KR960032728U - 웨이퍼 증착장치 - Google Patents

웨이퍼 증착장치

Info

Publication number
KR960032728U
KR960032728U KR2019950003750U KR19950003750U KR960032728U KR 960032728 U KR960032728 U KR 960032728U KR 2019950003750 U KR2019950003750 U KR 2019950003750U KR 19950003750 U KR19950003750 U KR 19950003750U KR 960032728 U KR960032728 U KR 960032728U
Authority
KR
South Korea
Prior art keywords
deposition equipment
wafer deposition
wafer
equipment
deposition
Prior art date
Application number
KR2019950003750U
Other languages
English (en)
Other versions
KR200198419Y1 (ko
Inventor
임종수
Original Assignee
현대반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대반도체주식회사 filed Critical 현대반도체주식회사
Priority to KR2019950003750U priority Critical patent/KR200198419Y1/ko
Publication of KR960032728U publication Critical patent/KR960032728U/ko
Application granted granted Critical
Publication of KR200198419Y1 publication Critical patent/KR200198419Y1/ko

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45565Shower nozzles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
KR2019950003750U 1995-03-04 1995-03-04 웨이퍼 증착장치 KR200198419Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950003750U KR200198419Y1 (ko) 1995-03-04 1995-03-04 웨이퍼 증착장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950003750U KR200198419Y1 (ko) 1995-03-04 1995-03-04 웨이퍼 증착장치

Publications (2)

Publication Number Publication Date
KR960032728U true KR960032728U (ko) 1996-10-24
KR200198419Y1 KR200198419Y1 (ko) 2000-12-01

Family

ID=19408792

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950003750U KR200198419Y1 (ko) 1995-03-04 1995-03-04 웨이퍼 증착장치

Country Status (1)

Country Link
KR (1) KR200198419Y1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100331964B1 (ko) * 2000-06-08 2002-04-10 김경균 원자층 증착 설비 및 이를 이용한 원자층 증착 방법

Also Published As

Publication number Publication date
KR200198419Y1 (ko) 2000-12-01

Similar Documents

Publication Publication Date Title
KR970001588A (ko) Cvd 장치
KR960032728U (ko) 웨이퍼 증착장치
KR970045362U (ko) 반도체 노광장치
KR970025784U (ko) 반도체 상압증착장치
KR950031464U (ko) 플라즈마 증착장비
KR970019733U (ko) 반도체 소자 증착 장치
KR970025796U (ko) 반도체 금속증착장치
KR970007225U (ko) 웨이퍼 세척 장치
KR970025846U (ko) 웨이퍼 운반구
KR950010189U (ko) 웨이퍼 코팅장치
KR970015306U (ko) 웨이퍼 세정장치
KR970046599U (ko) 웨이퍼척
KR970019763U (ko) 웨이퍼 캐리어박스
KR950025879U (ko) 플라즈마 증착장치
KR960006325U (ko) 반도체 제조용 증착장치
KR960027170U (ko) 화학 기상 증착장치
KR970015294U (ko) 화학기상증착장치
KR970011213U (ko) 반도체 제조용 장치
KR970046959U (ko) 웨이퍼 구조
KR960032360U (ko) 웨이퍼 노광장치
KR970045370U (ko) 웨이퍼의 노광장치
KR970046716U (ko) 웨이퍼의 건조장치
KR970046715U (ko) 웨이퍼의 건조장치
KR970003204U (ko) 웨이퍼 건조장치
KR970046587U (ko) 웨이퍼 캐리어

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090624

Year of fee payment: 10

EXPY Expiration of term