JPH0252491A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0252491A JPH0252491A JP20520788A JP20520788A JPH0252491A JP H0252491 A JPH0252491 A JP H0252491A JP 20520788 A JP20520788 A JP 20520788A JP 20520788 A JP20520788 A JP 20520788A JP H0252491 A JPH0252491 A JP H0252491A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- board
- opening
- edge part
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 abstract description 30
- 230000002265 prevention Effects 0.000 abstract description 10
- 238000003780 insertion Methods 0.000 abstract description 9
- 230000037431 insertion Effects 0.000 abstract description 9
- 239000002904 solvent Substances 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011737 fluorine Substances 0.000 abstract description 4
- 229910052731 fluorine Inorganic materials 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 description 7
- 230000000630 rising effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000032974 Gagging Diseases 0.000 description 1
- 206010038776 Retching Diseases 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的１
（産業上の利用分野）
本発明はプリント配線板に関し、特に、フラックス上が
りによる部品の不良を防止するようにしたプリント配線
板に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention 1 (Industrial Field of Application) The present invention relates to a printed wiring board, and particularly to a printed wiring board that prevents component defects due to flux build-up.
（従来の技術）
第３図は従来のプリント配線板の一部を示す説明図であ
る。基板１には部品取付は用の部品挿入穴２が開孔され
ており、基板の裏面には銅箔３が形成されている。半田
付はプロセスにおいては、部品挿入穴２に部品（図示せ
ず）を挿入した後、フラックス（図示せず）を塗布し半
田イ４けを行う。(Prior Art) FIG. 3 is an explanatory diagram showing a part of a conventional printed wiring board. A component insertion hole 2 for mounting components is formed in the substrate 1, and a copper foil 3 is formed on the back surface of the substrate. In the soldering process, after a component (not shown) is inserted into the component insertion hole 2, flux (not shown) is applied and soldering is performed.
フラックスを塗布づることにより、金属表面の酸化物が
除去され、半１日加熱による酸化が防止され、更に、半
田の表面張力が低下して半田濡れ性が向上する。By applying flux, oxides on the metal surface are removed, oxidation caused by heating for half a day is prevented, and the surface tension of the solder is lowered to improve solder wettability.
ところが、フラックスはその塗布量の多少に拘らず、部
品挿入穴２、基板分割用スリット（図示せず）及びその
他の穴（図示せず）を通過してＬｌ板１の表面に上がっ
てくる。このフラックス上がりにより基板１上に上がっ
たフラックスは部品の端子を伝わって移動ツる。リレー
及びスイッチ等の開放型部品（図示せず）では、フラッ
クスが部品端子間に付着し、接触不良等の部品不良が発
生してしまう。However, regardless of the amount of flux applied, the flux passes through the component insertion hole 2, the board dividing slit (not shown), and other holes (not shown) and rises to the surface of the Ll board 1. The flux rising on the board 1 due to this rising flux travels through the terminals of the component. In open type components (not shown) such as relays and switches, flux adheres between component terminals, resulting in component defects such as poor contact.
このようなフラックス上がりを防止するために、フラッ
クス塗布前において特殊溶剤を基板１に塗布するという
方法があり、また、開放型部品については半田槽による
一括半田付けを行わず、他の部品の一括半田付けの後に
半田ごてによる部分半田を行うという方法が採用される
。この場合には、−括半田付けの際に開放型部品を取付
けるランド部に半田が付着しないように、テープ等によ
りマスキングを行う必要があり、また、基板分割用スリ
ットにもテープが貼付けられる。In order to prevent such flux build-up, there is a method of applying a special solvent to the board 1 before applying the flux.Also, open type parts are not soldered all at once using a solder bath, but other parts are soldered all at once. After soldering, a method is adopted in which partial soldering is performed using a soldering iron. In this case, it is necessary to mask with tape or the like to prevent solder from adhering to the land portion on which the open type component is attached during bracket soldering, and tape is also pasted on the board dividing slit.
（発明が解決しようとする課題）
このように、上述した従来のプリント配線板においては
、フラックス上がりによる部品不良を防止するために、
製造上の制約が大きく工程数が多いという問題点があっ
た。(Problems to be Solved by the Invention) As described above, in the conventional printed wiring board described above, in order to prevent component defects due to flux build-up,
There were problems in that there were significant manufacturing constraints and a large number of steps.
本発明はかかる問題点に鑑みてなされたものであって、
少ない工程数で製造可能であり、フラックス−Ｅがりを
確実に防止することができるプリント配線板を提供する
ことを目的とする。The present invention has been made in view of such problems, and includes:
It is an object of the present invention to provide a printed wiring board that can be manufactured with a small number of steps and that can reliably prevent flux-E gagging.
［発明の構成］
（課題を解決するための手段）
本発明は、部品取付は面側の基板端部や開口周囲を印刷
用インキで塗布したものである。[Structure of the Invention] (Means for Solving the Problems) In the present invention, parts are attached by applying printing ink to the edge of the substrate on the surface side and around the opening.
（作用）
本発明においては、印刷用インキにより基板端部や開口
周囲に壁が形成され、フラックスが穴を通過して上昇す
ることを防止することができる。(Function) In the present invention, a wall is formed by the printing ink around the edge of the substrate and the opening, and it is possible to prevent the flux from passing through the hole and rising.
印刷用インキの塗布という＠中な工程によりフラックス
上がりを防止することができる。Flux build-up can be prevented by the intermediate process of applying printing ink.
（実施例）
以下、図面に基づいて本発明の詳細な説明する。第１図
は本発明に係るプリント配線板の一実施例を示ず斜視図
であり、第２図は第１図の一部を取付は部品を省略して
示す説明図である。第１図及び第２図において第３図と
同一の構成要素には同一の符号を付しである。(Example) Hereinafter, the present invention will be described in detail based on the drawings. FIG. 1 is a perspective view showing an embodiment of a printed wiring board according to the present invention, and FIG. 2 is an explanatory view showing a part of FIG. 1 with the attached parts omitted. Components in FIGS. 1 and 2 that are the same as those in FIG. 3 are given the same reference numerals.
Ｕ板１には部品取付り用の部品挿入穴２及び基板分割用
スリット４が開孔されている。この部品挿入穴２、基板
分割用スリット４及びその他の穴（図示せず）等の開口
周囲並びに基板１の端部の表面にはフラックス上がり防
止パターン５が形成されている。部品挿入穴２には部品
６のリード７が挿入され半田付けされている。フラック
ス上がり防止パターン５は文字印刷用インキ又はフッ素
系溶剤等の特殊溶剤を含有する文字印刷用インキを使用
してこれを開口周囲及び基板１の端部にシ；シ状にパタ
ーン印刷したものである。The U plate 1 has component insertion holes 2 for mounting components and slits 4 for dividing the board. A flux wicking prevention pattern 5 is formed around openings such as the component insertion hole 2, the board dividing slit 4, and other holes (not shown), and on the surface of the end of the board 1. Leads 7 of a component 6 are inserted into the component insertion hole 2 and soldered. The flux wicking prevention pattern 5 is a pattern printed around the opening and on the edge of the substrate 1 using a letter printing ink or a letter printing ink containing a special solvent such as a fluorine-based solvent. be.
このように構成されたプリント配線板においては、フラ
ックス塗布前にフラックス上がり防止パターン５が形成
される。このフラックス上がり防止パターン５により、
開口周囲及び基板１の端部に壁が形成される。従って、
フラックスが塗布されてもこの壁によりフラックスが基
板表面に上がることを防止することができる。更に、フ
ッ素系溶剤等の特殊溶剤が含有された文字印刷用インキ
を使用した場合には、フッ素系溶剤がフラックス防止効
果を有することから、フラックスはフラックス上がり防
止パターン５により化学的に除去され、フラックス上が
りを一層確実に防止することができる。In the printed wiring board configured in this way, the flux wicking prevention pattern 5 is formed before flux application. With this flux build-up prevention pattern 5,
A wall is formed around the opening and at the edge of the substrate 1. Therefore,
Even if flux is applied, this wall can prevent the flux from rising to the surface of the substrate. Furthermore, when a character printing ink containing a special solvent such as a fluorine-based solvent is used, since the fluorine-based solvent has a flux prevention effect, the flux is chemically removed by the flux wicking prevention pattern 5. Flux build-up can be more reliably prevented.
なお、フラックス防止パターン５は取付は部品の装置と
関係するもので、必ずしも開口周囲の全周に印刷する必
要はなく、その一部であっても有効である。Note that the installation of the flux prevention pattern 5 is related to the device of the component, so it is not necessarily necessary to print the entire circumference around the opening, and even a part of it is effective.
このようなフラックス上がり防止パターン５の印刷は、
基板製造メーカーにおいて、部品面側に部品の名称等を
文字印刷用インキで印刷する工程と同時に行われ、製造
工程数が増加するということはない。以後の半田付けに
おいてフラックス上がりを防止するだめの工程は不要で
あり、Ｍ 進上の制約が著しく低減される。Printing of such flux wicking prevention pattern 5 is as follows:
At the board manufacturer, this is done at the same time as the process of printing the name of the part on the side of the part with character printing ink, so there is no increase in the number of manufacturing steps. There is no need for a further step to prevent flux build-up in subsequent soldering, and restrictions on the M progression are significantly reduced.
［発明の効果］
以上説明したように本発明によれば、少ない工程数で７
ラツクス上がりを防止することができ、経済性が極めて
高い。[Effect of the invention] As explained above, according to the present invention, 7
It is possible to prevent the rise of lux and is extremely economical.
第１図は本発明に係るプリント配線板の一実施例を示す
斜視図、第２図は第１図の一部を部品を省略して示す説
明図、第３図は従来のプリント配線板を示す説明図であ
る。
１・・・基板、２・・・部品挿入穴、
４・・・基板分割用スリット、
５・・・フラックス上がり防止パターン、６・・・部品
、７・・・リード。
第１図
第２図
第３図FIG. 1 is a perspective view showing an embodiment of a printed wiring board according to the present invention, FIG. 2 is an explanatory diagram showing a part of FIG. 1 with parts omitted, and FIG. 3 is a diagram showing a conventional printed wiring board. FIG. 1... Board, 2... Component insertion hole, 4... Slit for board division, 5... Flux wicking prevention pattern, 6... Component, 7... Lead. Figure 1 Figure 2 Figure 3
Claims (1)
で塗布したことを特徴とするプリント配線板。A printed wiring board characterized by having printing ink applied to the edge of the board on the component mounting side and around the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20520788A JPH0252491A (en) | 1988-08-17 | 1988-08-17 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20520788A JPH0252491A (en) | 1988-08-17 | 1988-08-17 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0252491A true JPH0252491A (en) | 1990-02-22 |
Family
ID=16503174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20520788A Pending JPH0252491A (en) | 1988-08-17 | 1988-08-17 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0252491A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8813832B2 (en) | 2009-03-24 | 2014-08-26 | Sumitomo Precision Products Co., Ltd. | Heat sink |
| US11391473B2 (en) | 2018-08-29 | 2022-07-19 | Mitsubishi Electric Corporation | Outdoor unit and air conditioner |
-
1988
- 1988-08-17 JP JP20520788A patent/JPH0252491A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8813832B2 (en) | 2009-03-24 | 2014-08-26 | Sumitomo Precision Products Co., Ltd. | Heat sink |
| US11391473B2 (en) | 2018-08-29 | 2022-07-19 | Mitsubishi Electric Corporation | Outdoor unit and air conditioner |
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