KR970063459A - Method for forming thin film of semiconductor device - Google Patents

Method for forming thin film of semiconductor device Download PDF

Info

Publication number
KR970063459A
KR970063459A KR1019960004471A KR19960004471A KR970063459A KR 970063459 A KR970063459 A KR 970063459A KR 1019960004471 A KR1019960004471 A KR 1019960004471A KR 19960004471 A KR19960004471 A KR 19960004471A KR 970063459 A KR970063459 A KR 970063459A
Authority
KR
South Korea
Prior art keywords
thin film
semiconductor device
wafer
present
forming method
Prior art date
Application number
KR1019960004471A
Other languages
Korean (ko)
Inventor
김종우
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960004471A priority Critical patent/KR970063459A/en
Publication of KR970063459A publication Critical patent/KR970063459A/en

Links

Abstract

본 발명은 반도체장치의 박막 형성방법에 관해 개시한다. 본 발명에 의한 박막 형성방법은 반응챔버내의 서셉터 상에 정지되어 있는 웨이퍼 상에 박막을 형성하는 반도체장치의 박막형성방법에 있어서, 상기 서셉터를 회전시켜 회전하는 웨이퍼 상에 박막을 형성하는 것을 특징으로 한다.The present invention discloses a thin film forming method of a semiconductor device. A thin film forming method according to the present invention is a thin film forming method of a semiconductor device for forming a thin film on a wafer suspended on a susceptor in a reaction chamber, characterized in that a thin film is formed on a rotating wafer by rotating the susceptor .

따라서 본 발명에 의하면, 회전하는 웨이퍼 상에 박막을 형성하므로 종래에 비애 박막두께의 균일성을 크게 높일 수 있다. 뿐만 아니라 대구경 웨이퍼의 경우에도 동일하게 적용할 수 있다.Therefore, according to the present invention, since a thin film is formed on a rotating wafer, it is possible to greatly increase the uniformity of thin film thickness in the related art. In addition, the present invention can be similarly applied to a wafer having a large diameter.

Description

반도체장치의 박막 형성방법Method for forming thin film of semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 본 발명에 의한 반도체장치의 박막 형성장치를 나타낸 도면이다.FIG. 2 is a view showing an apparatus for forming a thin film of a semiconductor device according to the present invention.

Claims (1)

반응챔버내의 서셉터 상에 정지되어 있는 웨이퍼 상에 박막을 형성하는 반도체장치의 박막형성방법에 있어서, 상기 서셉터를 회전시켜 회전하는 웨이퍼 상에 박막을 형성하는 것을 특징으로 하는 반도체장치의 박막 형성방법.A thin film forming method of a semiconductor device for forming a thin film on a wafer suspended on a susceptor in a reaction chamber, the thin film forming method comprising: forming a thin film on a rotating wafer by rotating the susceptor Way. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960004471A 1996-02-24 1996-02-24 Method for forming thin film of semiconductor device KR970063459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960004471A KR970063459A (en) 1996-02-24 1996-02-24 Method for forming thin film of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960004471A KR970063459A (en) 1996-02-24 1996-02-24 Method for forming thin film of semiconductor device

Publications (1)

Publication Number Publication Date
KR970063459A true KR970063459A (en) 1997-09-12

Family

ID=66221608

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960004471A KR970063459A (en) 1996-02-24 1996-02-24 Method for forming thin film of semiconductor device

Country Status (1)

Country Link
KR (1) KR970063459A (en)

Similar Documents

Publication Publication Date Title
KR870008379A (en) Photoresist stripping method on semiconductor wafer
KR970008377A (en) Semiconductor device manufacturing method and semiconductor manufacturing apparatus
KR930001313A (en) Method of removing germanium from aluminum germanium alloy film
KR920001627A (en) Manufacturing Method of Semiconductor Substrate
KR970063459A (en) Method for forming thin film of semiconductor device
KR960030315A (en) Wet-phase epitaxial growth method
KR970030256A (en) Spin coating equipment
KR970007495A (en) Coating device used for manufacturing semiconductor device
KR920015470A (en) Semiconductor device and manufacturing method of insulating film for semiconductor device
KR970072195A (en) Wafer heating method
KR970017949A (en) Coating method of photoresist film and photoresist coating device used therefor
KR970059845A (en) Search alignment method in semiconductor exposure equipment
KR970018192A (en) Semiconductor Etching Device with Anode Electrode
KR970052093A (en) Dry etching device for semiconductor device manufacturing
KR970053287A (en) Wafer Fixture
KR960019570A (en) Method for preventing moisture absorption of an impurity-containing insulating film
KR970072168A (en) Method for inhibiting polymer deposition of semiconductor devices
KR970072063A (en) Method for forming polycrystalline silicon film of semiconductor device
KR970023946A (en) Wafer Clamp for Semiconductor Manufacturing Equipment
KR920020742A (en) Manufacturing method of reference electrode of semiconductor device
KR970049080A (en) Wet etching method with improved etching uniformity
KR970072004A (en) Photoresist application device
KR970052639A (en) Method for removing water-soluble substances in semiconductor device
KR980005317A (en) Photoresist removal method
KR970063420A (en) Wafer preprocessing method for photolithography process

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination