KR970008145B1 - 세라믹-온 금속-회로 기판 및 그 제조방법 - Google Patents

세라믹-온 금속-회로 기판 및 그 제조방법 Download PDF

Info

Publication number
KR970008145B1
KR970008145B1 KR1019920024285A KR920024285A KR970008145B1 KR 970008145 B1 KR970008145 B1 KR 970008145B1 KR 1019920024285 A KR1019920024285 A KR 1019920024285A KR 920024285 A KR920024285 A KR 920024285A KR 970008145 B1 KR970008145 B1 KR 970008145B1
Authority
KR
South Korea
Prior art keywords
ceramic
glass
circuit board
metal
bonding layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920024285A
Other languages
English (en)
Korean (ko)
Other versions
KR930015993A (ko
Inventor
쵸대리 체루쿠리 새트얌
스테핀 오니쉬케비치 루버미르
나라얀 프라뷰 아쇼크
제이 델러 베리
Original Assignee
제너럴 일렉트릭 컴페니
데니스 에이치. 어얼백
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/809,371 external-priority patent/US5256469A/en
Priority claimed from US07/809,372 external-priority patent/US5277724A/en
Application filed by 제너럴 일렉트릭 컴페니, 데니스 에이치. 어얼백 filed Critical 제너럴 일렉트릭 컴페니
Publication of KR930015993A publication Critical patent/KR930015993A/ko
Application granted granted Critical
Publication of KR970008145B1 publication Critical patent/KR970008145B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0054—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing PbO, SnO2, B2O3
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Glass Compositions (AREA)
KR1019920024285A 1991-12-18 1992-12-15 세라믹-온 금속-회로 기판 및 그 제조방법 Expired - Fee Related KR970008145B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US07/809,371 US5256469A (en) 1991-12-18 1991-12-18 Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
US07/809,372 1991-12-18
US07/809,371 1991-12-18
US809,371 1991-12-18
US07/809,372 US5277724A (en) 1991-12-18 1991-12-18 Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board
US809,372 1991-12-18

Publications (2)

Publication Number Publication Date
KR930015993A KR930015993A (ko) 1993-07-24
KR970008145B1 true KR970008145B1 (ko) 1997-05-21

Family

ID=27123219

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920024285A Expired - Fee Related KR970008145B1 (ko) 1991-12-18 1992-12-15 세라믹-온 금속-회로 기판 및 그 제조방법

Country Status (5)

Country Link
JP (1) JP2922375B2 (enrdf_load_stackoverflow)
KR (1) KR970008145B1 (enrdf_load_stackoverflow)
DE (1) DE4243040C2 (enrdf_load_stackoverflow)
GB (1) GB2263253B (enrdf_load_stackoverflow)
SG (1) SG50478A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100382416B1 (ko) * 1999-09-28 2003-05-01 가부시끼가이샤 도시바 세라믹 회로기판

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6233817B1 (en) * 1999-01-17 2001-05-22 Delphi Technologies, Inc. Method of forming thick-film hybrid circuit on a metal circuit board
KR100696861B1 (ko) * 1999-12-10 2007-03-19 고등기술연구원연구조합 금속상 저온 동시 소성 세라믹 기판 제조 방법
KR100696859B1 (ko) * 1999-12-10 2007-03-19 고등기술연구원연구조합 금속상 저온 동시 소성 세라믹 기판 제조 방법
DE10148751A1 (de) * 2001-10-02 2003-04-17 Siemens Ag Verfahren zur Herstellung einer Elektronikeinheit sowie Elektronikeinheit
WO2008064718A1 (de) * 2006-11-30 2008-06-05 Osram Gesellschaft mit beschränkter Haftung Elektronisches bauelementmodul und verfahren zu dessen herstellung
JP5585649B2 (ja) 2010-03-30 2014-09-10 株式会社村田製作所 金属ベース基板およびその製造方法
JP6285271B2 (ja) * 2014-04-24 2018-02-28 株式会社ノリタケカンパニーリミテド 接合材およびその利用
JP6577763B2 (ja) * 2015-06-23 2019-09-18 イビデン株式会社 エンジンバルブ及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3954486A (en) * 1974-07-30 1976-05-04 Owens-Illinois, Inc. Solder glass with refractory filler
US4185139A (en) * 1977-12-30 1980-01-22 International Standard Electric Corporation Filler for a glass-ceramic material comprising CaF2 granules overcoated with a silicon dioxide film
ZA802231B (en) * 1979-04-19 1981-09-30 Chloride Silent Power Ltd Glass for sealing beta-alumina in electro-chemical cells or other energy conversion devices, glasses for use in seals and cells or other energy conversion devices with such selas
US4256796A (en) * 1979-11-05 1981-03-17 Rca Corporation Partially devitrified porcelain composition and articles prepared with same
JPS5911700A (ja) * 1982-07-12 1984-01-21 株式会社日立製作所 セラミツク多層配線回路板
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system
US5041695A (en) * 1989-06-01 1991-08-20 Westinghouse Electric Corp. Co-fired ceramic package for a power circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100382416B1 (ko) * 1999-09-28 2003-05-01 가부시끼가이샤 도시바 세라믹 회로기판

Also Published As

Publication number Publication date
KR930015993A (ko) 1993-07-24
GB2263253B (en) 1996-02-07
JPH05270934A (ja) 1993-10-19
GB2263253A (en) 1993-07-21
DE4243040A1 (enrdf_load_stackoverflow) 1993-06-24
JP2922375B2 (ja) 1999-07-19
SG50478A1 (en) 1998-07-20
DE4243040C2 (de) 1999-06-17
GB9226220D0 (en) 1993-02-10

Similar Documents

Publication Publication Date Title
US5256469A (en) Multi-layered, co-fired, ceramic-on-metal circuit board for microelectronic packaging
US5304518A (en) Hybrid package, glass ceramic substrate for the hybrid package, and composition for the glass ceramic substrate
CA2211533C (en) Glass bonding layer for a ceramic circuit board support substrate
US4650923A (en) Ceramic article having a high moisture proof
EP1059271B1 (en) Composition for ceramic substrate and ceramic circuit component
US5277724A (en) Method of minimizing lateral shrinkage in a co-fired, ceramic-on-metal circuit board
US6667256B2 (en) Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part
US4835038A (en) Substrate coated with multiple thick films
US4821151A (en) Hermetically sealed package
US5043223A (en) Multilayer ceramic substrate and method for making the same
US4699827A (en) Electric device provided with a silk-screening dielectric coated conductive laminate
KR970008145B1 (ko) 세라믹-온 금속-회로 기판 및 그 제조방법
US6338893B1 (en) Conductive paste and ceramic printed circuit substrate using the same
US4963187A (en) Metallizing paste for circuit board having low thermal expansion coefficient
US6037045A (en) Thick-film paste and ceramic circuit substrate using the same
US4927711A (en) Hybrid circuits and thick film dielectrics used therein
US5955938A (en) RuO2 resistor paste, substrate and overcoat system
US20060009036A1 (en) High thermal cycle conductor system
JP3426920B2 (ja) 配線基板
JP3210837B2 (ja) 配線基板とそれを用いた半導体素子収納用パッケージおよびその実装構造
JPH02312201A (ja) 抵抗組成物、これを用いた回路基板及び電子装置
JPH06232528A (ja) 混成集積回路基板及びその製法
JP2001093327A (ja) Ｃｕ系導体組成物、ガラスセラミック配線基板並びにその製法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

Fee payment year number: 1

St.27 status event code: A-2-2-U10-U11-oth-PR1002

PR1001 Payment of annual fee

Fee payment year number: 4

St.27 status event code: A-4-4-U10-U11-oth-PR1001

PR1001 Payment of annual fee

Fee payment year number: 5

St.27 status event code: A-4-4-U10-U11-oth-PR1001

PR1001 Payment of annual fee

Fee payment year number: 6

St.27 status event code: A-4-4-U10-U11-oth-PR1001

PR1001 Payment of annual fee

Fee payment year number: 7

St.27 status event code: A-4-4-U10-U11-oth-PR1001

PR1001 Payment of annual fee

Fee payment year number: 8

St.27 status event code: A-4-4-U10-U11-oth-PR1001

PR1001 Payment of annual fee

Fee payment year number: 9

St.27 status event code: A-4-4-U10-U11-oth-PR1001

PR1001 Payment of annual fee

Fee payment year number: 10

St.27 status event code: A-4-4-U10-U11-oth-PR1001

FPAY Annual fee payment

Payment date: 20070823

Year of fee payment: 11

PR1001 Payment of annual fee

Fee payment year number: 11

St.27 status event code: A-4-4-U10-U11-oth-PR1001

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

Not in force date: 20080829

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

St.27 status event code: A-4-4-U10-U13-oth-PC1903

PC1903 Unpaid annual fee

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20080829

St.27 status event code: N-4-6-H10-H13-oth-PC1903

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000