JPH02184094A - Wiring board - Google Patents

Wiring board

Info

Publication number
JPH02184094A
JPH02184094A JP415989A JP415989A JPH02184094A JP H02184094 A JPH02184094 A JP H02184094A JP 415989 A JP415989 A JP 415989A JP 415989 A JP415989 A JP 415989A JP H02184094 A JPH02184094 A JP H02184094A
Authority
JP
Japan
Prior art keywords
hole
gas
lead insertion
electronic component
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP415989A
Other languages
Japanese (ja)
Inventor
Yoshiaki Takahashi
義明 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP415989A priority Critical patent/JPH02184094A/en
Publication of JPH02184094A publication Critical patent/JPH02184094A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To prevent the pinhole malfunction of a soldered part with residue of gas in a lead insertion hole by forming a groove extending from a through hole to the outside of the part with which an electronic component with leads is brought into close contact on the surface to be mounted with the electronic component with leads. CONSTITUTION:One gas vent groove 11 passing the center of two lead insertion holes 4 is linearly formed on a surface B to be mounted with an electronic component 3 with leads of a circuit board 1. The gas vent groove 11 is so formed from the lead insertion hole 4 as to extend up to the outside of the part in which the electronic component 3 with leads is brought into close contact therewith. The gas vent groove 11 is formed, for example, in a substantially triangular shape in section by a V-cut machine. Thus, since the gas vent hole 11 is formed, even if flux or the like is introduced from a high temperature solder tank into the lead insertion hole 4 at the time of solder dipping work so that gas is generated thereat or gas of the flux or the like is introduced into the lead insertion hole 4, the gas in the lead insertion hole 4 does not remain in the hole 4, but is discharged out of the hole 4 through the gas vent groove 11.

Description

【発明の詳細な説明】 〔産業上の利用分野１ 本発明は、電子部品のリードが挿入される貫通穴ならび
にこの貫通穴に挿入されるリードが半田付けされる導体
パターンとが形成されて成る配線基板に係り、特に前記
貫通穴内のガスを抜くことを可能にし、半田付は作業時
に半田にビンホール不良が生じることを防止することが
できる配線基板に関する。[Detailed Description of the Invention] [Industrial Application Field 1] The present invention comprises a through-hole into which a lead of an electronic component is inserted and a conductor pattern to which the lead inserted into the through-hole is soldered. The present invention relates to a wiring board, and particularly to a wiring board that allows gas to be released from the through hole and prevents bottle hole defects from occurring in the solder during soldering work.

〔従来の技術〕[Conventional technology]

第６図から第８図までは従来の配線基板を説明するため
のもので、第６図は配線基板を示す裏面図、第７図は第
６図の■−■断面図、第８図は第７図に示す配線基板に
リード付電子部品が装着された状態を示す断面図で゛あ
る。Figures 6 to 8 are for explaining the conventional wiring board. Figure 6 is a back view showing the wiring board, Figure 7 is a sectional view taken along the line ■-■ of Figure 6, and Figure 8 is a 8 is a sectional view showing a state in which leaded electronic components are mounted on the wiring board shown in FIG. 7. FIG.

これらの図に示すように、従来は、例えば樹脂製の配線
基板ｌの一方の面Ａに導体パターン２が形成されており
、また他方の面Ｂにはリード付電子部品３などが装着さ
れるようになっている。配線基板ｌには、前記各導体パ
ターン２のランド部２ａのほぼ中央部分を貫通するリー
ド挿入穴４が穿設されている。リード付電子部品３の各
リード３ａは、第８図に示すように、前記面Ｂ側からリ
ード挿入穴４に挿入され、前記各ランド部２ａと半田５
により接続され固定されるようになっている。As shown in these figures, conventionally, a conductive pattern 2 is formed on one side A of a wiring board l made of resin, and an electronic component 3 with leads is mounted on the other side B. It looks like this. A lead insertion hole 4 is formed in the wiring board l, passing through approximately the center of the land portion 2a of each of the conductor patterns 2. As shown in FIG. 8, each lead 3a of the leaded electronic component 3 is inserted into the lead insertion hole 4 from the surface B side, and is connected to each land portion 2a and the solder 5.
It is connected and fixed by.

また図示しないが、導体パターン２が形成された第７図
の前記面Ａには、ランド部２ａの半田付けされる部分を
除く導体パターン２と配線基板ｌの表面を覆うレジスト
（絶縁層）が被覆形成されている。Although not shown, on the surface A in FIG. 7 on which the conductive pattern 2 is formed, there is a resist (insulating layer) that covers the surface of the conductive pattern 2 and the wiring board l except for the soldered portion of the land portion 2a. A coating is formed.

［発明が解決しようとする課題］ ところで、このような配線基板１のランド部２ａに前記
リード３ａを半田付けする場合、リード付電子部品３が
載置された配線基板を、前記面Ａを下に向けた状態で、
高温の半田とフラックスが入れである半田槽の上まで移
動させ、さらにこれをフロー半田が噴流している半田噴
流部に進入させることによってフロー半田を前記ランド
部２ａおよびリード３ａに付着させるデイツプ半田付け
が行われている。[Problems to be Solved by the Invention] By the way, when soldering the leads 3a to the land portions 2a of such a wiring board 1, the wiring board on which the electronic component 3 with leads is placed is placed with the surface A facing down. in a state directed towards
Deep solder in which the flow solder is attached to the lands 2a and the leads 3a by moving the high temperature solder and flux to the top of the solder tank, and then entering the solder jet section where the flow solder is flowing. Attachment is being carried out.

しかしながら、この場合、配線基板１のリード挿入穴４
は、リード付電子部品３によってその前記面Ｂ側が完全
に塞がれた状態となっているため、前記半田槽内のフラ
ックスなどがリード挿入穴４内に入り込み、この穴４内
にフラックスなどのガスが滞留してしまうことがある。However, in this case, the lead insertion hole 4 of the wiring board 1
Since the surface B side is completely blocked by the lead-equipped electronic component 3, flux, etc. in the solder bath enters the lead insertion hole 4, and flux, etc., enters into the hole 4. Gas may remain.

その場合。In that case.

配線基板１が半田噴流部に進入しても、前記ガスの滞留
のため、半田でリード挿入穴４が埋らなくなり、半田に
ビンホール不良が生じてしまうという問題があった。Even when the wiring board 1 enters the solder jet portion, the lead insertion hole 4 is not filled with solder due to the retention of the gas, resulting in a problem that a pinhole defect occurs in the solder.

本発明はこのような課題に着目してなされたもので、リ
ード挿入穴内のガスの滞留による半田付は部分のビンホ
ール不良を防止することができる配線基板を提供するこ
とを目的とする。The present invention has been made with attention to such problems, and an object of the present invention is to provide a wiring board that can prevent soldering defects due to the retention of gas in the lead insertion holes.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、リード付電子部品のリードが挿入される貫通
穴と、この貫通穴に挿入される前記リードが半田付けさ
れる導体パターンとが形成されて成る配線基板において
、前記リード付電子部品が装着される面には、前記貫通
穴からこの電子部品が密着される部分の外側まで延びる
溝が形成されていることを特徴とするものである。The present invention provides a wiring board comprising a through hole into which a lead of a leaded electronic component is inserted and a conductor pattern to which the lead inserted into the through hole is soldered. The mounting surface is characterized by a groove extending from the through hole to the outside of the part to which the electronic component is closely attached.

〔作用Ｊ 上記した手段によれば、デイツプ半田付は作業の際に、
前記貫通穴内に侵入するのガスは、前記溝を通って貫通
穴の外へ排出されるようになっている。そのため、フラ
ックスなどのガスが前記貫通穴内に滞留することがな（
なる。[Operation J According to the above-mentioned means, dip soldering is performed during work.
Gas entering the through hole is discharged out of the through hole through the groove. Therefore, gas such as flux will not remain in the through hole (
Become.

［実施例］ 以下図面に基づいて本発明の詳細な説明する。[Example] The present invention will be described in detail below based on the drawings.

第１図から第４図までは本発明の一実施例を説明するた
めのもので、第１図はこの実施例に係る配線基板を示す
平面図、第２図は第１図のＩＩ　−ＩＩ断面図、第３図
は第１図のＩＩＩ　−Ｉｌ＋断面図、第４図は第２図の
配線基板にリード付電子部品が装着された状態を示す断
“面図である。1 to 4 are for explaining one embodiment of the present invention, FIG. 1 is a plan view showing a wiring board according to this embodiment, and FIG. 2 is a diagram showing II-II of FIG. 3 is a sectional view taken along III-Il+ of FIG. 1, and FIG. 4 is a sectional view showing a state in which leaded electronic components are mounted on the wiring board of FIG. 2.

これらの図中、第６図から第８図までに示すものと共通
する部分には同一の符号が付されている。In these figures, parts common to those shown in FIGS. 6 to 8 are given the same reference numerals.

この実施例においては、配線基板１のリード付電子部品
３が装着される面Ｂに、２つのリード挿入穴４の中央を
通る１つのガス抜き満１１が直線状に形成されている。In this embodiment, one gas vent hole 11 is formed in a straight line on the surface B of the wiring board 1 on which the leaded electronic component 3 is mounted, passing through the center of the two lead insertion holes 4.

このガス抜き溝１１は、第１図に示すようにリード挿入
穴４から、リード付電子部品３が密着される部分（第１
図に一点鎖線Ｃで囲んだ部分）の外側まで延びるように
形成されている。またこのガス抜き溝１１は、第３図に
拡大して示すように、例えばＶカットマシンによって断
面が略三角形状となるように形成されたもので、例えば
、その幅寸法ｔ１が０．６ｍｍで、その深さ寸法ｔ２が
０．３ｍｍ程度のものである。As shown in FIG.
It is formed so as to extend to the outside of the area (encircled by a dashed line C in the figure). Further, as shown in an enlarged view in FIG. 3, this gas vent groove 11 is formed by, for example, a V-cut machine so that the cross section has a substantially triangular shape, and the width dimension t1 is, for example, 0.6 mm. , the depth dimension t2 is about 0.3 mm.

以上の実施例では、前記のようなガス抜き溝１１が形成
されているので、半田デイツプ作業時においてリード挿
入穴４内に高温の半田槽からフラックスなどが入り込み
、そこでガスが発生した場合、あるいはリード挿入穴４
内にフラックスなどのガスが入り込んだ場合でも、リー
ド挿入穴４内のガスはこの穴４内に滞留することなくガ
ス抜き満１１を通ってこの穴４の外に排出されるように
なっている。したがって、フロー半田付は時に前記ガス
の滞留によってピンホールが生じることを防止すること
ができる。In the above embodiment, the gas vent groove 11 as described above is formed, so that if flux or the like enters into the lead insertion hole 4 from the high temperature solder bath during the soldering work and gas is generated there, or Lead insertion hole 4
Even if gas such as flux gets into the lead insertion hole 4, the gas in the lead insertion hole 4 will not remain in the hole 4 but will be discharged outside the hole 4 through the gas vent 11. . Therefore, flow soldering can sometimes prevent pinholes from forming due to the gas stagnation.

第５図は本発明の他の実施例に係る配線基板を示す平面
図である。この他の実施例においては各リード挿入穴４
ごとに、この多穴４からリード付電子部品３が密着され
る部分（−点鎖線Ｃで囲んだ部分）の外側まで延びるガ
ス抜き溝１２が形成されている、よって、この他の実施
例によっても、第１図〜第４図について前述したのと同
様の作用効果が奏されることになる。FIG. 5 is a plan view showing a wiring board according to another embodiment of the present invention. In other embodiments, each lead insertion hole 4
In each embodiment, a gas venting groove 12 is formed extending from the multi-hole 4 to the outside of the part (the part surrounded by the - dotted chain line C) to which the leaded electronic component 3 is tightly attached. Also, the same effects as described above with respect to FIGS. 1 to 4 will be achieved.

〔発明の効果〕〔Effect of the invention〕

以上のように本発明によれば、配線基板のリード付電子
部品が装着される面に、貫通穴内のガスを逃がすための
溝を形成するようにしているので、半田付は作業時に貫
通穴内にガスが滞留することを防ぎ、半田付は部分にビ
ンホール不良が発生することを防止することができる。As described above, according to the present invention, a groove is formed on the surface of the wiring board on which the lead-equipped electronic component is mounted, so that the gas inside the through-hole can escape, so that the soldering process can be carried out easily inside the through-hole during soldering. This prevents gas from stagnation, and prevents soldering from forming bottle holes.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図から第４図までは本発明の一実施例を説明するた
めのもので、第１図はこの実施例に係る配線基板を示す
平面図、第２図は第１図のＩＩ　−ＩＩ断面図、第３図
は第１図のＩＩＩ　−Ｉ１１断面図、第４図は第２図の
配線基板にリード付電子部品が装着された状態を示す断
面図、第５図は本発明の他の実施例に係る配線基板を示
す平面図、第６図から第８図までは従来の配線基板を説
明するためのもので、第６図は配線基板を示す裏面図、
第７図は第６図の■−■断面図、第８図は第７図に示す
配線基板にリード付電子部品が装着された状態を示す断
面図である。 １・・・配線基板、２・・・導体パターン、２ａ・・・
ランド部、３・・・リード付電子部品、３ａ・・・リー
ド。 ４・・・リード挿入穴、５・・・半田、１１．１２・・
・ガス抜き溝。1 to 4 are for explaining one embodiment of the present invention, FIG. 1 is a plan view showing a wiring board according to this embodiment, and FIG. 2 is a diagram showing II-II of FIG. 3 is a sectional view taken along line III-I11 of FIG. 1, FIG. 4 is a sectional view showing a state in which leaded electronic components are mounted on the wiring board of FIG. 2, and FIG. 5 is a sectional view of a device other than the present invention. 6 to 8 are for explaining the conventional wiring board, and FIG. 6 is a back view showing the wiring board,
FIG. 7 is a cross-sectional view taken along the line ■--■ in FIG. 6, and FIG. 8 is a cross-sectional view showing a state in which leaded electronic components are mounted on the wiring board shown in FIG. 1... Wiring board, 2... Conductor pattern, 2a...
Land portion, 3...Electronic component with lead, 3a...Lead. 4... Lead insertion hole, 5... Solder, 11.12...
・Gas vent groove.

Claims (1)

【特許請求の範囲】[Claims] １．リード付電子部品のリードが挿入される貫通穴と、
この貫通穴に挿入される前記リードが半田付けされる導
体パターンとが形成されて成る配線基板において、前記
リード付電子部品が装着される面には、前記貫通穴から
この電子部品が密着される部分の外側まで延びる溝が形
成されていることを特徴とする配線基板1. A through hole into which a lead of an electronic component with a lead is inserted;
In a wiring board formed with a conductor pattern to which the leads inserted into the through-holes are soldered, the electronic component is tightly attached to the surface on which the lead-attached electronic component is attached through the through-hole. A wiring board characterized by having a groove extending to the outside of the part.
JP415989A 1989-01-10 1989-01-10 Wiring board Pending JPH02184094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP415989A JPH02184094A (en) 1989-01-10 1989-01-10 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP415989A JPH02184094A (en) 1989-01-10 1989-01-10 Wiring board

Publications (1)

Publication Number Publication Date
JPH02184094A true JPH02184094A (en) 1990-07-18

Family

ID=11576966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP415989A Pending JPH02184094A (en) 1989-01-10 1989-01-10 Wiring board

Country Status (1)

Country Link
JP (1) JPH02184094A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012151297A (en) * 2011-01-19 2012-08-09 Rb Controls Co Printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012151297A (en) * 2011-01-19 2012-08-09 Rb Controls Co Printed wiring board

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