KR970008456B1 - Thin-film transistor & its manufacture - Google Patents

Thin-film transistor & its manufacture Download PDF

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Publication number
KR970008456B1
KR970008456B1 KR93025548A KR930025548A KR970008456B1 KR 970008456 B1 KR970008456 B1 KR 970008456B1 KR 93025548 A KR93025548 A KR 93025548A KR 930025548 A KR930025548 A KR 930025548A KR 970008456 B1 KR970008456 B1 KR 970008456B1
Authority
KR
South Korea
Prior art keywords
manufacture
thin
film transistor
transistor
film
Prior art date
Application number
KR93025548A
Other languages
English (en)
Inventor
Masahiko Akiyama
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Application granted granted Critical
Publication of KR970008456B1 publication Critical patent/KR970008456B1/ko

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66765Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45Ohmic electrodes
    • H01L29/456Ohmic electrodes on silicon
    • H01L29/458Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
KR93025548A 1992-11-27 1993-11-27 Thin-film transistor & its manufacture KR970008456B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31889592A JP3378280B2 (ja) 1992-11-27 1992-11-27 薄膜トランジスタおよびその製造方法

Publications (1)

Publication Number Publication Date
KR970008456B1 true KR970008456B1 (en) 1997-05-24

Family

ID=18104169

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93025548A KR970008456B1 (en) 1992-11-27 1993-11-27 Thin-film transistor & its manufacture

Country Status (3)

Country Link
US (1) US5614728A (ko)
JP (1) JP3378280B2 (ko)
KR (1) KR970008456B1 (ko)

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US6790714B2 (en) 1995-07-03 2004-09-14 Sanyo Electric Co., Ltd. Semiconductor device, display device and method of fabricating the same
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US6081308A (en) * 1996-11-21 2000-06-27 Samsung Electronics Co., Ltd. Method for manufacturing liquid crystal display
US6337520B1 (en) * 1997-02-26 2002-01-08 Samsung Electronics Co., Ltd. Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and manufacturing method thereof
US6445004B1 (en) 1998-02-26 2002-09-03 Samsung Electronics Co., Ltd. Composition for a wiring, a wiring using the composition, manufacturing method thereof, a display using the wiring and a manufacturing method thereof
JP3092537B2 (ja) * 1997-01-24 2000-09-25 日本電気株式会社 液晶表示装置
KR100399291B1 (ko) * 1997-01-27 2004-01-24 가부시키가이샤 아드반스트 디스프레이 반도체 박막트랜지스터, 그 제조방법, 반도체 박막트랜지스터어레이 기판 및 해당 반도체 박막트랜지스터어레이 기판을 사용한 액정표시장치
KR100272556B1 (ko) * 1997-04-10 2000-11-15 구본준 액정표시장치 및 그 제조방법
DE19731090C1 (de) * 1997-07-19 1998-11-19 Bosch Gmbh Robert Verfahren zur Herstellung einer Matrix aus Dünnschichttransistoren mit Speicherkapazitäten
JP3119228B2 (ja) * 1998-01-20 2000-12-18 日本電気株式会社 液晶表示パネル及びその製造方法
JP3592535B2 (ja) 1998-07-16 2004-11-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN1139837C (zh) * 1998-10-01 2004-02-25 三星电子株式会社 液晶显示器用薄膜晶体管阵列基板及其制造方法
JP3683463B2 (ja) 1999-03-11 2005-08-17 シャープ株式会社 アクティブマトリクス基板、その製造方法、及び、該基板を用いたイメージセンサ
KR100316762B1 (ko) * 1999-03-24 2001-12-12 구본준, 론 위라하디락사 액정표시장치의 구조 및 그 제조방법
TW525216B (en) * 2000-12-11 2003-03-21 Semiconductor Energy Lab Semiconductor device, and manufacturing method thereof
KR100364836B1 (ko) * 2001-02-09 2002-12-16 엘지.필립스 엘시디 주식회사 액정표시소자
US6781661B2 (en) * 2001-02-09 2004-08-24 Lg. Philips Lcd Co., Ltd. Liquid crystal display device and method of forming the same
TW546846B (en) * 2001-05-30 2003-08-11 Matsushita Electric Ind Co Ltd Thin film transistor and method for manufacturing the same
TW564564B (en) * 2002-10-03 2003-12-01 Au Optronics Corp Pixel structure and fabricating method thereof
US6710409B1 (en) * 2002-10-15 2004-03-23 Matrix Semiconductor, Inc. Inverted staggered thin film transistor with etch stop layer and method of making same
US20050001201A1 (en) * 2003-07-03 2005-01-06 Bocko Peter L. Glass product for use in ultra-thin glass display applications
US20060207967A1 (en) * 2003-07-03 2006-09-21 Bocko Peter L Porous processing carrier for flexible substrates
JP4712332B2 (ja) * 2003-08-28 2011-06-29 株式会社半導体エネルギー研究所 薄膜トランジスタの作製方法
CN1842745B (zh) * 2003-08-28 2013-03-27 株式会社半导体能源研究所 薄膜晶体管、薄膜晶体管的制造方法、以及显示器件的制造方法
TWI234288B (en) * 2004-07-27 2005-06-11 Au Optronics Corp Method for fabricating a thin film transistor and related circuits
US7033870B1 (en) * 2004-11-29 2006-04-25 International Business Machines Corporation Semiconductor transistors with reduced gate-source/drain capacitances
US7504329B2 (en) * 2005-05-11 2009-03-17 Interuniversitair Microelektronica Centrum (Imec) Method of forming a Yb-doped Ni full silicidation low work function gate electrode for n-MOSFET
KR100917654B1 (ko) 2006-11-10 2009-09-17 베이징 보에 옵토일렉트로닉스 테크놀로지 컴퍼니 리미티드 박막트랜지스터 액정 디스플레이 화소 구조 및 그 제조방법
TWI334647B (en) * 2007-03-03 2010-12-11 Au Optronics Corp Method for manufacturing pixel structure
KR100841170B1 (ko) * 2007-04-26 2008-06-24 삼성전자주식회사 저저항 금속 배선 형성방법, 금속 배선 구조 및 이를이용하는 표시장치
KR101510212B1 (ko) * 2008-06-05 2015-04-10 삼성전자주식회사 산화물 반도체 박막 트랜지스터의 제조방법
TWI326486B (en) * 2008-06-27 2010-06-21 Au Optronics Corp Method for manufacturing pixel structure
JP4917582B2 (ja) * 2008-07-25 2012-04-18 住友化学株式会社 アクティブマトリクス基板、ディスプレイパネル、表示装置およびアクティブマトリクス基板の製造方法
JP4909323B2 (ja) * 2008-07-25 2012-04-04 住友化学株式会社 アクティブマトリクス基板、ディスプレイパネル、表示装置およびアクティブマトリクス基板の製造方法
KR20100090628A (ko) * 2009-02-06 2010-08-16 주식회사 엘지화학 절연된 도전성 패턴의 제조 방법
CN101807586B (zh) * 2009-02-13 2013-07-31 北京京东方光电科技有限公司 Tft-lcd阵列基板及其制造方法
KR20110060479A (ko) 2009-11-30 2011-06-08 삼성모바일디스플레이주식회사 오믹 콘택층으로 산화물 반도체층을 갖는 박막 트랜지스터 및 그 제조방법
KR20120078293A (ko) * 2010-12-31 2012-07-10 삼성전자주식회사 트랜지스터와 그 제조방법 및 트랜지스터를 포함하는 전자소자
CN102651455B (zh) * 2012-02-28 2015-11-25 京东方科技集团股份有限公司 Oled器件、amoled器件及其制造方法
CN103489918A (zh) * 2012-06-08 2014-01-01 京东方科技集团股份有限公司 一种薄膜晶体管和阵列基板及其制造方法
KR102080065B1 (ko) 2013-04-30 2020-04-07 엘지디스플레이 주식회사 박막 트랜지스터 어레이 기판 및 그 제조 방법
CN107369777B (zh) * 2017-08-31 2020-01-03 京东方科技集团股份有限公司 一种oled基板及其制备方法、显示装置
CN108615735B (zh) * 2018-05-03 2021-01-22 京东方科技集团股份有限公司 一种阵列基板、显示装置及阵列基板的制作方法
CN108984034B (zh) * 2018-07-19 2021-09-21 业成科技(成都)有限公司 触控结构以及触控结构的制造方法
CN111162128A (zh) * 2019-12-30 2020-05-15 重庆康佳光电技术研究院有限公司 一种薄膜晶体管及其制备方法

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Also Published As

Publication number Publication date
US5614728A (en) 1997-03-25
JP3378280B2 (ja) 2003-02-17
JPH06163581A (ja) 1994-06-10

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