JPH04241491A - Method for printing cream solder - Google Patents
Method for printing cream solderInfo
- Publication number
- JPH04241491A JPH04241491A JP1606391A JP1606391A JPH04241491A JP H04241491 A JPH04241491 A JP H04241491A JP 1606391 A JP1606391 A JP 1606391A JP 1606391 A JP1606391 A JP 1606391A JP H04241491 A JPH04241491 A JP H04241491A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- layer
- printing
- cream solder
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 88
- 239000006071 cream Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims description 21
- 238000005476 soldering Methods 0.000 description 6
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明はクリームハンダの印刷方
法に関し、載置すべきクリームハンダの厚さが、ランド
により異なる場合に適用して有用なものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of printing cream solder, and is useful when the thickness of cream solder to be placed differs depending on the land.
【０００２】0002
【従来の技術】電子部品のプリント基板に対する実装に
おいてはハンダ付けが多用されている。このハンダ付け
の一種にクリームハンダを用いる方法がある。すなわち
、この方法は、フラックスにハンダ粒を混合してなるク
リームハンダを、ハンダマスクを利用して印刷により所
定の部位に載置し、その後電子部品を所定位置に載置し
、リフロー工程でフラックスを飛ばしてハンダ付けを行
なうというものである。2. Description of the Related Art Soldering is often used in mounting electronic components on printed circuit boards. One type of soldering is a method using cream solder. In other words, in this method, cream solder made by mixing solder grains with flux is placed on a predetermined location by printing using a solder mask, then electronic components are placed on the predetermined location, and the flux is removed in a reflow process. The process involves skipping the steps and soldering.
【０００３】0003
【発明が解決しようとする課題】上述の如きハンダ付け
方法において、クリームハンダをプリント基板のランド
等に印刷した場合、ハンダ付けすべき電子部品の部位に
よっては前記印刷により形成したハンダ層の厚さが充分
でない場合がある。すなわち、例えばフィルタ等の電子
部品の接地端子はその入出力端子よりも僅かではあるが
突出長を短く形成する場合がある。これは、接地端子は
、必ずしもハンダにより接続されていなくても良いが、
入出力端子は、必ずハンダにより接続されていなければ
ならないからである。[Problems to be Solved by the Invention] In the above-described soldering method, when cream solder is printed on the land of a printed circuit board, the thickness of the solder layer formed by the printing may vary depending on the part of the electronic component to be soldered. may not be sufficient. That is, for example, the ground terminal of an electronic component such as a filter may be formed to have a protrusion length that is slightly shorter than that of its input/output terminal. This means that the ground terminal does not necessarily have to be connected by solder, but
This is because the input/output terminals must be connected by solder.
【０００４】上述の如き場合、入出力端子はハンダ接続
されるものの、接地端子はハンダから浮いてしまい、ハ
ンダによる接続がなされない場合がある。このため、前
述の如くハンダから浮いた端子は、後に作業者が手作業
でハンダ付け作業を行なっており、その分余計な手間と
時間を要するという問題がある。[0004] In the above-mentioned case, although the input/output terminals are connected by solder, the ground terminal floats from the solder, and the connection by solder may not be made. For this reason, as described above, the terminals that have come loose from the solder must be manually soldered by the operator afterwards, which poses a problem in that extra effort and time are required.
【０００５】本発明は、上記従来技術の問題点に鑑み、
厚さが異なる複数種類のハンダ層を、クリームハンダの
印刷により形成し得るクリームハンダの印刷方法を提供
することを目的とする。[0005] In view of the problems of the above-mentioned prior art, the present invention
It is an object of the present invention to provide a cream solder printing method capable of forming a plurality of types of solder layers having different thicknesses by printing cream solder.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成する本発
明の構成は、印刷によりクリームハンダを載置すべきラ
ンドに対応する孔を有する第１のハンダマスクにより１
層目のクリームハンダを印刷する第１の印刷工程と、１
層目のクリームハンダの上に２層目のクリームハンダを
載置すべきランドに対応する孔を有するとともに、そう
ではないランドに対応する部分は１層目のクリームハン
ダと第２のハンダマスクとの接触を回避する凹部を有す
る第２のハンダマスクにより２層目のクリームハンダを
印刷する第２の印刷工程とを有することを特徴とする。Means for Solving the Problems The present invention achieves the above object by printing a first solder mask having holes corresponding to lands on which cream solder is to be placed.
a first printing process of printing a layer of cream solder;
The cream solder layer has a hole corresponding to the land on which the second layer cream solder is to be placed, and the portion corresponding to the other land has the first layer cream solder and the second solder mask. and a second printing step of printing a second layer of cream solder using a second solder mask having recesses that avoid contact with the solder.
【０００７】[0007]
【作用】上記構成の本発明によれば、第１の印刷工程で
第１のハンダマスクを用いて１層目のハンダ層が形成さ
れるとともに、第２の印刷工程で第２のハンダマスクを
用いて２層目のハンダ層が形成される。[Operation] According to the present invention having the above structure, the first solder layer is formed using the first solder mask in the first printing process, and the second solder mask is formed in the second printing process. A second solder layer is formed using the solder.
【０００８】このとき、２層目のハンダ層は、第２のハ
ンダマスクの孔で選択した１層目のハンダ層上にのみ形
成されるので、厚さが異なる１層のみのハンダ層と２層
のハンダ層とが形成される。[0008] At this time, the second solder layer is formed only on the first solder layer selected by the hole in the second solder mask. A solder layer is formed.
【０００９】さらに、第２の印刷工程において、１層目
のハンダ層は第２のハンダマスクの凹部に入り込む。Furthermore, in the second printing step, the first solder layer enters the recesses of the second solder mask.
【００１０】0010
【実施例】以下本発明の実施例を図面に基づき詳細に説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below in detail with reference to the drawings.
【００１１】図３及び図４は本発明の実施例に使用する
第１及び第２のハンダマスクを示す断面図である。FIGS. 3 and 4 are cross-sectional views showing first and second solder masks used in the embodiment of the present invention.
【００１２】図３に示すように、第１のハンダマスク１
は、第１の印刷工程においてクリームハンダを載置すべ
きランドに対応する孔１ａを有している。As shown in FIG. 3, a first solder mask 1
has a hole 1a corresponding to a land on which cream solder is to be placed in the first printing process.
【００１３】図４に示すように、第２のハンダマスク２
は、第１の印刷工程の次の工程である第２の印刷工程に
おいて、クリームハンダを載置すべきランドに対応する
孔２ａを有するとともに２層目のハンダ層の形成が不要
なランドに対応する部分には１層目のハンダ層との接触
を回避する凹部２ｂを有している。As shown in FIG. 4, the second solder mask 2
has a hole 2a corresponding to a land on which cream solder is to be placed in the second printing process which is the next process of the first printing process, and corresponds to a land where formation of a second solder layer is unnecessary. A recessed portion 2b is provided in the portion that prevents contact with the first solder layer.
【００１４】上記第１及び第２のハンダマスク１，２の
諸元は、図３及び図４に示すように、次の通りである。
ｌ１ ＜ｌ２
ｔ１ ＜ｔ２
ｔ２ ＜ｔ３
但し、ｌ１ ；第１のハンダマスク１の孔１ａの径、ｌ
２ ；第２のハンダマスク２の凹部２ｂの径、ｔ１ ；
第１のハンダマスク１の厚さ、ｔ２ ；第２のハンダマ
スク２の凹部２ｂの深さ、ｔ３ ；第２のハンダマスク
２の厚さ。The specifications of the first and second solder masks 1 and 2, as shown in FIGS. 3 and 4, are as follows. l1 <l2 t1 <t2 t2 <t3 However, l1 ; Diameter of hole 1a of first solder mask 1, l
2; Diameter of recess 2b of second solder mask 2, t1;
Thickness of first solder mask 1, t2; depth of recess 2b of second solder mask 2, t3: thickness of second solder mask 2.
【００１５】上記第１及び第２のハンダマスク１，２を
用いる本実施例においては、図１に示すように、先ず第
１のハンダマスク１を用いるクリームハンダの印刷によ
りプリント基板３のランド３ａ，３ｂ上にハンダ層４を
形成する。In this embodiment using the first and second solder masks 1 and 2, as shown in FIG. , 3b, a solder layer 4 is formed on them.
【００１６】続いて、図２に示すように、第２のハンダ
マスク２を用いるクリームハンダの印刷によりランド３
ａ上のハンダ層４の上にハンダ層５を形成する。このと
き、ランド３ｂ上のハンダ層４は凹部２ｂに入り込み第
２のハンダマスク２との接触を回避する。Subsequently, as shown in FIG. 2, the land 3 is printed with cream solder using the second solder mask 2.
A solder layer 5 is formed on the solder layer 4 on a. At this time, the solder layer 4 on the land 3b enters the recess 2b and avoids contact with the second solder mask 2.
【００１７】かくして、ランド３ａには２層のハンダ層
４，５を、またランド３ｂには１層のハンダ層４のみを
夫々形成する。すなわち、必要に応じランド３ａ，３ｂ
毎に厚さの異なるハンダ層を形成する。Thus, two solder layers 4 and 5 are formed on the land 3a, and only one solder layer 4 is formed on the land 3b. In other words, the lands 3a and 3b may be
A solder layer with a different thickness is formed for each.
【００１８】[0018]
【発明の効果】以上実施例とともに具体的に説明したよ
うに、本発明によれば必要に応じ厚さの異なるハンダ層
をクリームハンダの印刷により形成することができるの
で、電子部品のハンダ付け用の端子の長さがばらつく場
合でも、各端子の長さに最適なハンダ層を形成して次の
リフロー工程で確実・迅速に所定のハンダ付けを行なう
ことができる。Effects of the Invention As specifically explained above in conjunction with the embodiments, according to the present invention, solder layers with different thicknesses can be formed as needed by printing cream solder, so that the present invention can be used for soldering electronic components. Even if the lengths of the terminals vary, it is possible to form a solder layer that is optimal for each terminal length, and to reliably and quickly perform predetermined soldering in the next reflow process.
【図１】本発明の実施例に係る第１の印刷工程を概念的
に示す説明図である。FIG. 1 is an explanatory diagram conceptually showing a first printing process according to an embodiment of the present invention.
【図２】本発明の実施例に係る第２の印刷工程を概念的
に示す説明図である。FIG. 2 is an explanatory diagram conceptually showing a second printing process according to an embodiment of the present invention.
【図３】前記第１の印刷工程で使用する第１のハンダマ
スクを示す断面図である。FIG. 3 is a sectional view showing a first solder mask used in the first printing process.
【図４】前記第２の印刷工程で使用する第２のハンダマ
スクを示す断面図である。FIG. 4 is a sectional view showing a second solder mask used in the second printing process.
１ 第１のハンダマスク １ａ 孔 ２ 第２のハンダマスク ２ａ 孔 ２ｂ 凹部 ３ａ ランド ３ｂ ランド ４ ハンダ層 ５ ハンダ層 1 First solder mask 1a hole 2 Second solder mask 2a hole 2b Recessed part 3a Land 3b land 4 Solder layer 5 Solder layer
Claims (1)
きランドに対応する孔を有する第１のハンダマスクによ
り１層目のクリームハンダを印刷する第１の印刷工程と
、１層目のクリームハンダの上に２層目のクリームハン
ダを載置すべきランドに対応する孔を有するとともに、
そうではないランドに対応する部分は１層目のクリーム
ハンダと第２のハンダマスクとの接触を回避する凹部を
有する第２のハンダマスクにより２層目のクリームハン
ダを印刷する第２の印刷工程とを有することを特徴とす
るクリームハンダの印刷方法。Claim 1: A first printing step of printing a first layer of cream solder using a first solder mask having holes corresponding to lands on which cream solder is to be placed; It has a hole corresponding to the land on which the second layer of cream solder is to be placed, and
A second printing step is performed in which a second layer of cream solder is printed using a second solder mask that has a recessed portion to avoid contact between the first layer of cream solder and the second solder mask in areas corresponding to lands that do not have this type of land. A method for printing cream solder, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1606391A JPH04241491A (en) | 1991-01-14 | 1991-01-14 | Method for printing cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1606391A JPH04241491A (en) | 1991-01-14 | 1991-01-14 | Method for printing cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04241491A true JPH04241491A (en) | 1992-08-28 |
Family
ID=11906120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1606391A Withdrawn JPH04241491A (en) | 1991-01-14 | 1991-01-14 | Method for printing cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04241491A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1558066A1 (en) * | 2004-01-21 | 2005-07-27 | Sony Ericsson Mobile Communications AB | Providing differentiated levels of solder paste on a circuit board |
| WO2005072030A3 (en) * | 2004-01-21 | 2005-09-22 | Sony Ericsson Mobile Comm Ab | Providing differentiated levels of solder paste for a circuit paste for a circuit board |
-
1991
- 1991-01-14 JP JP1606391A patent/JPH04241491A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1558066A1 (en) * | 2004-01-21 | 2005-07-27 | Sony Ericsson Mobile Communications AB | Providing differentiated levels of solder paste on a circuit board |
| WO2005072030A3 (en) * | 2004-01-21 | 2005-09-22 | Sony Ericsson Mobile Comm Ab | Providing differentiated levels of solder paste for a circuit paste for a circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980514 |