KR970025796U - 반도체 금속증착장치 - Google Patents

반도체 금속증착장치

Info

Publication number
KR970025796U
KR970025796U KR2019950034801U KR19950034801U KR970025796U KR 970025796 U KR970025796 U KR 970025796U KR 2019950034801 U KR2019950034801 U KR 2019950034801U KR 19950034801 U KR19950034801 U KR 19950034801U KR 970025796 U KR970025796 U KR 970025796U
Authority
KR
South Korea
Prior art keywords
metal deposition
deposition equipment
semiconductor metal
semiconductor
equipment
Prior art date
Application number
KR2019950034801U
Other languages
English (en)
Other versions
KR0132413Y1 (ko
Inventor
김영도
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950034801U priority Critical patent/KR0132413Y1/ko
Publication of KR970025796U publication Critical patent/KR970025796U/ko
Application granted granted Critical
Publication of KR0132413Y1 publication Critical patent/KR0132413Y1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR2019950034801U 1995-11-22 1995-11-22 반도체 금속증착장치 KR0132413Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950034801U KR0132413Y1 (ko) 1995-11-22 1995-11-22 반도체 금속증착장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950034801U KR0132413Y1 (ko) 1995-11-22 1995-11-22 반도체 금속증착장치

Publications (2)

Publication Number Publication Date
KR970025796U true KR970025796U (ko) 1997-06-20
KR0132413Y1 KR0132413Y1 (ko) 1999-02-01

Family

ID=19429788

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950034801U KR0132413Y1 (ko) 1995-11-22 1995-11-22 반도체 금속증착장치

Country Status (1)

Country Link
KR (1) KR0132413Y1 (ko)

Also Published As

Publication number Publication date
KR0132413Y1 (ko) 1999-02-01

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