JPS5488957A - Polyamide resin composition - Google Patents

Polyamide resin composition

Info

Publication number
JPS5488957A
JPS5488957A JP13831577A JP13831577A JPS5488957A JP S5488957 A JPS5488957 A JP S5488957A JP 13831577 A JP13831577 A JP 13831577A JP 13831577 A JP13831577 A JP 13831577A JP S5488957 A JPS5488957 A JP S5488957A
Authority
JP
Japan
Prior art keywords
polyamide resin
olefin copolymer
resin composition
ethylene
copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13831577A
Other languages
Japanese (ja)
Other versions
JPS5761291B2 (en
Inventor
Nori Yoshihara
Masaharu Shirai
Shigeo Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP13831577A priority Critical patent/JPS5488957A/en
Publication of JPS5488957A publication Critical patent/JPS5488957A/en
Publication of JPS5761291B2 publication Critical patent/JPS5761291B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

PURPOSE: A resin composition capable of forming a resin molded article having improved impact and heat resistance, consisting of a polyamide resin, an olefin copolymer, and fillers.
CONSTITUTION: A polyamide resin composition consisting of A) 35 W 84 wt. % of a polyamide resin, B) 1 W 25 wt. % of an olefin copolymer having epoxy groups with an epoxy equivalent of 600 W 150,000, and C ) 15 W 50 wt. % of a non-fibrous inorganic filler having an average particle diameter not more than 15 μ and/or a fibrous filler having a diameter not more than 15 μ. The olefin copolymer is preferably ethylene-α olefin copolymer having a second-order transition point of - 20 W 120°C, or an ethylene-vinylester copolymer containing 15 W 60 wt. % of the vinyl ester component.
COPYRIGHT: (C)1979,JPO&Japio
JP13831577A 1977-11-16 1977-11-16 Polyamide resin composition Granted JPS5488957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13831577A JPS5488957A (en) 1977-11-16 1977-11-16 Polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13831577A JPS5488957A (en) 1977-11-16 1977-11-16 Polyamide resin composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP8071884A Division JPS6018542A (en) 1984-04-20 1984-04-20 Polyamide resin composition

Publications (2)

Publication Number Publication Date
JPS5488957A true JPS5488957A (en) 1979-07-14
JPS5761291B2 JPS5761291B2 (en) 1982-12-23

Family

ID=15219011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13831577A Granted JPS5488957A (en) 1977-11-16 1977-11-16 Polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS5488957A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167740A (en) * 1980-05-29 1981-12-23 Toyobo Co Ltd Polyblend composition
EP0070709A2 (en) * 1981-07-17 1983-01-26 E.I. Du Pont De Nemours And Company Mineral filled abrasion-resistant monofilament
JPS5936156A (en) * 1982-08-23 1984-02-28 Toray Ind Inc Thermoplastic resin composition
JPS6018542A (en) * 1984-04-20 1985-01-30 Toyobo Co Ltd Polyamide resin composition
JPS6096648A (en) * 1983-07-15 1985-05-30 Toyobo Co Ltd Polyamide composition to be metal-plated
JPH024861A (en) * 1988-02-12 1990-01-09 Basf Ag Filler-containing polyamide molding material improved in surface and paintability
JP2015218205A (en) * 2014-05-15 2015-12-07 三菱電線工業株式会社 Backup ring, and sealing material and seal structure prepared using the same
WO2023157639A1 (en) * 2022-02-15 2023-08-24 Nok株式会社 Sealing device and back-up ring

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5073996A (en) * 1973-10-25 1975-06-18
JPS5084654A (en) * 1973-11-28 1975-07-08
JPS51149352A (en) * 1975-06-09 1976-12-22 Teijin Ltd Polyamide composition
JPS5236860A (en) * 1975-09-17 1977-03-22 Matsushita Electric Ind Co Ltd Remote control circuit for electric cleaners and the like
JPS53120762A (en) * 1977-03-30 1978-10-21 Toyobo Co Ltd Polyamide resin composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5073996A (en) * 1973-10-25 1975-06-18
JPS5084654A (en) * 1973-11-28 1975-07-08
JPS51149352A (en) * 1975-06-09 1976-12-22 Teijin Ltd Polyamide composition
JPS5236860A (en) * 1975-09-17 1977-03-22 Matsushita Electric Ind Co Ltd Remote control circuit for electric cleaners and the like
JPS53120762A (en) * 1977-03-30 1978-10-21 Toyobo Co Ltd Polyamide resin composition

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167740A (en) * 1980-05-29 1981-12-23 Toyobo Co Ltd Polyblend composition
JPS6342662B2 (en) * 1980-05-29 1988-08-24 Toyo Boseki
EP0070709A2 (en) * 1981-07-17 1983-01-26 E.I. Du Pont De Nemours And Company Mineral filled abrasion-resistant monofilament
JPS5936156A (en) * 1982-08-23 1984-02-28 Toray Ind Inc Thermoplastic resin composition
JPS6096648A (en) * 1983-07-15 1985-05-30 Toyobo Co Ltd Polyamide composition to be metal-plated
JPS6018542A (en) * 1984-04-20 1985-01-30 Toyobo Co Ltd Polyamide resin composition
JPH024861A (en) * 1988-02-12 1990-01-09 Basf Ag Filler-containing polyamide molding material improved in surface and paintability
JP2015218205A (en) * 2014-05-15 2015-12-07 三菱電線工業株式会社 Backup ring, and sealing material and seal structure prepared using the same
WO2023157639A1 (en) * 2022-02-15 2023-08-24 Nok株式会社 Sealing device and back-up ring

Also Published As

Publication number Publication date
JPS5761291B2 (en) 1982-12-23

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