KR970008329B1 - Method for forming a fine resist pattern using an alkaline film covered photoresist - Google Patents

Method for forming a fine resist pattern using an alkaline film covered photoresist Download PDF

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Publication number
KR970008329B1
KR970008329B1 KR93016121A KR930016121A KR970008329B1 KR 970008329 B1 KR970008329 B1 KR 970008329B1 KR 93016121 A KR93016121 A KR 93016121A KR 930016121 A KR930016121 A KR 930016121A KR 970008329 B1 KR970008329 B1 KR 970008329B1
Authority
KR
South Korea
Prior art keywords
forming
resist pattern
film covered
fine resist
alkaline film
Prior art date
Application number
KR93016121A
Other languages
English (en)
Other versions
KR940004723A (ko
Inventor
Takeo Ishibashi
Eiichi Ishikawa
Itaru Kanai
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of KR940004723A publication Critical patent/KR940004723A/ko
Application granted granted Critical
Publication of KR970008329B1 publication Critical patent/KR970008329B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0276—Photolithographic processes using an anti-reflective coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/151—Matting or other surface reflectivity altering material

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR93016121A 1992-08-20 1993-08-19 Method for forming a fine resist pattern using an alkaline film covered photoresist KR970008329B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4221444A JP2829555B2 (ja) 1992-08-20 1992-08-20 微細レジストパターンの形成方法
JP92-22144 1992-08-20

Publications (2)

Publication Number Publication Date
KR940004723A KR940004723A (ko) 1994-03-15
KR970008329B1 true KR970008329B1 (en) 1997-05-23

Family

ID=16766835

Family Applications (1)

Application Number Title Priority Date Filing Date
KR93016121A KR970008329B1 (en) 1992-08-20 1993-08-19 Method for forming a fine resist pattern using an alkaline film covered photoresist

Country Status (4)

Country Link
US (1) US5554489A (ko)
JP (1) JP2829555B2 (ko)
KR (1) KR970008329B1 (ko)
DE (1) DE4327662C2 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5631314A (en) * 1994-04-27 1997-05-20 Tokyo Ohka Kogyo Co., Ltd. Liquid coating composition for use in forming photoresist coating films and photoresist material using said composition
JP2996127B2 (ja) * 1995-02-17 1999-12-27 日本電気株式会社 パターン形成方法
TW394850B (en) * 1996-03-07 2000-06-21 Clariant Finance Bvi Ltd Bottom antireflective coatings through refractive index modification by anomalous dispersion
WO1997033200A1 (en) * 1996-03-07 1997-09-12 Clariant International, Ltd. Light-absorbing antireflective layers with improved performance due to refractive index optimization
JP3694703B2 (ja) * 1996-04-25 2005-09-14 Ａｚエレクトロニックマテリアルズ株式会社 反射防止コーティング用組成物
US6274295B1 (en) 1997-03-06 2001-08-14 Clariant Finance (Bvi) Limited Light-absorbing antireflective layers with improved performance due to refractive index optimization
JPH10261574A (ja) * 1997-03-19 1998-09-29 Fujitsu Ltd 半導体装置の製造方法
US6428894B1 (en) * 1997-06-04 2002-08-06 International Business Machines Corporation Tunable and removable plasma deposited antireflective coatings
US6673523B2 (en) * 1999-03-09 2004-01-06 Matsushita Electric Industrial Co., Ltd. Pattern formation method
US6984482B2 (en) 1999-06-03 2006-01-10 Hynix Semiconductor Inc. Top-coating composition for photoresist and process for forming fine pattern using the same
JP2001142221A (ja) 1999-11-10 2001-05-25 Clariant (Japan) Kk 反射防止コーティング用組成物
TW556047B (en) * 2000-07-31 2003-10-01 Shipley Co Llc Coated substrate, method for forming photoresist relief image, and antireflective composition
JP2003264309A (ja) * 2002-03-08 2003-09-19 Toshiba Corp 光半導体装置および光半導体装置の製造方法
JP3707780B2 (ja) 2002-06-24 2005-10-19 東京応化工業株式会社 パターン微細化用被覆形成剤およびそれを用いた微細パターンの形成方法
JP4583860B2 (ja) * 2004-10-04 2010-11-17 富士通株式会社 レジストパターン厚肉化材料、レジストパターンの形成方法、並びに、半導体装置及びその製造方法
US7667819B2 (en) * 2005-02-17 2010-02-23 Massachusetts Institute Of Technology System and method for contrast enhanced zone plate array lithography
US7714988B2 (en) * 2005-02-17 2010-05-11 Massachusetts Institute Of Technology System and method for absorbance modulation lithography
DE202014007986U1 (de) 2014-10-01 2016-01-05 GM Global Technology Operations LLC (n. d. Gesetzen des Staates Delaware) Schalldämpfer
WO2018033562A1 (en) 2016-08-19 2018-02-22 Covestro Deutschland Ag Process for the synthesis of polyoxazolidinone compounds

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3342579A1 (de) * 1982-11-27 1984-05-30 Basf Ag, 6700 Ludwigshafen Bildaufzeichnungsmaterialien und damit durchfuehrbare bildaufzeichnungsverfahren
GB8414867D0 (en) * 1984-06-11 1984-07-18 Minnesota Mining & Mfg Pre-press proofing system
US4816380A (en) * 1986-06-27 1989-03-28 Texas Instruments Incorporated Water soluble contrast enhancement layer method of forming resist image on semiconductor chip
US4769306A (en) * 1987-09-23 1988-09-06 Polaroid Corporation Anti-reflection layer of silica matrix with fluorinated polylmer particles
DE3736980A1 (de) * 1987-10-31 1989-05-18 Basf Ag Mehrschichtiges, flaechenfoermiges, lichtempfindliches aufzeichnungsmaterial
JPH01231038A (ja) * 1988-03-11 1989-09-14 Oki Electric Ind Co Ltd 光脱色性層用材料及びそれを用いたパターン形成方法
JPH01231040A (ja) * 1988-03-11 1989-09-14 Oki Electric Ind Co Ltd 光脱色性層用材料及びそれを用いたパターン形成方法
JPH02212851A (ja) * 1989-02-14 1990-08-24 Oki Electric Ind Co Ltd コントラスト増強用の光脱色性層用材料およびそれを用いたパターン形成方法
DE4117127A1 (de) * 1991-05-25 1992-11-26 Basf Ag Lichtempfindliche aufzeichnungselemente, verfahren zu ihrer herstellung und weiterverarbeitung sowie geraete fuer die durchfuehrung dieser verfahren

Also Published As

Publication number Publication date
JP2829555B2 (ja) 1998-11-25
KR940004723A (ko) 1994-03-15
JPH0669120A (ja) 1994-03-11
DE4327662A1 (de) 1994-02-24
DE4327662C2 (de) 1995-10-05
US5554489A (en) 1996-09-10

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