KR960009070B1 - Method and apparatus for wet treatment of solid surfaces - Google Patents

Method and apparatus for wet treatment of solid surfaces Download PDF

Info

Publication number
KR960009070B1
KR960009070B1 KR94000196A KR19940000196A KR960009070B1 KR 960009070 B1 KR960009070 B1 KR 960009070B1 KR 94000196 A KR94000196 A KR 94000196A KR 19940000196 A KR19940000196 A KR 19940000196A KR 960009070 B1 KR960009070 B1 KR 960009070B1
Authority
KR
South Korea
Prior art keywords
solid surfaces
wet treatment
wet
treatment
solid
Prior art date
Application number
KR94000196A
Other languages
English (en)
Other versions
KR940018483A (ko
Inventor
Hidemitsu Aoki
Tsutomu Nakjima
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5105991A external-priority patent/JP2859081B2/ja
Priority claimed from JP5218211A external-priority patent/JP2581403B2/ja
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Publication of KR940018483A publication Critical patent/KR940018483A/ko
Application granted granted Critical
Publication of KR960009070B1 publication Critical patent/KR960009070B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
    • C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
    • C02F1/46104—Devices therefor; Their operating or servicing
    • C02F1/4618—Devices therefor; Their operating or servicing for producing "ionised" acidic or basic water
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F9/00—Multistage treatment of water, waste water or sewage
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/30—Treatment of water, waste water, or sewage by irradiation
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/30—Treatment of water, waste water, or sewage by irradiation
    • C02F1/32—Treatment of water, waste water, or sewage by irradiation with ultraviolet light
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/42—Treatment of water, waste water, or sewage by ion-exchange
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/12—Nature of the water, waste water, sewage or sludge to be treated from the silicate or ceramic industries, e.g. waste waters from cement or glass factories
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/46115—Electrolytic cell with membranes or diaphragms
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/4612—Controlling or monitoring
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/4618—Supplying or removing reactants or electrolyte
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2201/00—Apparatus for treatment of water, waste water or sewage
    • C02F2201/46—Apparatus for electrochemical processes
    • C02F2201/461—Electrolysis apparatus
    • C02F2201/46105—Details relating to the electrolytic devices
    • C02F2201/4618—Supplying or removing reactants or electrolyte
    • C02F2201/46185—Recycling the cathodic or anodic feed
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/06—Controlling or monitoring parameters in water treatment pH
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Water Treatments (AREA)
KR94000196A 1993-01-08 1994-01-07 Method and apparatus for wet treatment of solid surfaces KR960009070B1 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP1795493 1993-01-08
JP93-17954 1993-01-08
JP5105991A JP2859081B2 (ja) 1993-01-08 1993-04-09 ウェット処理方法及び処理装置
JP93-105991 1993-04-09
JP93-218211 1993-08-10
JP5218211A JP2581403B2 (ja) 1993-08-10 1993-08-10 ウェット処理方法及び処理装置

Publications (2)

Publication Number Publication Date
KR940018483A KR940018483A (ko) 1994-08-18
KR960009070B1 true KR960009070B1 (en) 1996-07-10

Family

ID=27282026

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94000196A KR960009070B1 (en) 1993-01-08 1994-01-07 Method and apparatus for wet treatment of solid surfaces

Country Status (5)

Country Link
US (1) US5578193A (ko)
EP (1) EP0605882B1 (ko)
KR (1) KR960009070B1 (ko)
CN (1) CN1083403C (ko)
DE (1) DE69306542T2 (ko)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1266557B1 (it) * 1993-07-21 1997-01-09 Arturo Guerini Procedimento e apparecchiatura di trattamento del liquido di bagnatura in macchine da stampa, particolarmente per macchine da
JP3098661B2 (ja) * 1993-07-28 2000-10-16 キヤノン株式会社 研磨剤組成物及びそれを用いる研磨方法
JP2743823B2 (ja) * 1994-03-25 1998-04-22 日本電気株式会社 半導体基板のウエット処理方法
JPH08126886A (ja) * 1994-10-28 1996-05-21 Japan Organo Co Ltd 超純水の製造方法及び装置
JP3313263B2 (ja) * 1995-04-15 2002-08-12 株式会社東芝 電解水生成方法及びその生成装置、半導体製造装置
JP2832171B2 (ja) * 1995-04-28 1998-12-02 信越半導体株式会社 半導体基板の洗浄装置および洗浄方法
JP2832173B2 (ja) * 1995-05-31 1998-12-02 信越半導体株式会社 半導体基板の洗浄装置および洗浄方法
JP3193295B2 (ja) * 1995-07-07 2001-07-30 株式会社日本トリム 透析装置
JP3153473B2 (ja) * 1995-08-17 2001-04-09 株式会社カイゲン 医療器具用消毒装置
FI955333A0 (fi) * 1995-11-06 1995-11-06 Juhani Ilves Anordning foer rening av vatten
KR0166831B1 (ko) * 1995-12-18 1999-02-01 문정환 반도체 웨이퍼 세정장치 및 방법
JPH09186116A (ja) * 1995-12-27 1997-07-15 Toshiba Corp 半導体装置の製造方法及び半導体製造装置
JP2836562B2 (ja) * 1996-02-08 1998-12-14 日本電気株式会社 半導体ウェハのウェット処理方法
CN1299333C (zh) * 1996-08-20 2007-02-07 奥加诺株式会社 清洗电子元件或其制造设备的元件的方法和装置
GB2316090B (en) * 1996-09-26 1998-12-23 Julian Bryson Method and apparatus for producing a sterilising solution
US6007696A (en) * 1996-09-28 1999-12-28 Kabushiki Kaisha Toshiba Apparatus and method for manufacturing electrolytic ionic water and washing method using electroyltic ionic water
US5865894A (en) * 1997-06-11 1999-02-02 Reynolds Tech Fabricators, Inc. Megasonic plating system
JP3286539B2 (ja) * 1996-10-30 2002-05-27 信越半導体株式会社 洗浄装置および洗浄方法
JP3055475B2 (ja) * 1996-11-08 2000-06-26 日本電気株式会社 マイクロ波励起の洗浄方法およびその装置
JPH10261687A (ja) * 1997-03-18 1998-09-29 Furontetsuku:Kk 半導体等製造装置
US6562205B1 (en) * 1997-03-31 2003-05-13 Mitsubishi Denki Kabushiki Kaisha High-temperature ultrapure water production apparatus and liquid medicine preparation apparatus equipped with the production apparatus
US6048466A (en) * 1997-08-20 2000-04-11 Fine Glass Technology Co., Ltd. Method of cleaning glass substrate for magnetic disk or semiconductor substrate
US6332470B1 (en) * 1997-12-30 2001-12-25 Boris Fishkin Aerosol substrate cleaner
AU1325599A (en) * 1998-01-26 1999-08-12 Hee Jung Kim Electrolysis of water resulting in the reduction of fat content in the human liver
AU732602B2 (en) * 1998-01-28 2001-04-26 Hee Jung Kim Facial moisturizer and cleanser
EP0988855A1 (en) * 1998-01-28 2000-03-29 Hee Jung Kim Facial moisturizer and cleanser
US6146468A (en) * 1998-06-29 2000-11-14 Speedfam-Ipec Corporation Semiconductor wafer treatment
US6021791A (en) * 1998-06-29 2000-02-08 Speedfam-Ipec Corporation Method and apparatus for immersion cleaning of semiconductor devices
US6462250B1 (en) 1999-06-22 2002-10-08 Canon Kabushiki Kaisha Method for decomposing halogenated aliphatic hydrocarbon compounds having adsorption process and apparatus for decomposition having adsorption means
TW546257B (en) 1999-09-01 2003-08-11 Nihon Trim Co Ltd Method and apparatus for producing electrolytic reduced water
JP2001114727A (ja) * 1999-10-12 2001-04-24 Canon Inc トリクロロ酢酸の製造方法及び装置
US6357454B1 (en) 1999-11-03 2002-03-19 Jyonan Electric Industrial Co., Ltd. Method for washing and sterilizing beer supply pipe
JP3825959B2 (ja) * 2000-06-16 2006-09-27 キヤノン株式会社 汚染物質分解方法及び装置
US6599431B2 (en) 2000-06-16 2003-07-29 Canon Kabushiki Kaisha Purifying apparatus for contaminated water and ground water and method thereof
JP3825993B2 (ja) * 2000-11-16 2006-09-27 キヤノン株式会社 汚染物質分解方法及び装置
DE10056957C1 (de) * 2000-11-17 2002-09-05 Metallkraft As Kristiansand Verfahren zum Herstellen nichtoxidischer Keramiken
US20040050682A1 (en) * 2000-12-27 2004-03-18 George Paskalov Activated water apparatus and methods and products
TW552836B (en) * 2001-07-13 2003-09-11 Jipukomu Kabushiki Kaisha Method for treating surface of copper articles
US20040173463A1 (en) * 2001-07-13 2004-09-09 Itoh Jin-Ichi Method for production of printed wiring board
EP1300201A1 (fr) * 2001-10-03 2003-04-09 C.S.E.M. Centre Suisse D'electronique Et De Microtechnique Sa Systeme de nettoyage de pieces
US7018514B2 (en) * 2001-11-12 2006-03-28 Canon Kabushiki Kaisha Method and apparatus for processing substances to be decomposed
JP2003205221A (ja) * 2001-11-12 2003-07-22 Canon Inc 有機塩素化合物の処理方法及びそれに用いる装置、土壌の修復方法及びそれに用いる装置
JP2004058006A (ja) * 2002-07-31 2004-02-26 First Ocean Kk 電解水製造方法
US7552427B2 (en) * 2004-12-13 2009-06-23 Intel Corporation Method and apparatus for implementing a bi-endian capable compiler
EP1715334A1 (fr) * 2005-04-22 2006-10-25 Adamant Technologies SA Procédé utilisant un capteur électrochimique et électrodes formant ce capteur
EP2228346A1 (en) * 2006-02-24 2010-09-15 Skyview Enterprises Ionized water and method of producing same
US8110089B2 (en) * 2009-03-26 2012-02-07 Ats Apparatus and method for preparing multiple pH water streams
CN102727110B (zh) * 2011-04-08 2015-03-25 林修鹏 一种用等离子杀菌的洗菜机
CN103695957B (zh) * 2013-12-05 2016-04-27 苏州快健药业科技有限公司 具有智能控制功能的制氢装置
DE102016109771B4 (de) * 2016-05-27 2020-09-10 Brooks Automation (Germany) Gmbh Verfahren zum Reinigen einer Kunststoffoberfläche
CN110330080A (zh) * 2019-07-18 2019-10-15 太原理工大学 一种光助电控离子交换工艺及处理低浓度废水中阴离子的方法
CN113506726B (zh) * 2021-09-13 2021-12-31 广州粤芯半导体技术有限公司 晶圆清洗方法及半导体器件的制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56125203A (en) * 1980-03-01 1981-10-01 Toru Yamamoto Photochemical decomposition of water by photosensitive catalyst
JPS61268391A (ja) * 1985-05-24 1986-11-27 Hitachi Ltd 純水製造装置
EP0286233B1 (en) * 1987-03-11 1992-01-02 Omco Co. Ltd. Water electrolyzing apparatus
JPH07115017B2 (ja) * 1987-07-21 1995-12-13 龍夫 岡崎 電解水生成用電解ユニツト
JPH01130781A (ja) * 1987-11-17 1989-05-23 Tatsuo Okazaki 閉鎖洗浄液回路を有する電解イオン水生成装置
US4857158A (en) * 1988-06-17 1989-08-15 Olin Corporation Sodium hydrosulfite electrolytic cell process control system
US5059284A (en) * 1989-10-30 1991-10-22 Beloit Corporation Apparatus to displace a digester from both ends
JPH0474587A (ja) * 1990-07-17 1992-03-09 Matsushita Electric Works Ltd イオン水給湯装置
JPH0476127A (ja) * 1990-07-17 1992-03-10 Matsushita Electric Works Ltd イオン水給湯装置
JPH04193235A (ja) * 1990-11-27 1992-07-13 Matsushita Electric Works Ltd ミスト発生装置付洗面化粧台
CA2059841A1 (en) * 1991-01-24 1992-07-25 Ichiro Hayashida Surface treating solutions and cleaning method
US5175124A (en) * 1991-03-25 1992-12-29 Motorola, Inc. Process for fabricating a semiconductor device using re-ionized rinse water
JPH04314408A (ja) * 1991-04-15 1992-11-05 Matsushita Electric Works Ltd イオン水供給洗面化粧台
JPH056884A (ja) * 1991-06-27 1993-01-14 Kawasaki Steel Corp シリコンウエハーの洗浄方法
JPH0557282A (ja) * 1991-08-28 1993-03-09 Matsushita Electric Works Ltd アルカリイオン水製造器
US5268092A (en) * 1992-02-03 1993-12-07 H.E.R.C., Inc. Two water control system using oxidation reduction potential sensing
US5234563A (en) * 1992-06-01 1993-08-10 Janix Kabushiki Kaisha Electrolytic ionized water producer of a continuous type

Also Published As

Publication number Publication date
CN1083403C (zh) 2002-04-24
KR940018483A (ko) 1994-08-18
EP0605882A1 (en) 1994-07-13
DE69306542D1 (de) 1997-01-23
EP0605882B1 (en) 1996-12-11
CN1092477A (zh) 1994-09-21
DE69306542T2 (de) 1997-05-15
US5578193A (en) 1996-11-26

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