JPH02184094A - Wiring board - Google Patents
Wiring boardInfo
- Publication number
- JPH02184094A JPH02184094A JP415989A JP415989A JPH02184094A JP H02184094 A JPH02184094 A JP H02184094A JP 415989 A JP415989 A JP 415989A JP 415989 A JP415989 A JP 415989A JP H02184094 A JPH02184094 A JP H02184094A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- gas
- lead insertion
- electronic component
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 238000003780 insertion Methods 0.000 abstract description 19
- 230000037431 insertion Effects 0.000 abstract description 19
- 229910000679 solder Inorganic materials 0.000 abstract description 16
- 230000004907 flux Effects 0.000 abstract description 8
- 238000007598 dipping method Methods 0.000 abstract 1
- 230000007257 malfunction Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 9
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野1
本発明は、電子部品のリードが挿入される貫通穴ならび
にこの貫通穴に挿入されるリードが半田付けされる導体
パターンとが形成されて成る配線基板に係り、特に前記
貫通穴内のガスを抜くことを可能にし、半田付は作業時
に半田にビンホール不良が生じることを防止することが
できる配線基板に関する。[Detailed Description of the Invention] [Industrial Application Field 1] The present invention comprises a through-hole into which a lead of an electronic component is inserted and a conductor pattern to which the lead inserted into the through-hole is soldered. The present invention relates to a wiring board, and particularly to a wiring board that allows gas to be released from the through hole and prevents bottle hole defects from occurring in the solder during soldering work.
第6図から第8図までは従来の配線基板を説明するため
のもので、第6図は配線基板を示す裏面図、第7図は第
6図の■−■断面図、第8図は第7図に示す配線基板に
リード付電子部品が装着された状態を示す断面図で゛あ
る。Figures 6 to 8 are for explaining the conventional wiring board. Figure 6 is a back view showing the wiring board, Figure 7 is a sectional view taken along the line ■-■ of Figure 6, and Figure 8 is a 8 is a sectional view showing a state in which leaded electronic components are mounted on the wiring board shown in FIG. 7. FIG.
これらの図に示すように、従来は、例えば樹脂製の配線
基板lの一方の面Aに導体パターン2が形成されており
、また他方の面Bにはリード付電子部品3などが装着さ
れるようになっている。配線基板lには、前記各導体パ
ターン2のランド部2aのほぼ中央部分を貫通するリー
ド挿入穴4が穿設されている。リード付電子部品3の各
リード3aは、第8図に示すように、前記面B側からリ
ード挿入穴4に挿入され、前記各ランド部2aと半田5
により接続され固定されるようになっている。As shown in these figures, conventionally, a conductive pattern 2 is formed on one side A of a wiring board l made of resin, and an electronic component 3 with leads is mounted on the other side B. It looks like this. A lead insertion hole 4 is formed in the wiring board l, passing through approximately the center of the land portion 2a of each of the conductor patterns 2. As shown in FIG. 8, each lead 3a of the leaded electronic component 3 is inserted into the lead insertion hole 4 from the surface B side, and is connected to each land portion 2a and the solder 5.
It is connected and fixed by.
また図示しないが、導体パターン2が形成された第7図
の前記面Aには、ランド部2aの半田付けされる部分を
除く導体パターン2と配線基板lの表面を覆うレジスト
(絶縁層)が被覆形成されている。Although not shown, on the surface A in FIG. 7 on which the conductive pattern 2 is formed, there is a resist (insulating layer) that covers the surface of the conductive pattern 2 and the wiring board l except for the soldered portion of the land portion 2a. A coating is formed.
[発明が解決しようとする課題]
ところで、このような配線基板1のランド部2aに前記
リード3aを半田付けする場合、リード付電子部品3が
載置された配線基板を、前記面Aを下に向けた状態で、
高温の半田とフラックスが入れである半田槽の上まで移
動させ、さらにこれをフロー半田が噴流している半田噴
流部に進入させることによってフロー半田を前記ランド
部2aおよびリード3aに付着させるデイツプ半田付け
が行われている。[Problems to be Solved by the Invention] By the way, when soldering the leads 3a to the land portions 2a of such a wiring board 1, the wiring board on which the electronic component 3 with leads is placed is placed with the surface A facing down. in a state directed towards
Deep solder in which the flow solder is attached to the lands 2a and the leads 3a by moving the high temperature solder and flux to the top of the solder tank, and then entering the solder jet section where the flow solder is flowing. Attachment is being carried out.
しかしながら、この場合、配線基板1のリード挿入穴4
は、リード付電子部品3によってその前記面B側が完全
に塞がれた状態となっているため、前記半田槽内のフラ
ックスなどがリード挿入穴4内に入り込み、この穴4内
にフラックスなどのガスが滞留してしまうことがある。However, in this case, the lead insertion hole 4 of the wiring board 1
Since the surface B side is completely blocked by the lead-equipped electronic component 3, flux, etc. in the solder bath enters the lead insertion hole 4, and flux, etc., enters into the hole 4. Gas may remain.
その場合。In that case.
配線基板1が半田噴流部に進入しても、前記ガスの滞留
のため、半田でリード挿入穴4が埋らなくなり、半田に
ビンホール不良が生じてしまうという問題があった。Even when the wiring board 1 enters the solder jet portion, the lead insertion hole 4 is not filled with solder due to the retention of the gas, resulting in a problem that a pinhole defect occurs in the solder.
本発明はこのような課題に着目してなされたもので、リ
ード挿入穴内のガスの滞留による半田付は部分のビンホ
ール不良を防止することができる配線基板を提供するこ
とを目的とする。The present invention has been made with attention to such problems, and an object of the present invention is to provide a wiring board that can prevent soldering defects due to the retention of gas in the lead insertion holes.
本発明は、リード付電子部品のリードが挿入される貫通
穴と、この貫通穴に挿入される前記リードが半田付けさ
れる導体パターンとが形成されて成る配線基板において
、前記リード付電子部品が装着される面には、前記貫通
穴からこの電子部品が密着される部分の外側まで延びる
溝が形成されていることを特徴とするものである。The present invention provides a wiring board comprising a through hole into which a lead of a leaded electronic component is inserted and a conductor pattern to which the lead inserted into the through hole is soldered. The mounting surface is characterized by a groove extending from the through hole to the outside of the part to which the electronic component is closely attached.
〔作用J
上記した手段によれば、デイツプ半田付は作業の際に、
前記貫通穴内に侵入するのガスは、前記溝を通って貫通
穴の外へ排出されるようになっている。そのため、フラ
ックスなどのガスが前記貫通穴内に滞留することがな(
なる。[Operation J According to the above-mentioned means, dip soldering is performed during work.
Gas entering the through hole is discharged out of the through hole through the groove. Therefore, gas such as flux will not remain in the through hole (
Become.
[実施例] 以下図面に基づいて本発明の詳細な説明する。[Example] The present invention will be described in detail below based on the drawings.
第1図から第4図までは本発明の一実施例を説明するた
めのもので、第1図はこの実施例に係る配線基板を示す
平面図、第2図は第1図のII −II断面図、第3図
は第1図のIII −Il+断面図、第4図は第2図の
配線基板にリード付電子部品が装着された状態を示す断
“面図である。1 to 4 are for explaining one embodiment of the present invention, FIG. 1 is a plan view showing a wiring board according to this embodiment, and FIG. 2 is a diagram showing II-II of FIG. 3 is a sectional view taken along III-Il+ of FIG. 1, and FIG. 4 is a sectional view showing a state in which leaded electronic components are mounted on the wiring board of FIG. 2.
これらの図中、第6図から第8図までに示すものと共通
する部分には同一の符号が付されている。In these figures, parts common to those shown in FIGS. 6 to 8 are given the same reference numerals.
この実施例においては、配線基板1のリード付電子部品
3が装着される面Bに、2つのリード挿入穴4の中央を
通る1つのガス抜き満11が直線状に形成されている。In this embodiment, one gas vent hole 11 is formed in a straight line on the surface B of the wiring board 1 on which the leaded electronic component 3 is mounted, passing through the center of the two lead insertion holes 4.
このガス抜き溝11は、第1図に示すようにリード挿入
穴4から、リード付電子部品3が密着される部分(第1
図に一点鎖線Cで囲んだ部分)の外側まで延びるように
形成されている。またこのガス抜き溝11は、第3図に
拡大して示すように、例えばVカットマシンによって断
面が略三角形状となるように形成されたもので、例えば
、その幅寸法t1が0.6mmで、その深さ寸法t2が
0.3mm程度のものである。As shown in FIG.
It is formed so as to extend to the outside of the area (encircled by a dashed line C in the figure). Further, as shown in an enlarged view in FIG. 3, this gas vent groove 11 is formed by, for example, a V-cut machine so that the cross section has a substantially triangular shape, and the width dimension t1 is, for example, 0.6 mm. , the depth dimension t2 is about 0.3 mm.
以上の実施例では、前記のようなガス抜き溝11が形成
されているので、半田デイツプ作業時においてリード挿
入穴4内に高温の半田槽からフラックスなどが入り込み
、そこでガスが発生した場合、あるいはリード挿入穴4
内にフラックスなどのガスが入り込んだ場合でも、リー
ド挿入穴4内のガスはこの穴4内に滞留することなくガ
ス抜き満11を通ってこの穴4の外に排出されるように
なっている。したがって、フロー半田付は時に前記ガス
の滞留によってピンホールが生じることを防止すること
ができる。In the above embodiment, the gas vent groove 11 as described above is formed, so that if flux or the like enters into the lead insertion hole 4 from the high temperature solder bath during the soldering work and gas is generated there, or Lead insertion hole 4
Even if gas such as flux gets into the lead insertion hole 4, the gas in the lead insertion hole 4 will not remain in the hole 4 but will be discharged outside the hole 4 through the gas vent 11. . Therefore, flow soldering can sometimes prevent pinholes from forming due to the gas stagnation.
第5図は本発明の他の実施例に係る配線基板を示す平面
図である。この他の実施例においては各リード挿入穴4
ごとに、この多穴4からリード付電子部品3が密着され
る部分(−点鎖線Cで囲んだ部分)の外側まで延びるガ
ス抜き溝12が形成されている、よって、この他の実施
例によっても、第1図〜第4図について前述したのと同
様の作用効果が奏されることになる。FIG. 5 is a plan view showing a wiring board according to another embodiment of the present invention. In other embodiments, each lead insertion hole 4
In each embodiment, a gas venting groove 12 is formed extending from the multi-hole 4 to the outside of the part (the part surrounded by the - dotted chain line C) to which the leaded electronic component 3 is tightly attached. Also, the same effects as described above with respect to FIGS. 1 to 4 will be achieved.
以上のように本発明によれば、配線基板のリード付電子
部品が装着される面に、貫通穴内のガスを逃がすための
溝を形成するようにしているので、半田付は作業時に貫
通穴内にガスが滞留することを防ぎ、半田付は部分にビ
ンホール不良が発生することを防止することができる。As described above, according to the present invention, a groove is formed on the surface of the wiring board on which the lead-equipped electronic component is mounted, so that the gas inside the through-hole can escape, so that the soldering process can be carried out easily inside the through-hole during soldering. This prevents gas from stagnation, and prevents soldering from forming bottle holes.
第1図から第4図までは本発明の一実施例を説明するた
めのもので、第1図はこの実施例に係る配線基板を示す
平面図、第2図は第1図のII −II断面図、第3図
は第1図のIII −I11断面図、第4図は第2図の
配線基板にリード付電子部品が装着された状態を示す断
面図、第5図は本発明の他の実施例に係る配線基板を示
す平面図、第6図から第8図までは従来の配線基板を説
明するためのもので、第6図は配線基板を示す裏面図、
第7図は第6図の■−■断面図、第8図は第7図に示す
配線基板にリード付電子部品が装着された状態を示す断
面図である。
1・・・配線基板、2・・・導体パターン、2a・・・
ランド部、3・・・リード付電子部品、3a・・・リー
ド。
4・・・リード挿入穴、5・・・半田、11.12・・
・ガス抜き溝。1 to 4 are for explaining one embodiment of the present invention, FIG. 1 is a plan view showing a wiring board according to this embodiment, and FIG. 2 is a diagram showing II-II of FIG. 3 is a sectional view taken along line III-I11 of FIG. 1, FIG. 4 is a sectional view showing a state in which leaded electronic components are mounted on the wiring board of FIG. 2, and FIG. 5 is a sectional view of a device other than the present invention. 6 to 8 are for explaining the conventional wiring board, and FIG. 6 is a back view showing the wiring board,
FIG. 7 is a cross-sectional view taken along the line ■--■ in FIG. 6, and FIG. 8 is a cross-sectional view showing a state in which leaded electronic components are mounted on the wiring board shown in FIG. 1... Wiring board, 2... Conductor pattern, 2a...
Land portion, 3...Electronic component with lead, 3a...Lead. 4... Lead insertion hole, 5... Solder, 11.12...
・Gas vent groove.
Claims (1)
この貫通穴に挿入される前記リードが半田付けされる導
体パターンとが形成されて成る配線基板において、前記
リード付電子部品が装着される面には、前記貫通穴から
この電子部品が密着される部分の外側まで延びる溝が形
成されていることを特徴とする配線基板1. A through hole into which a lead of an electronic component with a lead is inserted;
In a wiring board formed with a conductor pattern to which the leads inserted into the through-holes are soldered, the electronic component is tightly attached to the surface on which the lead-attached electronic component is attached through the through-hole. A wiring board characterized by having a groove extending to the outside of the part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP415989A JPH02184094A (en) | 1989-01-10 | 1989-01-10 | Wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP415989A JPH02184094A (en) | 1989-01-10 | 1989-01-10 | Wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02184094A true JPH02184094A (en) | 1990-07-18 |
Family
ID=11576966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP415989A Pending JPH02184094A (en) | 1989-01-10 | 1989-01-10 | Wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02184094A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012151297A (en) * | 2011-01-19 | 2012-08-09 | Rb Controls Co | Printed wiring board |
-
1989
- 1989-01-10 JP JP415989A patent/JPH02184094A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012151297A (en) * | 2011-01-19 | 2012-08-09 | Rb Controls Co | Printed wiring board |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20070257355A1 (en) | Soldering structure of through hole | |
JPH07288375A (en) | Circuit board | |
JPH02184094A (en) | Wiring board | |
JPH04223396A (en) | Printed wiring board device | |
JP7551235B2 (en) | Manufacturing method of electronic device and printed wiring board used in the method | |
JP2000277892A (en) | Printed circuit board and electronic component mounting board | |
JPH04343288A (en) | Printed wiring board | |
US7291912B2 (en) | Circuit board | |
JPS5853890A (en) | Method of soldering electronic part | |
JPH0697637A (en) | Printed wiring board | |
JPH04115592A (en) | Printed wiring board | |
JPH04152692A (en) | Manufacture of printed wiring board | |
JPH07297502A (en) | Printed wiring board | |
JPH09191173A (en) | Circuit board | |
JPH0414892A (en) | Structure of solder resist opening of printed-wiring board | |
JPH0384912A (en) | Electronic component | |
GB2300524A (en) | Process for making a printed circuit board partially coated with solder | |
KR101088066B1 (en) | Flexible printed wiring board | |
KR960007302Y1 (en) | Print circuit board | |
JPH04786A (en) | Manufacture of printed circuit board | |
JPH02222195A (en) | Manufacture of multilayer interconnection board burying via hole in footprint | |
JPH06125166A (en) | Circuit board | |
JPH02164092A (en) | Mold board with pattern trench | |
JPH06120649A (en) | Electronic circuit board | |
JPH04269894A (en) | Soldering method for surface mount component on printed circuit board |