KR960019478A - 페리클을 박리하는 방법 및 장치 - Google Patents

페리클을 박리하는 방법 및 장치 Download PDF

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Publication number
KR960019478A
KR960019478A KR1019950044327A KR19950044327A KR960019478A KR 960019478 A KR960019478 A KR 960019478A KR 1019950044327 A KR1019950044327 A KR 1019950044327A KR 19950044327 A KR19950044327 A KR 19950044327A KR 960019478 A KR960019478 A KR 960019478A
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KR
South Korea
Prior art keywords
photomask
adhesive
pellicle
peeling
hot water
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Application number
KR1019950044327A
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English (en)
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KR100205196B1 (ko
Inventor
신이치로우 다나카
시게루 와다
하루히코 구스노세
Original Assignee
기다오까 다까시
미쓰비시 뎅끼 가부시끼가이샤
가와즈 사토루
료우덴 세미콘덕터 시스템 엔지니어링 가부시끼가이샤
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Application filed by 기다오까 다까시, 미쓰비시 뎅끼 가부시끼가이샤, 가와즈 사토루, 료우덴 세미콘덕터 시스템 엔지니어링 가부시끼가이샤 filed Critical 기다오까 다까시
Publication of KR960019478A publication Critical patent/KR960019478A/ko
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Publication of KR100205196B1 publication Critical patent/KR100205196B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1111—Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1189—Gripping and pulling work apart during delaminating with shearing during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49721—Repairing with disassembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49821—Disassembling by altering or destroying work part or connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

글라스 포토마스크로 부터 페리클을 박리하는 방법은 온수(50~100℃)에 페리클의 포토마스크의 접착부를 침지하여 접착부에서의 접착제의 접착력을 감소시키는 것을 포함한다. 이 방법은 치구등으로 무리한 힘을 가하지 않고 페리클을 용이하게 박리함으로써 포토마스크의 손상을 방지하고, 유기용제보다는 온수의 사용으로 인체에 악영향을 피하며, 포토마스크에 불필요한 접착제의 접착력을 막는다.

Description

페리클을 박리하는 방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예의 페리클박리방법을 나타낸 단면도,
제3도는 본 발명의 제4실시예의 페리클박리방법을 나타낸 단면도,
제5도는 본 발명의 제6실시예의 페리클박리장치을 나타낸 단면도.

Claims (10)

  1. 페리클의 포토마스크의 접착부를 온수(50~100℃)에 침지하여 상기 접착부에서 접착제의 접착력을 저하하는 스텝과, 상기 포토마스크로 부터 상기 페리클을 박리하는 스텝을 구비한 페리클박리방법.
  2. 제1항에 있어서, 온수의 온도가 70~100℃ 범위인 페리클박리방법.
  3. 제1항에 있어서, 상기 페리클이 온수에서 상기 포토마스크로 부터 박리되는 페리클박리방법.
  4. 제1항에 있어서, 상기 온수가 계면활성제를 포함하는 페리클박리방법.
  5. 페리클의 포토마스크의 접착부를 고온의 수증기에 쐬여 상기 접착부에서 접착제의 접착력을 저하하는 스텝과, 상기 포토마스크로 부터 상기 페리클을 박리하는 스텝을 구비한 페리클박리방법.
  6. 제5항에 있어서, 비등수에 의해 상기 수증기가 발생되는 페리클박리방법.
  7. 상기 포토마스크에 부착된 페리클의 페리클프레임의 양측면을 파지하는 파지부를 가지고, 포토마스크를 지지하는 지지부와, 고온의 수증기를 발생하여 상기 페리클의 상기 포토마스크의 접착부에 상기 수증기를 접촉하는 수증기발생부를 구비한 페리클박리장치.
  8. 제7항에 있어서, 상기 파지부는 상반되게 이동하도록 하는 상기 지지부에 고정된 고정조와, 상기 고정조에 대향한 상기 지지부에 부착된 가동조와, 상기 고정조와 상기 가동조와의 사이에 상기 페리클프레임을 파지하기 위한 방향으로 상기 가동조에 힘을 가하는 리프스프링을 포함한 페리클박리장치.
  9. 제7항에 있어서, 상기 수증기발생부는 페리클의 포토마스크의 접착부에 대향하는 위치에 수증기의 취출구가 설치된 용기와, 상기 용기내의 물을 비등하는 가열기를 포함하는 페리클박리장치.
  10. 제9항에 있어서, 상기 용기는 상기 가열기를 실장한 용기본체와, 상기 취출구를 가지고 상기 용기의 상부에 설치된 덮개를 포함하는 페리클박리장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950044327A 1994-11-28 1995-11-28 페리클을 박리하는 방법 및 장치 KR100205196B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP29301794A JP3408000B2 (ja) 1994-11-28 1994-11-28 ペリクル剥離方法
JP94-293017 1994-11-28

Publications (2)

Publication Number Publication Date
KR960019478A true KR960019478A (ko) 1996-06-17
KR100205196B1 KR100205196B1 (ko) 1999-07-01

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US (1) US5772842A (ko)
JP (1) JP3408000B2 (ko)
KR (1) KR100205196B1 (ko)

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JP4637053B2 (ja) * 2006-05-15 2011-02-23 信越化学工業株式会社 ペリクルおよびペリクル剥離装置
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KR102293215B1 (ko) * 2017-03-27 2021-08-24 삼성전자주식회사 펠리클의 제조 방법 및 펠리클 조립 장치
US10670959B2 (en) 2017-05-10 2020-06-02 Taiwan Semiconductor Manufacturing Company, Ltd. Pellicle and method of using the same
JP2022523345A (ja) * 2019-02-28 2022-04-22 エーエスエムエル ネザーランズ ビー．ブイ． レチクルアセンブリのアセンブリのための装置
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JPH06175356A (ja) * 1992-12-11 1994-06-24 Nikon Corp ペリクル剥離装置

Also Published As

Publication number Publication date
JPH08152709A (ja) 1996-06-11
KR100205196B1 (ko) 1999-07-01
US5772842A (en) 1998-06-30
JP3408000B2 (ja) 2003-05-19

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