KR970053261A - 카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그 작동 방법 - Google Patents

카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그 작동 방법 Download PDF

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KR970053261A
KR970053261A KR1019950065737A KR19950065737A KR970053261A KR 970053261 A KR970053261 A KR 970053261A KR 1019950065737 A KR1019950065737 A KR 1019950065737A KR 19950065737 A KR19950065737 A KR 19950065737A KR 970053261 A KR970053261 A KR 970053261A
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South Korea
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wafer
cassette
seating
wafer cassette
measuring device
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KR1019950065737A
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KR100192961B1 (ko
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이영호
함상규
임영규
안병설
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김광호
삼성전자 주식회사
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Priority to KR1019950065737A priority Critical patent/KR100192961B1/ko
Priority to TW085111879A priority patent/TW353651B/zh
Priority to US08/768,710 priority patent/US6111637A/en
Priority to JP35123596A priority patent/JP3797732B2/ja
Publication of KR970053261A publication Critical patent/KR970053261A/ko
Application granted granted Critical
Publication of KR100192961B1 publication Critical patent/KR100192961B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

본 발명은 카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그 작동 방법에 관한 것으로서, 웨이퍼 카세트를 안착시키는 안착부와, 상기 안착부 하단에 장착되어 웨이퍼 카세트를 고정하는 고정부와, 상기 고정부에 고정된 웨이퍼 카세트로부터 웨이퍼를 꺼내어 이송하는 이송부와, 상기 이송부에 의해 이송된 웨이퍼를 측정하는 측정부와, 상기 측정부에서 측정된 데이터를 나타내는 모니터부와, 상기의 진행 단계를 여러 색의 빛으로 나타내는 발광부로 구성됨을 특징으로 한다. 한편 카세트 잠금기가 장착된 웨이퍼 측정 장치의 작동 방법은 웨이퍼 카세트를 안착부에 안착시키고 작동 스위치를 누르는 제1스텝과, 작동 스위치의 접속에 의해 웨이퍼 카세트를 고정하고 그 완료를 작업자에게 알리는 제2스텝과, 로봇 아암의 웨이퍼를 웨이퍼 카세트에서 꺼내는 사전 조정한 후 측정부로 이송하는 제3스텝과, 측정부에서 측정이 완료된 웨이퍼의 측정 데이터를 출력하고 로봇 아암이 웨이퍼를 웨이퍼 카세트에 로딩하는 제4스텝과, 상기의 과정을 반복하여 마지막 웨이퍼가 웨이퍼 카세트에 로딩되면 그 종료를 작업자에게 알리는 제5스텝으로 구성됨을 특징으로 한다.

Description

카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그 작동 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 본 발명에 의한 카세트 잠금기가 장착된 웨이퍼 측정 장치를 개략적으로 도시한 정면도.

Claims (6)

  1. 웨이퍼 카세트를 안착시키는 안착부와, 상기 안착부 하단에 장착되어 웨이퍼 카세트를 고정하는 고정부와, 상기 고정부에 고정된 웨이퍼 카세트로부터 웨이퍼를 꺼내어 이송하는 이송부와, 상기 이송부에 의해 이송된 웨이퍼를 측정하는 측정부와,앗기 측정부에서 측정된 데이터를 나타내는 모니터부와, 상기의 진행 단계를 여러 색의 빛으로 나타내는 발광부로 구성됨을 특징으로 하는 카세트 잠금기가 장착된 웨이퍼 측정 장치.
  2. 제1항에 있어서, 상기 고정부는 안착된 웨이퍼 카세트의 하단 부위를 걸어 고정할 수 있도록 걸림턱을 구비함을 특징으로 하는 카세트 잠금기가 장착된 웨이퍼 측정 장치.
  3. 제1항에 있어서, 상기 발광부는 여러 색을 나타낼 수 있는 램프로 구비됨을 특징으로 하는 카세트 잠금기가 장착된 웨이퍼 측정 장치.
  4. 제2항에 있어서, 상기 걸림턱은 일정한 각도로 제한된 회전 범위 내에서 작동하여 웨이퍼 카세트를 잠그고 풀 수 있도록 구비되어 있음을 특징으로 하는 카세트 잠금기가 장착된 웨이퍼 측정 장치.
  5. 제3항에 있어서, 상기 램프는 에이퍼 카세트가 안착부에 고정된 후, 측정된 마지막 웨이퍼가 카세트에 로딩된 후, 에이퍼 카세트가 제거된 후, 장비가 다운이 된 직후에 작동됨을 특징으로 하는 카세트 잠금기가 장착된 웨이퍼 측정 장치.
  6. 웨이퍼 카세트를 안착부에 안착시키고 작동 스위치를 누르는 제1스텝과, 작동 스위치의 접속에 의해 웨이퍼 카세트를 고정하고 그 완료된 작업자에게 알리는 제2스텝과, 로봇 아암이 웨이퍼를 웨이퍼 카세트에서 꺼내는 사전 조정한 후 측정부로 이송하는 제3스텝과, 측정부에서 측정이 완료된 에이퍼의 측정 데이터를 출력하고 로봇 아암이 웨이퍼를 웨이퍼 카세트에 로딩하는 제4스텝과, 상기의 과정을 반복하여 마지막 웨이퍼가 웨이퍼 카세트에 로딩되면 그 종료를 작업자에게 알리는 제5스텝으로 구성됨을 특징으로 하는 카세트 잠금기가 장착된 웨이퍼 측정 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950065737A 1995-12-29 1995-12-29 카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그작동방법 KR100192961B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019950065737A KR100192961B1 (ko) 1995-12-29 1995-12-29 카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그작동방법
TW085111879A TW353651B (en) 1995-12-29 1996-09-26 Apparatus and method for examining wafers
US08/768,710 US6111637A (en) 1995-12-29 1996-12-18 Apparatus and method for examining wafers
JP35123596A JP3797732B2 (ja) 1995-12-29 1996-12-27 パーティクルの測定装置および測定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950065737A KR100192961B1 (ko) 1995-12-29 1995-12-29 카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그작동방법

Publications (2)

Publication Number Publication Date
KR970053261A true KR970053261A (ko) 1997-07-31
KR100192961B1 KR100192961B1 (ko) 1999-06-15

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Application Number Title Priority Date Filing Date
KR1019950065737A KR100192961B1 (ko) 1995-12-29 1995-12-29 카세트 잠금기가 장착된 웨이퍼 측정 장치 및 그작동방법

Country Status (4)

Country Link
US (1) US6111637A (ko)
JP (1) JP3797732B2 (ko)
KR (1) KR100192961B1 (ko)
TW (1) TW353651B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103295928B (zh) * 2012-03-02 2016-04-06 无锡华润上华科技有限公司 一种快速查找晶圆划伤缺角沾污的方法
CN109935537B9 (zh) * 2017-12-15 2021-03-19 辛耘企业股份有限公司 基板处理系统
JP7103200B2 (ja) * 2018-12-18 2022-07-20 株式会社安川電機 搬送システム及び搬送制御方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4644172A (en) * 1984-02-22 1987-02-17 Kla Instruments Corporation Electronic control of an automatic wafer inspection system
US4938654A (en) * 1985-05-17 1990-07-03 Schram Richard R Automated wafer inspection system
US4818169A (en) * 1985-05-17 1989-04-04 Schram Richard R Automated wafer inspection system
IL86514A0 (ko) * 1988-05-26 1988-11-15
US5488292A (en) * 1993-10-04 1996-01-30 Tokyo Seimitsu Co., Ltd. Wafer inspecting system

Also Published As

Publication number Publication date
TW353651B (en) 1999-03-01
JPH09191041A (ja) 1997-07-22
US6111637A (en) 2000-08-29
JP3797732B2 (ja) 2006-07-19
KR100192961B1 (ko) 1999-06-15

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