KR970054535A - 화합물 반도체 장치의 제조 방법 - Google Patents
화합물 반도체 장치의 제조 방법 Download PDFInfo
- Publication number
- KR970054535A KR970054535A KR1019960073952A KR19960073952A KR970054535A KR 970054535 A KR970054535 A KR 970054535A KR 1019960073952 A KR1019960073952 A KR 1019960073952A KR 19960073952 A KR19960073952 A KR 19960073952A KR 970054535 A KR970054535 A KR 970054535A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- manufacturing
- semiconductor device
- compound semiconductor
- gaas
- Prior art date
Links
- 150000001875 compounds Chemical class 0.000 title claims abstract description 5
- 239000004065 semiconductor Substances 0.000 title claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 title claims abstract 5
- 239000000758 substrate Substances 0.000 claims abstract 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims abstract 5
- 239000012535 impurity Substances 0.000 claims abstract 2
- 238000002161 passivation Methods 0.000 claims abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 238000005468 ion implantation Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02293—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process formation of epitaxial layers by a deposition process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1032—III-V
- H01L2924/10329—Gallium arsenide [GaAs]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
GaAs 디바이스의 특성, 품질을 유지하면서 낮은 제조 코스트로 제조할 수 있는 화합물 반도체 장치의 제조방법을 제공한다. 이를 위해 본 발명의 화합물 반도체 장치의 제조 방법은 반절연성 GaAs 기판(10)을 준비하는 공정, 상기 기판에 이온 주입에 의해 불순물을 도입하여 채널 영역(11)을 형성하는 공정, 상기 기판의 채널 영역상에 패시베이션막으로서 언도프 GaAs 층 또는 GaInP층(20)을 에피택셜 성장하는 공정, 및 상기 기판상에 소스. 드레인 전극(14,15) 및 게이트 전극(13)을 형성하는 공정으로 이루어진다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 한 실시 형태의 화합물 반도체 장치의 단면도.
Claims (1)
- 반절연성 GaAs기판을 준비하는 공정, 상기 기판에 이온 주입에 의해 불순물을 도입하여 채널 영역을 형성하는 공정, 상기 기판의 채널 영역상에 패시베이션막으로서 언도프 GaAs 층 또는 GaInP층을 에피택셜 성장하는 공정, 및 상기 기판상에 소스. 드레인 전극 및 게이트 전극을 형성하는 공정으로 이루어지는 것을 특징으로 하는 화합물 반도체 장치의 제조 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7343400A JPH09186176A (ja) | 1995-12-28 | 1995-12-28 | 化合物半導体装置の製造方法 |
JP95-343400 | 1995-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970054535A true KR970054535A (ko) | 1997-07-31 |
KR100244002B1 KR100244002B1 (ko) | 2000-02-01 |
Family
ID=18361224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960073952A KR100244002B1 (ko) | 1995-12-28 | 1996-12-27 | 화합물 반도체 장치의 제조 방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH09186176A (ko) |
KR (1) | KR100244002B1 (ko) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS628575A (ja) * | 1985-07-04 | 1987-01-16 | Nec Corp | 半導体装置 |
JPH01268071A (ja) * | 1988-04-20 | 1989-10-25 | Hitachi Ltd | 化合物半導体素子 |
-
1995
- 1995-12-28 JP JP7343400A patent/JPH09186176A/ja active Pending
-
1996
- 1996-12-27 KR KR1019960073952A patent/KR100244002B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH09186176A (ja) | 1997-07-15 |
KR100244002B1 (ko) | 2000-02-01 |
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Date | Code | Title | Description |
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |