KR970052639A - Method for removing water-soluble substances in semiconductor device - Google Patents

Method for removing water-soluble substances in semiconductor device Download PDF

Info

Publication number
KR970052639A
KR970052639A KR1019950050923A KR19950050923A KR970052639A KR 970052639 A KR970052639 A KR 970052639A KR 1019950050923 A KR1019950050923 A KR 1019950050923A KR 19950050923 A KR19950050923 A KR 19950050923A KR 970052639 A KR970052639 A KR 970052639A
Authority
KR
South Korea
Prior art keywords
water
semiconductor device
soluble substance
solution
soluble
Prior art date
Application number
KR1019950050923A
Other languages
Korean (ko)
Inventor
박찬하
김상훈
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019950050923A priority Critical patent/KR970052639A/en
Publication of KR970052639A publication Critical patent/KR970052639A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/40—Specific cleaning or washing processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

본 발명은 메틸알코올(Methyl Alcohol : CH2OH)또는 에틸알코올(ethyl alcohol :C2H5OH)또는 IPA(isopropyl alcohol)과 같은 전기쌍극자모멘트를 지니는 용액으로 수용성 물질을 제거하고 세정하는 것을 특징으로 하는 반도체 소자 제조시의 수용성 물질 제거방법에 관한 것으로, 탑(Top) ARC(Antirefletive Coating)물질과 같은 수용성 용액을 웨이퍼에 도포하는 모든 공정에서 도포된 수용성 물질을 효과적으로 제거하여, 오염원을 쉽게 제거함으로써 공정의 안정화를 가져오고 이에 따라 소자의 신뢰성을 향상시키는 효과가 있다.The present invention is characterized in that the water-soluble substance is removed and washed with a solution having an electric dipole moment such as methyl alcohol (CH 2 OH) or ethyl alcohol (ethyl alcohol: C 2 H 5 OH) or IPA (isopropyl alcohol). The present invention relates to a method of removing a water-soluble substance in manufacturing a semiconductor device, which effectively removes a water-soluble substance applied in all processes of applying a water-soluble solution, such as a top ARC (Antirefletive Coating) material, onto a wafer, thereby easily removing a source of contamination. As a result, the stabilization of the process is brought about, thereby improving the reliability of the device.

Description

반도체 소자 제조시의 수용성 물질 제거방법Method for removing water-soluble substances in semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (3)

반도체 소자 제조시의 수용성 물질 제거방법에 있어서, 전기쌍극자모멘트를 지니는 용액으로 수용성 물질을 제거하고 세정하는 것을 특징으로 하는 반도체 소자 제조시의 수용성 물질 제거방법.A method of removing a water-soluble substance in the manufacture of a semiconductor device, wherein the water-soluble substance is removed in a solution having an electric dipole moment and washed. 제1항에 있어서, 상기 전기쌍극자모멘트를 지니는 용액은 메틸알코올(Methyl Alcohol : CH2OH)또는 에틸알코올(ethyl alcohol :C2H5OH)또는 IPA(isopropyl alcohol)중 어느 하나인 것을 특징으로 하는 반도체 소자 제조시의 수용성 물질 제거방법.The method of claim 1, wherein the solution having an electric dipole moment is any one of methyl alcohol (CH 2 OH), ethyl alcohol (ethyl alcohol: C 2 H 5 OH) or IPA (isopropyl alcohol) A water-soluble substance removal method in manufacturing a semiconductor device. 제2항에 있어서, 상기 수용성 물질 제거방법을 반도체 소자공정의 탑(Top) ARC(Antirefletive Coating)공정에 적용하는 것을 특징으로 하는 반도체 소자 제조시의 수용성 물질 제거방법.The method of claim 2, wherein the water-soluble material removal method is applied to a top antirefletive coating (ARC) process of a semiconductor device process. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950050923A 1995-12-16 1995-12-16 Method for removing water-soluble substances in semiconductor device KR970052639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950050923A KR970052639A (en) 1995-12-16 1995-12-16 Method for removing water-soluble substances in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950050923A KR970052639A (en) 1995-12-16 1995-12-16 Method for removing water-soluble substances in semiconductor device

Publications (1)

Publication Number Publication Date
KR970052639A true KR970052639A (en) 1997-07-29

Family

ID=66595123

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950050923A KR970052639A (en) 1995-12-16 1995-12-16 Method for removing water-soluble substances in semiconductor device

Country Status (1)

Country Link
KR (1) KR970052639A (en)

Similar Documents

Publication Publication Date Title
KR960002620A (en) Wafer and substrate processing apparatus and processing method, wafer and substrate transfer stacking apparatus
KR930022467A (en) Method of forming aluminum pattern
KR960012346A (en) Organic matter removal method and apparatus
KR970066727A (en) Photoresist removal method
KR970008377A (en) Semiconductor device manufacturing method and semiconductor manufacturing apparatus
KR970052639A (en) Method for removing water-soluble substances in semiconductor device
KR920020742A (en) Manufacturing method of reference electrode of semiconductor device
KR920003434A (en) Aluminum dry etching method and apparatus
KR970017949A (en) Coating method of photoresist film and photoresist coating device used therefor
KR920015582A (en) Planarization method of semiconductor device
KR970063459A (en) Method for forming thin film of semiconductor device
KR960026318A (en) Wafer drying method
KR970051881A (en) Method for Coating Photosensitive Film of Semiconductor Device
KR950021190A (en) Semiconductor device cleaning method
KR970072144A (en) Semiconductor dry etching method
KR970003669A (en) Metal wiring formation method to prevent metal film corrosion
KR950021188A (en) Rinsing and drying method after wafer hydrofluoric acid treatment
KR970023813A (en) Semiconductor device manufacturing method
KR980006390A (en) Semiconductor device manufacturing method
KR980005403A (en) Plasma processing apparatus of semiconductor element
KR980003833A (en) Pattern Forming Method of Semiconductor Device
KR970077240A (en) Dry Etching Method Using Plasma
KR970077375A (en) How to remove foreign materials
KR970008396A (en) How to remove polymer
KR980011993A (en) A semiconductor wafer cleaning apparatus having a plurality of arms

Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid