼가이샤 filed Critical 이따가끼 히로시
Publication of KR970074833A publication Critical patent/KR970074833A/ko
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Publication of KR100287237B1 publication Critical patent/KR100287237B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/16—Dicarboxylic acids and dihydroxy compounds
    • C08G63/18—Dicarboxylic acids and dihydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/181—Acids containing aromatic rings
    • C08G63/183—Terephthalic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08J2367/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Abstract

본 발명은 (A) (i) 주요 반복 유니트로서 에틸렌 테레프탈레이트 유니트를 함유하고 및 융점이 210∼250℃인 공중합 폴리에스테르 55∼100중량%, 및 (ii) 폴리부틸렌 테레프탈레이트 또는 주요 반복 유니트로써 부틸렌테레프탈레이트 유니트를 함유하고 융점이 180℃ 이상인 공중합 폴리에스테르 0∼45중량%를 함유하는 공중합체 조성물로부터 형성되고, 및 (B) 평면배향계수가 0.08∼0.16인 포토레지스트층 지지체 필름에 관한 것이다.
상기 지지체 필름은 기판 형상에 따른 설정 및 해상도에 있어서 탁월하기 때문에, 그의 표면상에 보호 필름 및 포토레지스트층을 적층하므로써 포토레지스트 필름 적충체의 제조에 적합하다.

Description

포토레지스트층 지지체 필름 및 포토레지스트 필름 적층체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. (A) (i) 주요 반복 유니트로서 에틸렌 테레프탈레이트 유니트를 함유하고 및 융점이 210∼250℃인 공중합 폴리에스테르 55∼100중량%, 및 (ii) 폴리부틸렌 테레프탈레이트 또는 주요 반복 유니트로써 부틸렌테레프탈레이트 유니트를 함유하고 융점이 180℃ 이상인 공중합 폴리에스테르 0∼45중량%를 함유하는 공중합체 조성물로부터 형성되고, 및 (B) 평면배향계수가 0.08∼0.16인 포토레지스트층 지지체 필름.
  2. 제1항에 있어서, 중합체 조성물이 평균 입자 크기가 2.5㎛ 이하인 윤활제 0.001∼0.5중량%를 함유하는 지지체 필름.
  3. 제1항에 있어서, 횡방향 및 종방향에서의 L5 수치가 1∼65g/mm의 범위인 지지체 필름.
  4. 제1항에 있어서, 평면배향계수가 0.10∼0.15인 지지체 필름.
  5. 제1항에 있어서, 두께가 3∼75m인 지지체 필름.
  6. 제1항에 있어서, 중합체 조성물이 주요 반복 단위체로서 에틸렌 테레프탈레이트를 함유하고 융점이 215∼235℃인 공중합 폴리에스테르인 지지체 조성물.
  7. 제1항에 있어서, 중합체 조성물이 (i) 주요 반복 유니트로서 에틸렌 테레프탈레이트 유니트를 함유하고 융점이 210∼250℃인 공중합 폴리에스테르 55∼99중량% 및 (ii) 폴리부틸렌 테레프탈레이트 또는 주요 반복 유니트로서 부틸렌 테레프탈레이트를 함유하고 융점이 180℃ 이상인 공중합 폴리에스테르 1∼45중량%를 함유하는 지지체 필름.
  8. (1) 보호필름, (2) 포토레지스트층 및 (3) 제1항에서의 포토레지스트 지지체 필름으로 구
    성되며, 언급된 순서대로 적충된 포토레지스트 필름 적충제.
  9. (i) 제1항에서의 포토레지스트 지지체 필름, (ii) 포토레지스트층 및 (iii) 전도성 기판으로 구성되며, 언급된 순서대로 적충된 포토레지스트 필름 적충제.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970019585A 1996-05-20 1997-05-20 포토레지스트층지지체필름및포토레지스트필름적층체 KR100287237B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP96-124576 1996-05-20
JP12457796A JP3364380B2 (ja) 1996-05-20 1996-05-20 ポリエステルフイルム
JP12457696A JP3150902B2 (ja) 1996-05-20 1996-05-20 ポリエステルフイルム
JP96-124577 1996-05-20

Publications (2)

Publication Number Publication Date
KR970074833A true KR970074833A (ko) 1997-12-10
KR100287237B1 KR100287237B1 (ko) 2001-04-16

Family

ID=26461248

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KR1019970019585A KR100287237B1 (ko) 1996-05-20 1997-05-20 포토레지스트층지지체필름및포토레지스트필름적층체

Country Status (5)

Country Link
US (2) US5994027A (ko)
EP (2) EP0809151B1 (ko)
KR (1) KR100287237B1 (ko)
DE (2) DE69703264T2 (ko)
TW (1) TW477916B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69703264T2 (de) * 1996-05-20 2001-05-17 Teijin Ltd Laminat aus einem Fotoresistschichtträger und einem Fotoresist
KR100370557B1 (ko) * 1998-10-27 2003-03-17 에스케이씨 주식회사 포토레지스트 필름의 베이스 필름용 폴리에스테르 필름
TW403952B (en) * 1998-11-26 2000-09-01 United Microelectronics Corp The method of removing the photoresist
EP1114733B1 (en) * 1999-06-01 2007-08-08 Teijin Limited Polyester film for ink image receiving substrate and ink image receiving substrate
KR100687984B1 (ko) 2003-09-05 2007-02-27 주식회사 코오롱 저휘발성 방향족 폴리에스테르 수지조성물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS566498A (en) * 1979-06-26 1981-01-23 Hitachi Chemical Co Ltd Method of manufacturing flexible printed circuit board
JPH07106394B2 (ja) * 1989-05-17 1995-11-15 東洋製罐株式会社 絞りしごき缶の製造方法
JP3016943B2 (ja) * 1992-02-12 2000-03-06 帝人株式会社 金属板貼合せ加工用ポリエステルフイルム
DE69320713T2 (de) * 1992-01-16 1999-05-20 Teijin Ltd Polyesterfilm zur metallfolienlaminierung sowie anwendung derselben
DE69333210T2 (de) * 1992-07-22 2004-07-01 Teijin Ltd. Biaxial orientierter mehrschichtiger Polyesterfilm, geeignet zum Kleben auf Metallblech
DE69329978T2 (de) * 1993-12-10 2001-10-04 Teijin Ltd Durchsichtige folie zur beschichtung einer metalldose
JPH0996907A (ja) * 1995-10-02 1997-04-08 Tamapori Kk 感光性フィルム
DE69703264T2 (de) * 1996-05-20 2001-05-17 Teijin Ltd Laminat aus einem Fotoresistschichtträger und einem Fotoresist

Also Published As

Publication number Publication date
EP0809151A1 (en) 1997-11-26
KR100287237B1 (ko) 2001-04-16
US5994027A (en) 1999-11-30
DE69703264T2 (de) 2001-05-17
EP0961173B1 (en) 2002-09-18
EP0961173A1 (en) 1999-12-01
EP0809151B1 (en) 2000-10-11
DE69703264D1 (de) 2000-11-16
DE69715676D1 (de) 2002-10-24
TW477916B (en) 2002-03-01
US6140013A (en) 2000-10-31
DE69715676T2 (de) 2003-05-22

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