KR960009238A - Mold-lubricating material which is processed in a mold for molding an optical-semiconductor device and a method for producing a packaged optical-semiconductor device using the mold-lubricating material. - Google Patents

Mold-lubricating material which is processed in a mold for molding an optical-semiconductor device and a method for producing a packaged optical-semiconductor device using the mold-lubricating material. Download PDF

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Publication number
KR960009238A
KR960009238A KR1019950024605A KR19950024605A KR960009238A KR 960009238 A KR960009238 A KR 960009238A KR 1019950024605 A KR1019950024605 A KR 1019950024605A KR 19950024605 A KR19950024605 A KR 19950024605A KR 960009238 A KR960009238 A KR 960009238A
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South Korea
Prior art keywords
mold
lubricating material
semiconductor device
molecular weight
molding
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KR1019950024605A
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Korean (ko)
Inventor
사또루 쓰찌다
마사히꼬 오사까
고오조오 히로까와
야스아끼 나까무라
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단노 다께시
히다치가세고교 주식회사
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Priority claimed from JP6189687A external-priority patent/JPH0852744A/en
Priority claimed from JP6208526A external-priority patent/JPH0873703A/en
Application filed by 단노 다께시, 히다치가세고교 주식회사 filed Critical 단노 다께시
Publication of KR960009238A publication Critical patent/KR960009238A/en

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  • Polymers & Plastics (AREA)
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  • Health & Medical Sciences (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

본 발명의, (A)에폭시 수지, (B)경화제, (C)경화촉진제 및, (D)평균 분자량수 1,000-10,000인 산화 폴리에틸렌 왁스, 평균 분자량수 1,000-10,000인 산화 폴리프로필렌 왁스 및 그 혼합물에서 선택된 저분자량 폴리올레핀 왁스(성분 (A), (B), (C) 및 (D)의 총합의 5-50중량%)를 포함하는, 광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질은 몰드 표면에 탁월한 이형 지속성을 갖는 피복을 형성하여, 거짓 실시(dummy shot)가 필요 없고 광-반도체 장치를 패키지화 하는 반복 쇼트수를 증가시키며, 모오스 경도 1-7의 무기 충전제, 유기 충전제 및 그 혼합물에서 선택된 충전제(E)를 가함으로써 더욱 개선된다.(A) Epoxy resin, (B) hardening agent, (C) hardening accelerator of this invention, (D) Oxidized polyethylene wax with an average molecular weight number of 1,000-10,000, Oxidized polypropylene wax with an average molecular weight number of 1,000-10,000, and its mixture Mold-lubricating material to be treated in a mold for molding an optical-semiconductor device, comprising a low molecular weight polyolefin wax (5-50% by weight of the sum total of components (A), (B), (C) and (D)) selected from Silver forms a coating with excellent release persistence on the mold surface, eliminating the need for dummy shots and increasing the number of repeat shots that package the optical-semiconductor device, inorganic fillers with organic hardness of 1-7, organic fillers and their It is further improved by adding the selected filler (E) in the mixture.

Description

광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질 및 이 몰드-윤활 물질을 이용하여 패키지화 광-반도체 장치를 생산하는 방법Mold-lubricating material which is processed in a mold for molding an optical-semiconductor device and a method for producing a packaged optical-semiconductor device using the mold-lubricating material.

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (11)

(A)에폭시 수지, (B)경화제, (C)경화촉진제 및, (D)평균 분자량수 1,000-10,000인 산화 폴리에틸렌 왁스, 평균 분자량수 1,000-10,000인 산화 폴리프로필렌 왁스 및 그 혼합물에서 선택된 저분자량 폴리올레핀 왁스(에폭시 수지, 경화제, 경화촉진제 및 전분자량 폴리올레핀 왁스의 총중량의 5-50중량%)를 포함하는 광-반도체 장치 몰딩용 몰드에 처리하는 몰드-윤활 물질.Low molecular weight selected from (A) epoxy resins, (B) curing agents, (C) curing accelerators, and (D) oxidized polyethylene waxes with an average molecular weight of 1,000-10,000, oxidized polypropylene waxes with an average molecular weight of 1,000-10,000, and mixtures thereof A mold-lubricating material which is subjected to a mold for molding an optical-semiconductor device comprising polyolefin wax (5-50% by weight of the total weight of the epoxy resin, the curing agent, the curing accelerator, and the starch polyolefin wax). 제1항에서, 모오스 경도 1-7의 무기 충전제(filler), 유기 충전제 및 그 혼합물로 이루어지는 군에서 선택된 충전제(E)를 추가로 포함하는 몰드-윤활 물질.2. The mold-lubricating material of claim 1, further comprising a filler (E) selected from the group consisting of inorganic fillers of Mohs hardness 1-7, organic fillers and mixtures thereof. 제2항에서, 충전제가 에폭시 수지, 경화제, 경화촉진제, 저분자량 폴리올레핀 왁스 및 충전제의 총중량의 20-90중량%인 몰드-윤활 물질.3. The mold-lubricating material of claim 2, wherein the filler is 20-90% by weight of the total weight of the epoxy resin, curing agent, curing accelerator, low molecular weight polyolefin wax and filler. 제1항에서, 에폭시 수지의 에폭시기와 경화제의 하이드록실기가 하이드록실기에 대한 에폭시의 비율이 0.7-1.3의 범위이고, 경화촉진제가 에폭시 수지와 경화제의 총중량의 0.1-5중량%인 몰드-윤활 물질.The mold of claim 1, wherein the epoxy group of the epoxy resin and the hydroxyl group of the curing agent have a ratio of epoxy to the hydroxyl group in the range of 0.7-1.3, and the curing accelerator is 0.1-5% by weight of the total weight of the epoxy resin and the curing agent. Lubricating material. 제1항에서, 저분자량 폴리올레핀 왁스가 5-30의 산값을 갖는 몰드-윤활 물질.The mold-lubricating material of claim 1, wherein the low molecular weight polyolefin wax has an acid value of 5-30. 제3항에서, 에폭시 수지의 에폭시기와 경화제의 하이드록실기가 하이드록실기에 대한 에폭시의 비율이 0.7-1.3의 범위이고, 경화촉진제가 에폭시 수지와 경화제의 총중량의 0.1-5중량%인 몰드-윤활 물질.4. The mold of claim 3, wherein the epoxy group of the epoxy resin and the hydroxyl group of the curing agent have a ratio of epoxy to the hydroxyl group in the range of 0.7-1.3, and the curing accelerator is 0.1-5% by weight of the total weight of the epoxy resin and the curing agent. Lubricating material. 제3항에서, 저분자량 폴리올레핀 왁스가 5-30의 산값을 갖느 몰드-윤활 물질.4. The mold-lubricating material of claim 3, wherein the low molecular weight polyolefin wax has an acid value of 5-30. 제1항의 몰드-윤활 물질로 처리한 몰드 표면을 갖는 몰드를 이용하여 그 안에 든 광-반도체장치를 패키지 수지로 몰딩하는 것을 포함하는, 패키지화 광-반도체 장치를 생산하는 방법.A method of producing a packaged optical-semiconductor device comprising molding a photo-semiconductor device contained therein into a package resin using a mold having a mold surface treated with the mold-lubricating material of claim 1. 제8항에서, 몰드를 이용하여 몰드-윤활 물질을 몰딩함으로써 몰드의 표면을 몰드-윤활 물질로 처리하는 방법.The method of claim 8, wherein the surface of the mold is treated with a mold-lubricating material by molding the mold-lubricating material with the mold. 제8항에서, 몰드-윤활 물질이 모오스 경도 1-7의 무기 충전제, 유기 충전제 및 그 혼합물로 이루어지는 군에서 선택된 충전제(E)를 추가로 포함하는 방법.The method of claim 8, wherein the mold-lubricating material further comprises a filler (E) selected from the group consisting of inorganic fillers of MOS hardness 1-7, organic fillers and mixtures thereof. 제10항에서, 몰드를 이용하여 몰드-윤활 물질을 몰딩함으로써 몰드의 표면을 몰드-윤활 물질로 처리하는 방법.The method of claim 10, wherein the surface of the mold is treated with a mold-lubricating material by molding the mold-lubricating material with the mold. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950024605A 1994-08-11 1995-08-09 Mold-lubricating material which is processed in a mold for molding an optical-semiconductor device and a method for producing a packaged optical-semiconductor device using the mold-lubricating material. KR960009238A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP6-189687 1994-08-11
JP6189687A JPH0852744A (en) 1994-08-11 1994-08-11 Release material for mold for molding photosemiconductor apparatus and photosemiconductor apparatus manufactured using mold treated with the same release material
JP6-208526 1994-09-01
JP6208526A JPH0873703A (en) 1994-09-01 1994-09-01 Epoxy resin composition and optical semiconductor device produced using the composition

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KR960009238A true KR960009238A (en) 1996-03-22

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TW (1) TW274535B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100944501B1 (en) * 2008-07-31 2010-03-03 (주)에이씨티 Rubber sheet for coating of semiconductor mold

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100944501B1 (en) * 2008-07-31 2010-03-03 (주)에이씨티 Rubber sheet for coating of semiconductor mold

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TW274535B (en) 1996-04-21

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