KR970030753A - 마킹장치가 구비된 얼라이너 - Google Patents

마킹장치가 구비된 얼라이너 Download PDF

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Publication number
KR970030753A
KR970030753A KR1019950039347A KR19950039347A KR970030753A KR 970030753 A KR970030753 A KR 970030753A KR 1019950039347 A KR1019950039347 A KR 1019950039347A KR 19950039347 A KR19950039347 A KR 19950039347A KR 970030753 A KR970030753 A KR 970030753A
Authority
KR
South Korea
Prior art keywords
marking
aligner
mask
light source
wafer
Prior art date
Application number
KR1019950039347A
Other languages
English (en)
Other versions
KR0179855B1 (ko
Inventor
김광철
Original Assignee
문정환
엘지반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, 엘지반도체 주식회사 filed Critical 문정환
Priority to KR1019950039347A priority Critical patent/KR0179855B1/ko
Priority to DE19600427A priority patent/DE19600427B4/de
Priority to JP8003951A priority patent/JPH09205054A/ja
Priority to US08/822,472 priority patent/US5796468A/en
Publication of KR970030753A publication Critical patent/KR970030753A/ko
Application granted granted Critical
Publication of KR0179855B1 publication Critical patent/KR0179855B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

본 발명은 마킹(MARKING)장치가 구비된 얼라이너(ALLIGNER)에 관한 것으로, 종래에는 마킹장치와 노광(EXPOSURE)을 실시하기 위하여 조준/정렬을 하는 얼라이너가 별도로 구성되어 있어서, 시간의 절감에 따른 생산성을 향상시키는데 한계가 있는 문제점이 있었던바, 본 발명은 조명계(10)에서 공급되는 광원이 확산렌즈(11), 마스크(12), 마스크 모듈(13), 렌즈(14)를 통과하여 스테이지(16)에 의해 이동하는 척(16a)의 상면에 설치되어 있는 웨이퍼(W)에 마킹을 할 수 있도록 구성하여, 마킹과 얼라인을 동시에 실시함으로써 시간의 절감에 따른 생산성 향상의 효과가 있다.

Description

마킹장치가 구비된 얼라이너
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 2도는 본 발명 마킹장치가 구비된 얼라이너의 구성을 보인 개략구성도.

Claims (1)

  1. 일측에 광케이블이 구비되어 있고 광원을 공급해 주기 위한 조명계와, 그 공원을 확산시키기 위한 확산렌즈와, 여러 종류의 인쇄할 문자가 새겨있는 마스크와, 그 마스크를 선택적으로 구동할 수 있는 마스크 모듈과, 광원을 웨이퍼에 보내기 위한 렌즈와, 광원을 임의 시간동안 선택적으로 개·폐할 수 있는 셔터와, 웨이퍼를 이용시키기 위한 척이 구비된 스테이지로 구성된 것을 특징으로 하는 마킹장치가 구비된 얼라이너.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950039347A 1995-11-02 1995-11-02 마킹장치가 구비된 얼라이너 KR0179855B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019950039347A KR0179855B1 (ko) 1995-11-02 1995-11-02 마킹장치가 구비된 얼라이너
DE19600427A DE19600427B4 (de) 1995-11-02 1996-01-08 Verfahren zum Ausrichten und Markieren eines Wafers
JP8003951A JPH09205054A (ja) 1995-11-02 1996-01-12 半導体ウェーハ製造用マーキング装置を備えたアライナ
US08/822,472 US5796468A (en) 1995-11-02 1997-03-24 Apparatus used to align and mark wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950039347A KR0179855B1 (ko) 1995-11-02 1995-11-02 마킹장치가 구비된 얼라이너

Publications (2)

Publication Number Publication Date
KR970030753A true KR970030753A (ko) 1997-06-26
KR0179855B1 KR0179855B1 (ko) 1999-03-20

Family

ID=19432718

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950039347A KR0179855B1 (ko) 1995-11-02 1995-11-02 마킹장치가 구비된 얼라이너

Country Status (3)

Country Link
JP (1) JPH09205054A (ko)
KR (1) KR0179855B1 (ko)
DE (1) DE19600427B4 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5144992B2 (ja) * 2007-08-27 2013-02-13 株式会社オーク製作所 露光装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994419A (ja) * 1982-11-19 1984-05-31 Canon Inc 分割焼付け装置におけるアライメント方法
JPS61189636A (ja) * 1985-02-19 1986-08-23 Ushio Inc キセノン・水銀放電灯による半導体ウエハ−の露光方法
JPH0652705B2 (ja) * 1988-05-12 1994-07-06 キヤノン株式会社 露光装置

Also Published As

Publication number Publication date
DE19600427A1 (de) 1997-05-07
KR0179855B1 (ko) 1999-03-20
DE19600427B4 (de) 2005-03-03
JPH09205054A (ja) 1997-08-05

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