KR960009238A - 광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질 및 이 몰드-윤활 물질을 이용하여 패키지화 광-반도체 장치를 생산하는 방법 - Google Patents

광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질 및 이 몰드-윤활 물질을 이용하여 패키지화 광-반도체 장치를 생산하는 방법 Download PDF

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Publication number
KR960009238A
KR960009238A KR1019950024605A KR19950024605A KR960009238A KR 960009238 A KR960009238 A KR 960009238A KR 1019950024605 A KR1019950024605 A KR 1019950024605A KR 19950024605 A KR19950024605 A KR 19950024605A KR 960009238 A KR960009238 A KR 960009238A
Authority
KR
South Korea
Prior art keywords
mold
lubricating material
semiconductor device
molecular weight
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019950024605A
Other languages
English (en)
Korean (ko)
Inventor
사또루 쓰찌다
마사히꼬 오사까
고오조오 히로까와
야스아끼 나까무라
Original Assignee
단노 다께시
히다치가세고교 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6189687A external-priority patent/JPH0852744A/ja
Priority claimed from JP6208526A external-priority patent/JPH0873703A/ja
Application filed by 단노 다께시, 히다치가세고교 주식회사 filed Critical 단노 다께시
Publication of KR960009238A publication Critical patent/KR960009238A/ko
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/58—Applying the releasing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/009—Additives being defined by their hardness

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1019950024605A 1994-08-11 1995-08-09 광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질 및 이 몰드-윤활 물질을 이용하여 패키지화 광-반도체 장치를 생산하는 방법 Ceased KR960009238A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP6-189687 1994-08-11
JP6189687A JPH0852744A (ja) 1994-08-11 1994-08-11 光半導体装置成形用金型離型付与材及び該離型付与材により処理された金型を用いて製造された光半導体装置
JP6208526A JPH0873703A (ja) 1994-09-01 1994-09-01 エポキシ樹脂組成物及び該組成物を用いて製造した光半導体装置
JP6-208526 1994-09-01

Publications (1)

Publication Number Publication Date
KR960009238A true KR960009238A (ko) 1996-03-22

Family

ID=51397225

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950024605A Ceased KR960009238A (ko) 1994-08-11 1995-08-09 광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질 및 이 몰드-윤활 물질을 이용하여 패키지화 광-반도체 장치를 생산하는 방법

Country Status (2)

Country Link
KR (1) KR960009238A (https=)
TW (1) TW274535B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100944501B1 (ko) * 2008-07-31 2010-03-03 (주)에이씨티 반도체 금형 코팅용 고무시트

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100944501B1 (ko) * 2008-07-31 2010-03-03 (주)에이씨티 반도체 금형 코팅용 고무시트

Also Published As

Publication number Publication date
TW274535B (https=) 1996-04-21

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