JPH0613740A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0613740A JPH0613740A JP19289392A JP19289392A JPH0613740A JP H0613740 A JPH0613740 A JP H0613740A JP 19289392 A JP19289392 A JP 19289392A JP 19289392 A JP19289392 A JP 19289392A JP H0613740 A JPH0613740 A JP H0613740A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- solder
- square hole
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えば機器のプリン
ト配線板の半田付け対策に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to measures for soldering a printed wiring board of a device, for example.
【０００２】[0002]
【従来の技術】図４は従来のプリント配線板を示す断面
図であり、図において、１は絶縁基板、２はスリット又
は角穴、３はフラックス及び半田、４は部品である。2. Description of the Related Art FIG. 4 is a sectional view showing a conventional printed wiring board, in which 1 is an insulating substrate, 2 is a slit or square hole, 3 is flux and solder, and 4 is a component.
【０００３】以上のようなプリント配線板においては、
プリント配線板上に部品を乗せ、自動半田付装置により
半田付けをし固定する。In the above printed wiring board,
Parts are placed on the printed wiring board and soldered and fixed by the automatic soldering device.
【０００４】[0004]
【発明が解決しようとする課題】従来のプリント配線板
は以上のように構成されているが、半田付け時に、フラ
ックス及び半田が部品面側に上がり、回路部へ流入した
場合、回路の誤動作、プリント配線板の品質の低下の原
因となり、流入したフラックス及び半田を取り除く必要
があった。またこのため、取り除くための器具を用意し
なければならない等の問題があった。The conventional printed wiring board is constructed as described above. However, when the flux and the solder rise to the component surface side and flow into the circuit portion at the time of soldering, malfunction of the circuit, It has been necessary to remove the flux and solder that have flowed in, which causes the quality of the printed wiring board to deteriorate. For this reason, there is a problem that a device for removing must be prepared.
【０００５】この発明は上記のような課題を解消するた
めになされたもので、部品面側に上がってきたフラック
ス及び半田が回路部へ流入するのを防止することを目的
とする。The present invention has been made to solve the above problems, and an object thereof is to prevent flux and solder rising to the component side from flowing into a circuit portion.
【０００６】[0006]
【課題を解決するための手段】この発明に係るプリント
配線板は、スリット部又は角穴部の周辺に、例えば導
体、ソルダレジスト、シンボルプリントを積み重ねた堰
を設けたものである。A printed wiring board according to the present invention is provided with a weir, which is formed by stacking, for example, a conductor, a solder resist, and a symbol print on the periphery of a slit portion or a square hole portion.
【０００７】[0007]
【作用】この発明におけるプリント配線板は、スリット
部又は角穴部の周辺に、堰を設けたことにより、半田付
け時に部品面側に上がったフラックス及び半田の回路部
への流入を防止する。In the printed wiring board according to the present invention, the weir is provided around the slit portion or the square hole portion to prevent the flux and solder which have risen to the component side during soldering from flowing into the circuit portion.
【０００８】[0008]
【実施例】実施例１．以下、この発明の一実施例を図
１、図２について説明する。図において、１〜４は上記
従来例のものと同様であり、５は角穴またはスリット２
の周辺部に配置され、導体６とソルダレジスト７とシン
ボルプリント８とを順次積み上げて形成した堰である。EXAMPLES Example 1. An embodiment of the present invention will be described below with reference to FIGS. In the figure, 1 to 4 are the same as those of the conventional example, and 5 is a square hole or slit 2.
Is a weir that is arranged in the peripheral portion of the and is formed by sequentially stacking the conductor 6, the solder resist 7, and the symbol print 8.
【０００９】次にその作用について説明する。プリント
配線板上に部品を乗せ自動半田付装置により半田付けを
し固定するが、そのとき図１のスリット又は角穴部２よ
りフラックス及び半田３が部品面側に上がってきた場合
に、スリット又は角穴部２の周辺に、導体６、ソルダレ
ジスト７、シンボルプリント８の積み重ねにより堰５を
設けたことにより、部品がある回路部への不要なフラッ
クス及び半田の流入を防止することができる。なお上記
実施例において、導体６、ソルダレジスト７、シンボル
プリント８の積み重ねによって堰５を設けたのは、プリ
ント配線板の製造工程上で形成できるためであり、その
他の構成物では新たな製造工程を必要とし、コストアッ
プとなる。Next, the operation will be described. The component is placed on the printed wiring board and is soldered and fixed by the automatic soldering device. At that time, when the flux and the solder 3 come up to the component side from the slit or the square hole portion 2 in FIG. By providing the weir 5 around the square hole portion 2 by stacking the conductor 6, the solder resist 7, and the symbol print 8, it is possible to prevent unnecessary flux and solder from flowing into the circuit portion where the component is present. In the above embodiment, the reason why the weir 5 is provided by stacking the conductor 6, the solder resist 7, and the symbol print 8 is that the weir 5 can be formed in the manufacturing process of the printed wiring board, and in other components, a new manufacturing process is performed. Is required, resulting in increased cost.
【００１０】実施例２．図３はこの発明の他の実施例を
示すもので、角穴２の周囲にチップ部品９を配置するこ
とで堰を設けてもよい。Embodiment 2. FIG. 3 shows another embodiment of the present invention, in which a weir may be provided by disposing a chip component 9 around the square hole 2.
【００１１】[0011]
【発明の効果】以上のようにこの発明によれば、スリッ
ト又は角穴部の周辺部に、堰を構成したので、半田付け
時に部品面側に上がった不要なフラックス及び半田の回
路部への流入を防ぎ、品質のよいプリント配線板が得ら
れる。As described above, according to the present invention, since the weir is formed in the peripheral portion of the slit or the square hole portion, unnecessary flux and solder which have risen to the surface of the component during soldering to the circuit portion Inflow can be prevented and a high quality printed wiring board can be obtained.
【図１】この発明の一実施例によるプリント配線板を示
す断面図である。FIG. 1 is a sectional view showing a printed wiring board according to an embodiment of the present invention.
【図２】図１の上面図である。FIG. 2 is a top view of FIG.
【図３】この発明の他の実施例を示す上面図である。FIG. 3 is a top view showing another embodiment of the present invention.
【図４】従来のプリント配線板を示す断面図である。FIG. 4 is a cross-sectional view showing a conventional printed wiring board.
１ 絶縁基材 ２ スリット又は角穴 ３ フラックス及び半田 ４ 部品 ５ 堰 ６ 導体 ７ ソルダレジスト ８ シンボルプリント 1 Insulating Base 2 Slit or Square Hole 3 Flux and Solder 4 Parts 5 Weir 6 Conductor 7 Solder Resist 8 Symbol Print
Claims (2)
上に部品を乗せ、半田付装置により半田付け固定するも
のにおいて、上記絶縁基板上の、上記スリットまたは角
穴部の周辺に、半田付け時、部品面側に上がったフラッ
ク及び半田をせき止めるための堰をめぐらして配置した
ことを特徴とするプリント配線板。1. A method in which a component is placed on an insulating substrate having slits or square holes and fixed by soldering with a soldering device, when soldering is performed around the slits or square holes on the insulating substrate. The printed wiring board is characterized by arranging flacks rising to the component surface side and weirs for stopping solder.
プリントの積み重ねにより構成されている請求項１記載
のプリント配線板。2. The printed wiring board according to claim 1, wherein the weir is formed by stacking conductors, solder resists, and symbol prints.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19289392A JPH0613740A (en) | 1992-06-25 | 1992-06-25 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19289392A JPH0613740A (en) | 1992-06-25 | 1992-06-25 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0613740A true JPH0613740A (en) | 1994-01-21 |
Family
ID=16298733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19289392A Pending JPH0613740A (en) | 1992-06-25 | 1992-06-25 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0613740A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9097938B2 (en) | 2010-04-23 | 2015-08-04 | Rolic Ag | Photoaligning material |
| US9334366B2 (en) | 2011-10-03 | 2016-05-10 | Rolic Ag | Photoaligning materials |
| US9765235B2 (en) | 2011-08-02 | 2017-09-19 | Rolic Ag | Photoaligning material |
| WO2023199569A1 (en) * | 2022-04-13 | 2023-10-19 | 日立Astemo株式会社 | Drive control device for electric motor |
-
1992
- 1992-06-25 JP JP19289392A patent/JPH0613740A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9097938B2 (en) | 2010-04-23 | 2015-08-04 | Rolic Ag | Photoaligning material |
| US9765235B2 (en) | 2011-08-02 | 2017-09-19 | Rolic Ag | Photoaligning material |
| US9334366B2 (en) | 2011-10-03 | 2016-05-10 | Rolic Ag | Photoaligning materials |
| WO2023199569A1 (en) * | 2022-04-13 | 2023-10-19 | 日立Astemo株式会社 | Drive control device for electric motor |
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