KR970027252A - 스탬핑호일의 접착층조성물 - Google Patents

스탬핑호일의 접착층조성물 Download PDF

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Publication number
KR970027252A
KR970027252A KR1019950044232A KR19950044232A KR970027252A KR 970027252 A KR970027252 A KR 970027252A KR 1019950044232 A KR1019950044232 A KR 1019950044232A KR 19950044232 A KR19950044232 A KR 19950044232A KR 970027252 A KR970027252 A KR 970027252A
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KR
South Korea
Prior art keywords
weight
parts
adhesive layer
stamping foil
phthalate
Prior art date
Application number
KR1019950044232A
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English (en)
Other versions
KR100314871B1 (ko
Inventor
이수형
박기진
Original Assignee
이웅열
주식회사 코오롱
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Publication date
Application filed by 이웅열, 주식회사 코오롱 filed Critical 이웅열
Priority to KR1019950044232A priority Critical patent/KR100314871B1/ko
Publication of KR970027252A publication Critical patent/KR970027252A/ko
Application granted granted Critical
Publication of KR100314871B1 publication Critical patent/KR100314871B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/02—Condensation polymers of aldehydes or ketones only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/28—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/04—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
    • C09J127/06—Homopolymers or copolymers of vinyl chloride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
    • C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
    • C09J131/04—Homopolymers or copolymers of vinyl acetate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

본 발명은 베이스 필름 지지체, 이형층, 보호층, 금속증착층, 접착층의 구조로 이루어지는 스탬핑호일의 접착층 조성물에 관한 것으로서, 케톤 수지 30∼50중량부, 비닐클로라이드-비닐아세테이트 공중합체 5∼20중량부, 염소함량이 10 내지 40중량%인 폴리프로필렌 수지 5∼20중량부, 비닐아세테이트 수지 15∼30중량부, 입자경(Primary Particle Size)이 0.1 내지 2㎛인 실리카 입자 10∼25중량부, 및 가소제 5∼15중량부를 함유하는 것을 특징으로 하며, 이러한 특징의 접착층 조성물을 적용한 스탬핑호일은 낮은 온도에서도 접착성이 우수하여 수동 스탬핑기계는 물론 고속 자동 스탬핑기계에서도 피전사체에 견고하게 전사된다.

Description

스탬핑호일의 접착층조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (2)

  1. 피전사체 표면에 접착되도록 스탬핑호일에 적층형성되는 스탬핑호일의 접착층에 있어서, 상기 접착층이 케톤 수지 30∼50중량부, 비닐클로라이드-비닐아세테이트 공중합체 5∼20중량부, 염소함량이 10 내지 40중량%인 폴리프로필렌 수지 5∼20중량부, 비닐아세테이트 수지 15∼30중량부, 입자경(Primary Particle Size)이 0.1 내지 2㎛인 실리카 입자 10∼25중량부, 및 가소제 5∼15중량부를 함유하는 것을 특징으로 하는 스탬핑호일의 접착층조성물.
  2. 제1항에 있어서, 가소제가 디메틸 프탈레이트(DMP), 디이소부틸프탈레이트(DIBP), 디부틸프탈레이트(DBP), 디헵틸프탈레이트(DHP), 디옥틸프탈레이트(DOP), 디이소옥틸프탈레이트(DIOP), 디-n-옥틸프탈레이트(DnOP), 디이소노닐프탈레이트(DINP), 디이소데실프탈레이트(DIDP), 디운데실프탈레이트(DUP), 디트리데실프탈레이트(DTDP) 또는 부틸 벤질 프탈레이트(BBP)인 것을 특징으로 하는 스탬핑호일의 접착층조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950044232A 1995-11-28 1995-11-28 스탬핑호일의접착층조성물 KR100314871B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950044232A KR100314871B1 (ko) 1995-11-28 1995-11-28 스탬핑호일의접착층조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950044232A KR100314871B1 (ko) 1995-11-28 1995-11-28 스탬핑호일의접착층조성물

Publications (2)

Publication Number Publication Date
KR970027252A true KR970027252A (ko) 1997-06-24
KR100314871B1 KR100314871B1 (ko) 2002-07-02

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Application Number Title Priority Date Filing Date
KR1019950044232A KR100314871B1 (ko) 1995-11-28 1995-11-28 스탬핑호일의접착층조성물

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KR (1) KR100314871B1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100452559B1 (ko) * 2001-12-06 2004-10-14 주식회사 엘지화학 알루미늄 판에 대한 부착력이 우수한 점착제 조성물
CN103468174B (zh) * 2013-09-29 2015-04-08 云南玉溪东魅包装材料有限公司 一种用于电化铝的低温烫印热熔胶及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518470A (en) * 1978-07-27 1980-02-08 Masatoshi Shimizu Adhesive solution forming thin film capable of forcibly being released
JPS61207475A (ja) * 1985-03-11 1986-09-13 Aica Kogyo Co Ltd 接着剤

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KR100314871B1 (ko) 2002-07-02

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