KR960007302Y1 - Print circuit board - Google Patents
Print circuit board Download PDFInfo
- Publication number
- KR960007302Y1 KR960007302Y1 KR2019910000647U KR910000647U KR960007302Y1 KR 960007302 Y1 KR960007302 Y1 KR 960007302Y1 KR 2019910000647 U KR2019910000647 U KR 2019910000647U KR 910000647 U KR910000647 U KR 910000647U KR 960007302 Y1 KR960007302 Y1 KR 960007302Y1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- lead
- soldering
- pcb
- pattern
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
요약없슴No summary
Description
제1도는 종래의 프린트 배선 회로용 기판의 평면도1 is a plan view of a substrate for a conventional printed wiring circuit
제2도는 본 고안의 일실시예에 따른 프린트 배선 회로용 기판의 평면도2 is a plan view of a substrate for a printed wiring circuit according to an embodiment of the present invention
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
A : 페이팅한 외곽 테두리 부분A: painted outer border
본 고안은 프린트 배선 회로용 기판(Print Circuit Board : 이하 PCB라 함)에 관한 것으로 특히 자동 납땜시 납물이 넘치지 않고 인접 패턴과의 단락을 방지한 프린트 배선 회로용 기판에 관한 것이다.The present invention relates to a printed circuit board (PCB), and more particularly, to a printed wiring circuit board which prevents a short circuit from adjacent patterns without overflowing the solder during automatic soldering.
일반적으로 PCB를 행해지는 납땜은 수동 혹은 자동으로 이루어지는데, 생산 자동차 추세에 따라 점점 자동 납땜방식을 채택해가고 있는 실정이다. 그런데 종래에는 PCB를 자동으로 납땜하게 되면 납물이 흘러 넘치는 경우가 많이 발생하였다. 이는 불량율을 높이는 요인중의 하나로, 시급한 개선이 요구되는 점이기도 하였다.In general, PCB soldering is performed manually or automatically. In accordance with the trend of production vehicles, automatic soldering is increasingly adopted. However, in the past, when soldering the PCB automatically, a lot of cases of overflowing the solder were generated. This is one of the factors to increase the defective rate, which also requires urgent improvement.
또한 PCB에 약간의 무리를 가하여 금형에 삽입하거나 기타 다른 이유로 패턴(pattern)의 칠이 벗겨지게 되면 옆의 패턴과 단락(short)될 우려가 많았다.In addition, when a small amount of force was applied to the PCB and inserted into the mold, or the pattern was peeled off for other reasons, the pattern was shorted with the side.
따라서 본 고안의 목적은 자동 납땜시의 납룰 넘침 및 인접패턴과의 단락을 방지한 PCB를 제공함에 있다.Accordingly, an object of the present invention is to provide a PCB which prevents overflow of lead rules and short circuits with adjacent patterns during automatic soldering.
상기한 목적을 달성하기 위한 본 PCB는 배선이 이루어지는 면의 외곽 테두리에 상기 납물과 배타적 성분을 갖는 페인트를 소정의 너비와 두께로 칠하여, 패턴의 칠을 보호함으로써 인접한 패턴과의 단락을 방지하고 상기 남물이 흘러 넘침을 방지함을 특징으로 한다.The present PCB for achieving the above object is to paint the lead and the exclusive component paint on the outer edge of the wiring surface to a predetermined width and thickness, to protect the fill of the pattern to prevent short circuit with adjacent patterns and It is characterized by preventing the flow of overflow.
이하 본 발명의 일실시예를 첨부한 도면을 참조하여 상세히 설명한다. 제2도는 본 고안의 일실시예에 따른 프린터 배선 회로용 기판의 평면도이다.Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 2 is a plan view of a substrate for a printer wiring circuit according to an embodiment of the present invention.
참조부호 A는 소정의 너비와 두께로 페인팅한 외곽 테두리 부분을 나타낸다.Reference numeral A denotes an outer edge portion painted in a predetermined width and thickness.
본 실시예에서는 상기 페인트를 흰색으로 가정한다. 또한 상기 페인트는 납땜시 사용하는 납물과 배타적 성분을 갖는다.In this embodiment, the paint is assumed to be white. The paint also has an exclusive component with the lead used in soldering.
상기 페인팅을 하는 면은 배선이 이루어지는 쪽이라면, 상·하 모두로 하고, 어느 한쪽에만 배선이 이루어질 경우에는 해당하는 한쪽에만 페인팅을 하여도 무방하다.The surface to be painted may be both up and down as long as the wiring is made. If the wiring is made only on one side, the surface may be painted only on one side.
패턴의 단락 원인은 PCB를 금형에 삽입시 혹은 기타 이루로 패턴의 칠이 벗겨지는 데 있다.The cause of the pattern short circuit is that the pattern is peeled off when the PCB is inserted into the mold or otherwise.
그러므로 도시한 바와 같이 외곽 테두리에 페인팅을 하게 되면 패턴의 칠이 잘 벗겨지지 않아 인접한 패턴과의 단락을 방지할 수 있다.Therefore, painting on the outer border, as shown, can prevent the pattern from peeling off well and prevent short circuits with adjacent patterns.
또한 이와같이 외곽 테두리에 페인팅 처리가 되었기 때문에 페인팅 처리를 하지 않은 경우와 비교해볼 때 얇은 턱이 생기는 효과를 얻을 수 있다.In addition, since the outer edges are painted, the result is a thin chin compared to the case without the painting process.
아울러 상기 페인트와 상기 납의 성분은 상후 배파적이다. 이렇게 외곽 테두리에 턱이 생길 뿐만 아니라 그 턱을 이루는 페인트의 성분이 납물의 성분과 서로 배타적이므로 납땜 과정에서 상기 턱쪽으로 납물이 흘러 가더라도 흘러 넘치지 않게 되는 것이다.In addition, the components of the paint and the lead is cross-border. In this way, not only the jaw is formed on the outer edge, but the components of the paint forming the jaw are mutually exclusive with the components of the lead, so that the lead does not overflow even when the lead flows toward the jaw during the soldering process.
상기한 바와같은 본 고안은 PCB의 외곽 테두리에 페인팅을 함으로써 납땜시 납물이 흘러 넘치는 것을 방지할 수 있을 뿐만 아니라 패턴의 칠이 쉽게 벗겨지지 않아 인접한 패턴과의 단락을 방지하여 불량율을 최소화하는 장점이 있다.As described above, the present invention not only prevents lead from flowing out when soldering by painting on the outer edge of the PCB, but also prevents shorting of adjacent patterns since the fill of the pattern is not easily peeled off, thereby minimizing the defective rate. have.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910000647U KR960007302Y1 (en) | 1991-01-17 | 1991-01-17 | Print circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019910000647U KR960007302Y1 (en) | 1991-01-17 | 1991-01-17 | Print circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR920016075U KR920016075U (en) | 1992-08-17 |
| KR960007302Y1 true KR960007302Y1 (en) | 1996-08-28 |
Family
ID=19309904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019910000647U KR960007302Y1 (en) | 1991-01-17 | 1991-01-17 | Print circuit board |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR960007302Y1 (en) |
-
1991
- 1991-01-17 KR KR2019910000647U patent/KR960007302Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR920016075U (en) | 1992-08-17 |
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