JPH04786A - Manufacture of printed circuit board - Google Patents
Manufacture of printed circuit boardInfo
- Publication number
- JPH04786A JPH04786A JP10126190A JP10126190A JPH04786A JP H04786 A JPH04786 A JP H04786A JP 10126190 A JP10126190 A JP 10126190A JP 10126190 A JP10126190 A JP 10126190A JP H04786 A JPH04786 A JP H04786A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- solder
- symbol
- diameter
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229910000679 solder Inorganic materials 0.000 claims abstract description 37
- 238000000576 coating method Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000004020 conductor Substances 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 abstract description 2
- 230000003213 activating effect Effects 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 5
- 230000004913 activation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、印刷配線板の小径スルホール信頼性向上に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to improving the reliability of small-diameter through holes in printed wiring boards.
第３図は従来のソルダーレジスト形成からソルダーコー
トまでの工程を示す流れ図、第４図、第５図（（転）は
従来の小径スルホール部ソルダーレジスト形状を示す断
面図、第５図（Ｂ）は第５図（入をデイツプまたはフロ
ーソルダリングした状態を示す断面図である。Fig. 3 is a flowchart showing the conventional process from forming solder resist to solder coating, Figs. FIG. 5 is a sectional view showing a state in which the insert is dip or flow soldered.
図において、（１）は小径スルホール、 （２ａ）？
（２ｂ）はソルダーレジスト、（３）はシンボル印刷
、（４）はソルダーコート前・ンダ、 （５ａ）はデ
イツプまたはフローソルダリングハンダ、 （ｓｂ）は
ハンダブリッジである。In the figure, (1) is a small diameter through hole, (2a)?
(2b) is solder resist, (3) is symbol printing, (4) is before solder coating, (5a) is dip or flow soldering solder, and (sb) is solder bridge.
近年、印刷配線板は、ソルダーレジストから露出する部
分のみにノ・ンダをコーティングするソルダーコート法
が主流となってきている。その際。In recent years, solder coating methods have become mainstream for printed wiring boards, in which solder is coated only on the parts exposed from the solder resist. that time.
信号用小径スルホール＋１１部のソルダーレジストは。Small diameter through hole for signal + 11 part solder resist.
第４図（２ａ）のごとくクリアランスを設けない仕様と
、第５図（２ｂ）のごとくクリアランスを設ける仕様が
ある。第４図（２ａ）のようにクリアランスを設けない
と、ソルダーコート前の銅表面活性化処理液が残渣する
危険があシ、信頼性上好ましくない。第５図（２ｂ）は
処理液残渣を防止するためクリアランスを設け、小径ス
ルホールを貫通にしている。There is a specification in which no clearance is provided, as shown in FIG. 4 (2a), and a specification in which a clearance is provided, as shown in FIG. 5 (2b). If a clearance is not provided as shown in FIG. 4 (2a), there is a risk that the copper surface activation treatment solution before solder coating will remain, which is not preferable in terms of reliability. In FIG. 5 (2b), a clearance is provided to prevent processing liquid residue, and a small diameter through hole is made to penetrate.
従来の印刷配線板小径スルホール部は以上第５図（２ｂ
）のようにクリアランスを設けているため。The conventional printed wiring board small diameter through-hole section is shown in Figure 5 (2b).
) because of the clearance provided.
第５図（Ｂ）のようにアセンブリメーカで部品実装後の
デイツプまたはフローソルダリングの際、小径スルホー
ル−小径スルホール間隔または小径スルホール部品ビン
間隔が微細の箇所では（５ｂ）のようなハンダブリッジ
が発生する問題があった。As shown in Figure 5 (B), during dip or flow soldering after component mounting at an assembly manufacturer, solder bridges as shown in (5b) occur at locations where the small-diameter through-hole to small-diameter through-hole spacing or the small-diameter through-hole component bin spacing is minute. There was a problem that occurred.
この発明は上記のような問題点を解消するためになされ
たもので、小径スルホール内処理液残渣に対する信頼性
を向上するとともに、アセンブリメーカでのハンダブリ
ッジも防止することを目的とする。The present invention has been made to solve the above-mentioned problems, and aims to improve the reliability of treating liquid residue in small-diameter through-holes and to prevent solder bridging at assembly manufacturers.
この発明における印刷配線板の製造方法は、従来ソルダ
ーコート前に行っていたシンボル印刷をソルダーコート
後に移し、シンボル印刷を小径スルホール部にも施した
ものである。In the method of manufacturing a printed wiring board according to the present invention, symbol printing, which was conventionally performed before solder coating, is moved after solder coating, and symbol printing is also applied to small-diameter through-hole portions.
この発明における印刷配線板小径スルホールは。 The printed wiring board small-diameter through holes in this invention are as follows.
シンボル印刷を施したことによシデイツプまたはフロー
ソルダリング時のハンダブリッジを防止できる。Symbol printing prevents solder bridges during side dip or flow soldering.
以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図はソルダーレジスト形成からシンボル印刷工程ま
での本発明の流れ図、第２図は第１図（（転）（ＢＸＣ
）に添っての断面図であり、（４）はソルダーレジスト
形成後、（Ｂ）はソルダーコート後、（Ｃ）はシンボル
印刷後を示す。Figure 1 is a flow chart of the present invention from solder resist formation to symbol printing process, and Figure 2 is a flowchart of the present invention from solder resist formation to symbol printing process.
), in which (4) shows the state after forming the solder resist, (B) shows the state after solder coating, and (C) shows the state after symbol printing.
図中、 ｆｌ）は小径スルホール、 （２１））は
ソルダーコート）、 （５ａ）は小径スルホール部に
施したシンボル印刷、 （３ｂ）は文字、形状等を表
す通常のシンボル印刷、（４）はソルダーコートハンダ
である。In the figure, fl) is a small diameter through hole, (21)) is a solder coat), (5a) is symbol printing applied to the small diameter through hole, (3b) is normal symbol printing that represents characters, shapes, etc., and (4) is It is solder coat solder.
本発明の印刷配線板の製造方法は、第２図（Ａ）の通り
、小径スルホール内処理液残渣に対する信頼性向上を目
的にソルダーレジスト（２ｂ）にクリアランスを設け、
小径スルホールを貫通とする。次いで、銅表面にハンダ
をコーティングするため１表面活性化処理の後、ソルダ
ーコートを行い、洗浄後、第２図（Ｂ）の状態となる。As shown in FIG. 2(A), the method for manufacturing a printed wiring board of the present invention includes providing a clearance in the solder resist (2b) for the purpose of improving reliability against processing liquid residue in small diameter through holes.
Penetrate through small diameter through hole. Next, in order to coat the copper surface with solder, after one surface activation treatment, solder coating is performed, and after cleaning, the state as shown in FIG. 2(B) is obtained.
この際、第２図（Ａ）の通りスルホールを貫通としてい
るため、活性化処理液は洗浄にて全て除去される。その
後、従来。At this time, since the through-holes are penetrating as shown in FIG. 2(A), all of the activation treatment liquid is removed by washing. Then conventional.
ソルダーコート前に施していたシンボル印刷を。Symbol printing that was applied before solder coating.
ソルダーコート後実施する。この際、第２図（Ｃ）−（
３ａ）のように小径スルホール部にもシンボル印刷を施
すことにより導体が露出している箇所を覆うだめ２部品
実装後のデイツプまたはフローソルダリング時のブリッ
ジを防止する。Perform after solder coating. At this time, Fig. 2 (C)-(
As shown in 3a), by printing a symbol on the small diameter through-hole portion, it is possible to cover the area where the conductor is exposed, thereby preventing dips after mounting two components or bridging during flow soldering.
本発明は、従来と比較し、工程を増すことなく。The present invention does not require an increase in the number of steps compared to the conventional method.
スルホール信頼性およびハンダ付性を向上することが可
能となる。Through-hole reliability and solderability can be improved.
なお、上記実施例では、小径スルホール部シンボル印刷
（３ａ）はテンティング状態となっているが。In the above embodiment, the symbol printing (3a) on the small diameter through hole portion is in a tenting state.
導体が覆われていれば小径スルホール内に垂れ込んでい
ても良い。また、小径スルホール部ンルダーレジストク
リアランス径（２ｂ）は特に定めない。As long as the conductor is covered, it may hang down into the small diameter through hole. Furthermore, the diameter (2b) of the small-diameter through-hole resist clearance is not particularly determined.
以上のように、この発明によれば、印刷配線板小径スル
ホール部の処理液残渣に対する信頼性向上のため、ソル
ダーレジストにクリアランスを設けた箇所にシンボル印
刷を施すことによシ、スルホール信頼性向上と部品実装
時の−・ンダブリッジを防止する効果がある。As described above, according to the present invention, in order to improve the reliability of the small-diameter through-hole portions of printed wiring boards against processing liquid residue, through-hole reliability is improved by printing symbols on the solder resist at locations where clearances are provided. This has the effect of preventing negative bridges during component mounting.
第１図はこの発明の工程流れ図、第２図はこの発明の一
実施例による印刷配線板の製造工程ごとの断面図、第３
図は従来の工程流れ図、に４図。
第５図は従来の印刷配線板断面図である。
図中、（１）は小径スルホール、（２ａ）、（２ｂ）は
ソルダーレジスト、（３ａ）、（３ｂ）はシンボル印刷
、（４）はソルダーコートハンダを示す。
なお２図中、同一符号は同一または相当部分を示す。Fig. 1 is a process flow chart of the present invention, Fig. 2 is a sectional view of each manufacturing process of a printed wiring board according to an embodiment of the invention, and Fig. 3 is a process flow diagram of the present invention.
Figure 4 is a conventional process flow diagram. FIG. 5 is a sectional view of a conventional printed wiring board. In the figure, (1) shows small diameter through holes, (2a) and (2b) show solder resist, (3a) and (3b) show symbol printing, and (4) shows solder coat solder. Note that in the two figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
ルダーコート工程後に行い，小径スルホール部にもシン
ボル印刷を施すことを特徴とする印刷配線板の製造方法
。A method for manufacturing a printed wiring board, characterized in that in the printed wiring board manufacturing process, a symbol printing process is performed after a solder coating process, and symbols are printed also on small diameter through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10126190A JPH04786A (en) | 1990-04-17 | 1990-04-17 | Manufacture of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10126190A JPH04786A (en) | 1990-04-17 | 1990-04-17 | Manufacture of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04786A true JPH04786A (en) | 1992-01-06 |
Family
ID=14295973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10126190A Pending JPH04786A (en) | 1990-04-17 | 1990-04-17 | Manufacture of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04786A (en) |
-
1990
- 1990-04-17 JP JP10126190A patent/JPH04786A/en active Pending
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