KR970011024A - 전기도금 방법 - Google Patents

전기도금 방법 Download PDF

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Publication number
KR970011024A
KR970011024A KR1019960034840A KR19960034840A KR970011024A KR 970011024 A KR970011024 A KR 970011024A KR 1019960034840 A KR1019960034840 A KR 1019960034840A KR 19960034840 A KR19960034840 A KR 19960034840A KR 970011024 A KR970011024 A KR 970011024A
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KR
South Korea
Prior art keywords
copper
copper alloy
weight
amine
insulating material
Prior art date
Application number
KR1019960034840A
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English (en)
Inventor
요시히로 사카모토
토시오 다니무라
미노루 오우타니
Original Assignee
마에다 고사쿠
멧쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마에다 고사쿠, 멧쿠 가부시키가이샤 filed Critical 마에다 고사쿠
Publication of KR970011024A publication Critical patent/KR970011024A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

본 발명은 특정 흑연입자 또는 팔라듐 화합물을 구리 및 절연재로 이루어진 표면에 적응하고, 구리를 마이크로엣칭하여 특정 구리 또는 팔라듐 화합물을 제거하고, 전기도금에 제공하는 방법에 제공된다. 이 방법은 마이크로엣치제로서 황산 5~60중량%, 과산화수소 3~35% 및 포스폰기 함유 아민 또는 그의 염 0.01~10중량%, 그리고 임의로 포스폰기 함유 아민 이외의 아민 0.1~10중량%를 함유하는 수용액을 사용함을 특징으로 한다. 이 방법은 인쇄회로기판 쓰로우 홀의 내벽에 신뢰성 높은 전기도금을 확실하게 한다.

Description

전기도금 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (6)

  1. (a) 입자 평균직경 2㎛ 이하를 갖는 흑연입자 또는 입자 평균직경 1㎛ 이하를 갖는 카본블랙 입자 또는 양자를 함유하는 수분산액을 전기도금할 구리 또는 구리합금 및 절연재로 이루어진 표면에 사용하여 상기 흑연 또는 카본블랙 입자가 상기 표면에 부착되게 하고, (b) 황산 5~60중량%, 관산화수소 3~35% 및 포스폰기 함유 아민 또는 그의 염 0.01~10중량%를 포함하는 수용액인 마이크로엣칭제를 사용하여 구리 또는 구리합금층을 엣칭시킴으로써 구리 또는 구리합금으로부터 상기 흑연 또는 카본블랙 입자를 제거하고, (c) 상기 흑연 또는 카본블랙 입자가 제거된 구리 또는 구리합금으로 구성되는 층 및 전도층으로서 나머지 흑연 또는 카본블랙을 이용하여 전기도금함을 특징으로 하는 구리 또는 구리합금 및 절연재로 이루어지는 표면의 전기도금 방법.
  2. 제1항에 있어서, 상기 마이크로엣칭제 수용액에 다시 포스폰기 함유 아민 이외의 아민을 0.1~10중량% 함유함을 특징으로 하는 방법.
  3. (a) 팔라듐 화합물을 함유하는 수용액 또는 수분산액을 사용하여 팔라듐 화합물이 구리 또는 구리 합금 및 절연재로 이루어진 표면에 부착되게 하고, (b) 황산 5~60중량%, 과산화수소 3~35중량% 및 포스폰기 함유 아민 또는 그의 염 0.01~10중량%를 포함하는 수용액인 마이크로엣칭제를 사용하여 구리 또는 구리합금층을 엣칭시킴으로써 구리 또는 구리합금으로부터 상기 팔라듐 화합물을 제거하고, (c) 상기 팔라듐 화합물이 제거된 구리 또는 구리합금으로 구성되는 층 및 전도층으로서 나머지 팔라듐 화합물을 이용하여 전기도금함을 특징으로 하는 구리 또는 구리합금 및 절연재로 이루어지는 표면의 전기도금 방법.
  4. 제3항에 있어서, 상기 마이크로엣칭제 수용액에 다시 포스폰기 함유 아민 이외의 아민을 0.1~10중량% 함유함을 특징으로 하는 방법.
  5. 제1항 또는 제3항에 있어서, 엣칭의 깊이가 1.0㎛ 이하인 것이 특징인 방법.
  6. 제1항 또는 제3항에 있어서, 구리 또는 구리합금 및 절연재로 이루어진 표면을 갖는 물체는 인쇄회로기판에 쓰로우 홀이 존재하는 것이 특징인 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960034840A 1995-08-23 1996-08-22 전기도금 방법 KR970011024A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP214869/1995 1995-08-23
JP21486995 1995-08-23
JP6696/1996 1996-01-18
JP00669696A JP3481379B2 (ja) 1995-08-23 1996-01-18 電気めっき法

Publications (1)

Publication Number Publication Date
KR970011024A true KR970011024A (ko) 1997-03-27

Family

ID=26340892

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960034840A KR970011024A (ko) 1995-08-23 1996-08-22 전기도금 방법

Country Status (6)

Country Link
US (1) US5788830A (ko)
EP (1) EP0759482B1 (ko)
JP (1) JP3481379B2 (ko)
KR (1) KR970011024A (ko)
CN (1) CN1090890C (ko)
DE (1) DE69613286T2 (ko)

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DE19740431C1 (de) * 1997-09-11 1998-11-12 Atotech Deutschland Gmbh Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats
US6036835A (en) * 1997-09-24 2000-03-14 Shipley Company, L.L.C. Method of microetching a conductive polymer on multilayer circuit boards
US6855266B1 (en) 1999-08-13 2005-02-15 Cabot Microelectronics Corporation Polishing system with stopping compound and method of its use
ATE360051T1 (de) * 1999-08-13 2007-05-15 Cabot Microelectronics Corp Poliersystem und verfahren zu seiner verwendung
US6613671B1 (en) 2000-03-03 2003-09-02 Micron Technology, Inc. Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
US6921551B2 (en) * 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
US20020134684A1 (en) * 2000-10-25 2002-09-26 Shipley Company, L.L.C. Seed layer processes
JP3941433B2 (ja) * 2001-08-08 2007-07-04 株式会社豊田自動織機 ビアホールのスミア除去方法
JP4000796B2 (ja) * 2001-08-08 2007-10-31 株式会社豊田自動織機 ビアホールの銅メッキ方法
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KR101337263B1 (ko) * 2004-08-25 2013-12-05 동우 화인켐 주식회사 인듐 산화막의 식각액 조성물 및 이를 이용한 식각 방법
CN100477890C (zh) * 2005-09-19 2009-04-08 金像电子股份有限公司 电路板的无孔圈线路制造方法
CN102102197B (zh) * 2005-12-06 2014-04-16 荏原优莱特科技股份有限公司 钯配合物以及使用该配合物的催化剂赋予处理液
CN101453837B (zh) * 2007-11-28 2011-03-30 比亚迪股份有限公司 一种印刷电路板的孔导电化方法
CN101772279B (zh) * 2009-12-21 2013-03-06 艾默生网络能源有限公司 一种带盲孔的pcb板的制造方法
CN102127447A (zh) * 2009-12-30 2011-07-20 杜邦太阳能有限公司 透明导电金属氧化物膜的形态设计
JP6101421B2 (ja) 2010-08-16 2017-03-22 インテグリス・インコーポレーテッド 銅または銅合金用エッチング液
US8524540B2 (en) * 2011-02-01 2013-09-03 Nilesh Kapadia Adhesion promoting composition for metal leadframes
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KR101556769B1 (ko) * 2013-12-18 2015-10-02 (주)드림텍 Facl을 이용한 양면 fpcb 제조 방법
KR101418036B1 (ko) * 2013-12-27 2014-07-09 (주)오알켐 도금 처리된 관통홀을 갖는 다층 인쇄 회로 기판의 제조방법
KR101418035B1 (ko) * 2013-12-27 2014-07-09 (주)오알켐 도금 처리된 관통홀을 갖는 다층 인쇄 회로 기판의 제조방법
CN104947110A (zh) * 2014-03-27 2015-09-30 浙江德汇电子陶瓷有限公司 一种微蚀剂和线路板的制造方法及线路板
JP6531612B2 (ja) * 2014-11-27 2019-06-19 三菱瓦斯化学株式会社 液体組成物およびこれを用いたエッチング方法
CN105063681A (zh) * 2015-08-28 2015-11-18 韶关硕成化工有限公司 Pcb板用的高浓度碳孔液及其制备方法
CN105177661A (zh) * 2015-08-28 2015-12-23 韶关硕成化工有限公司 高浓度的pcb板用碳孔液及其制备方法
CN105132962A (zh) * 2015-08-28 2015-12-09 韶关硕成化工有限公司 一种高浓度pcb板用碳孔液及其制备方法
JP6218000B2 (ja) 2016-02-19 2017-10-25 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
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Also Published As

Publication number Publication date
EP0759482B1 (en) 2001-06-13
JP3481379B2 (ja) 2003-12-22
CN1090890C (zh) 2002-09-11
EP0759482A1 (en) 1997-02-26
DE69613286T2 (de) 2001-09-20
CN1155230A (zh) 1997-07-23
JPH09118996A (ja) 1997-05-06
DE69613286D1 (de) 2001-07-19
US5788830A (en) 1998-08-04

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