KR960005927A - 웨이퍼 캐리어 - Google Patents
웨이퍼 캐리어 Download PDFInfo
- Publication number
- KR960005927A KR960005927A KR1019950020892A KR19950020892A KR960005927A KR 960005927 A KR960005927 A KR 960005927A KR 1019950020892 A KR1019950020892 A KR 1019950020892A KR 19950020892 A KR19950020892 A KR 19950020892A KR 960005927 A KR960005927 A KR 960005927A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer carrier
- main body
- body portion
- carrier
- sidewalls
- Prior art date
Links
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims abstract 8
- 229920000049 Carbon (fiber) Polymers 0.000 claims 8
- 239000004917 carbon fiber Substances 0.000 claims 8
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 2
- 229920000728 polyester Polymers 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 239000000806 elastomer Substances 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
- Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2918—Rod, strand, filament or fiber including free carbon or carbide or therewith [not as steel]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
대단한 저 입자 발생 특성을 가진 치수적으로 안정하며 정전기 소산성인, 반도체 웨이퍼들이나 자기 기억장치 디스크들 용의 캐리어의 개시이다. 캐리어는 대향하는 측벽들과 접속벽들을 가지고 있고, 측벽들은 디스크들이나 웨이퍼들의 축방향 배열을 위한 슬롯들을 구성하는 리브들을 가지고 있다. 측벽들, 리브들, 및 단벽들은 모두 일체이며, 또, 12중량% 내지 25중량%의 단소섬유 충전제를 가진 사출성형의 폴리부틸 테레프탈레이트(PBT)로 형성돼 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 반도체 웨이퍼의 캐리어이다.
제2도는 자기 디스크를 적하하는 데 적합한 세 부분의 적하 캐리어이다.
제3도는 제1도에 보인 따위의 분체부를 보지하는, 캐리어의 부분으로서의 봉입물(enclosure)이다.
Claims (15)
- 웨이퍼를 보지하는 적어도 하나의 슬롯을 가진 웨이퍼 캐리어로서, 그 캐리어는 탄소섬유로 충전된 폴리부틸 테레프탈레이트로 형성된 웨이퍼 캐리어.
- 제1항에 있어서, 폴리부틸 테레프탈레이트의 탄소섬유의 비율이 12 내지 25중량 퍼센트의 범위인 웨이퍼 캐리어.
- 제2항에 있어서, 탄소섬유들이 있으며 대부분의 섬유는 혼합전의 종횡비가 100 : 1 이상인, 웨이퍼 캐리어.
- 제1항에 있어서, 리브들이 있는 한 쌍의 측벽과, 한 쌍의 접속벽을 더 함유하고, 그 리브들이 복수의 슬롯을 구성하며, 측벽들과, 단벽들, 및 리브들은 모두가 일체로 웨이퍼 캐리어.
- 제4항에 있어서, 측벽들, 접속벽들, 및 리브들은 주본체부의 주요부분이고, 그 주 본체부는 상기 개방이며 또 웨이퍼 캐리어는 개방 상부의 뚜껑을 더 함유하는, 웨이퍼 캐리어.
- 제4항에 있어서, 측벽들, 접속벽들, 및 리브들은 주본체부의 주요부분이고, 그 주 본체부는 저부개방이며 웨이퍼 캐리어는 개방 저부의 밑뚜껑을 더 함유하는, 웨이퍼 캐리어.
- 제1항에 있어서, 폴리부틸 테레프탈레이트는 탄성중합체의 폴리에스터를 더 함유하는, 웨이퍼 캐리어.
- 제4항에 있어서, 측벽들과 단벽들은 주 본체부의 주요부분이고, 또 캐리어는 05내지 1012옴/스퀘어의 범위의 표면 저항률에 충분한 탄소섬유를 가진 폴리부틸 테레프탈레이트로 제조된 개방가능의 봉입물을 더 함유하는 웨이퍼 캐리어.
- 웨이퍼를 보지하는 적어도 하나의 슬롯을 가진 사출 성형의 웨이퍼 캐리어로서, 그 캐리어는 105내지 1010옴/스퀘어의 범위의 표면 저항률에 충분한 탄소섬유로 충전된 폴리부틸 테레프탈레이트로 형성된 웨이퍼 캐리어.
- 제9항에 있어서, 탄소섬유들은 재단 탄소섬유인 웨이퍼 캐리어.
- 제9항에 있어서, 한 쌍의 측벽, 그 측벽들을 연결하는 한 쌍의 단벽, 측벽들에 형성된 복수의 슬롯을 더 함유하며, 측벽들과 단벽들은 모두 일체인 웨이퍼 캐리어.
- 제11항에 있어서, 측벽들과 단벽들은 주 본체부의 주요부분이고, 그 주 본체부는 상부 개방이며, 또 웨이퍼 캐리어는 개방 상부의 뚜껑을 더 함유하는, 웨이퍼 캐리어.
- 제11항에 있어서, 측벽들, 접속벽들, 및 리브들은 주본체부의 주요부분이고, 그 주본체부는 저부 개방이며, 또 웨이퍼 캐리어는 개방 저부의 밑뚜껑을 더 함유하는, 웨이퍼 캐리어.
- 제11항에 있어서, 측벽들과 단벽들은 주본체부의 주요부분이고, 또 캐리어는 105내지 1012옴/스퀘어의 범위의 표면 저항률에 충분한 탄소섬유를 가진 폴리부틸 테레프탈레이트로 제조된 개방가능의 봉입물을 더 함유하며 그 봉입물은 주본체부를 받아들이는 크기인, 웨이퍼 캐리어.
- 제11항에 있어서, 폴리부틸 테레프탈레이트는 탄성중합체 폴리에스터 첨가제를 가지는 웨이퍼 캐리어.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27550294A | 1994-07-15 | 1994-07-15 | |
US08/275,502 | 1994-07-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960005927A true KR960005927A (ko) | 1996-02-23 |
KR100343421B1 KR100343421B1 (ko) | 2002-12-02 |
Family
ID=23052581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950020892A KR100343421B1 (ko) | 1994-07-15 | 1995-07-15 | 웨이퍼 캐리어 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5780127A (ko) |
EP (1) | EP0692817B1 (ko) |
JP (1) | JPH0888266A (ko) |
KR (1) | KR100343421B1 (ko) |
CN (1) | CN1121645A (ko) |
DE (1) | DE69500752T2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100431654B1 (ko) * | 2001-07-26 | 2004-05-17 | 삼성전자주식회사 | 반도체 장치의 알루미늄막 증착방법 |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100188137B1 (ko) | 1995-09-07 | 1999-06-01 | 김광호 | 액정 표시 장치 글래스 적재용 카세트 |
JP3283743B2 (ja) | 1996-01-11 | 2002-05-20 | 帝人株式会社 | シリコンウェーハーキャリア |
US5788082A (en) * | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
EP1881034A1 (en) | 1997-04-04 | 2008-01-23 | Teijin Limited | Silicon wafer carrier |
EP0915506B1 (en) | 1997-04-04 | 2009-12-16 | Teijin Limited | Silicon wafer carrier |
US6150446A (en) * | 1997-08-29 | 2000-11-21 | Teijin Limited | Destaticizing thermoplastic resin composition |
US6068137A (en) * | 1997-09-16 | 2000-05-30 | Sumitomo Metal Industries, Ltd. | Semiconductor wafer carrier |
JPH11145272A (ja) * | 1997-11-11 | 1999-05-28 | Innotech Corp | クリーンボックス |
US6428729B1 (en) * | 1998-05-28 | 2002-08-06 | Entegris, Inc. | Composite substrate carrier |
DE19924182B4 (de) * | 1998-05-28 | 2008-04-17 | Entegris, Inc., Chaska | Träger für zu bearbeitende, aufzubewahrende und/oder zu transportierende Halbleiterwafer |
DE19964317B4 (de) * | 1998-05-28 | 2008-04-10 | Entegris, Inc., Chaska | Verwendung eines Behälters für einen Reinraum zur Aufnahme von Halbleiterwafern |
TW431998B (en) * | 1998-05-28 | 2001-05-01 | Fluoroware Inc | Overmolded wafer carrier, wafer carrier, process for mnaufacturing wafer carriers and wafer carrier portion |
US6871741B2 (en) * | 1998-05-28 | 2005-03-29 | Entegris, Inc. | Composite substrate carrier |
CN1080177C (zh) * | 1998-09-21 | 2002-03-06 | 财团法人工业技术研究院 | 集成电路晶片承载盘及其制造方法 |
JP2000248186A (ja) | 1999-02-26 | 2000-09-12 | Teijin Ltd | 樹脂組成物およびそれからなるエレクトロニクス分野の搬送用冶具 |
US6193090B1 (en) | 1999-04-06 | 2001-02-27 | 3M Innovative Properties Company | Reusable container |
DE10045202A1 (de) * | 2000-09-13 | 2002-04-11 | Infineon Technologies Ag | Kassette für flache Werkstücke |
DE10116382C2 (de) * | 2001-04-02 | 2003-08-28 | Infineon Technologies Ag | Transportbehälter für Wafer |
US6758339B2 (en) * | 2001-07-12 | 2004-07-06 | Entegris, Inc. | Thin wafer carrier |
US20030188990A1 (en) * | 2001-11-14 | 2003-10-09 | Bhatt Sanjiv M. | Composite kinematic coupling |
DE10213677B4 (de) * | 2002-03-27 | 2005-11-03 | Atn Automatisierungstechnik Niemeier Gmbh | Verfahren und Vorrichtung für das punktuelle Löten mit erwärmtem Lot |
US7175026B2 (en) | 2002-05-03 | 2007-02-13 | Maxtor Corporation | Memory disk shipping container with improved contaminant control |
US7600359B2 (en) * | 2002-05-09 | 2009-10-13 | Seagate Technology Llc | Method of merging two disks concentrically without gap between disks |
MY138480A (en) * | 2002-05-09 | 2009-06-30 | Maxtor Corp | Method of simultaneous two-disk processing of single-sided magnetic recording disks |
US7367773B2 (en) * | 2002-05-09 | 2008-05-06 | Maxtor Corporation | Apparatus for combining or separating disk pairs simultaneously |
US7180709B2 (en) * | 2002-05-09 | 2007-02-20 | Maxtor Corporation | Information-storage media with dissimilar outer diameter and/or inner diameter chamfer designs on two sides |
US7628895B2 (en) * | 2002-05-09 | 2009-12-08 | Seagate Technology Llc | W-patterned tools for transporting/handling pairs of disks |
US7052739B2 (en) * | 2002-05-09 | 2006-05-30 | Maxtor Corporation | Method of lubricating multiple magnetic storage disks in close proximity |
US7083871B2 (en) | 2002-05-09 | 2006-08-01 | Maxtor Corporation | Single-sided sputtered magnetic recording disks |
US20040074808A1 (en) * | 2002-07-05 | 2004-04-22 | Entegris, Inc. | Fire retardant wafer carrier |
US7083376B2 (en) | 2002-10-10 | 2006-08-01 | Maxtor Corporation | Automated merge nest for pairs of magnetic storage disks |
US7168153B2 (en) | 2002-10-10 | 2007-01-30 | Maxtor Corporation | Method for manufacturing single-sided hard memory disks |
US7316325B2 (en) * | 2003-11-07 | 2008-01-08 | Entegris, Inc. | Substrate container |
WO2005097905A1 (ja) * | 2004-03-31 | 2005-10-20 | Techno Polymer Co., Ltd. | 熱可塑性樹脂組成物及び樹脂成形体 |
US7882616B1 (en) | 2004-09-02 | 2011-02-08 | Seagate Technology Llc | Manufacturing single-sided storage media |
CN101378973B (zh) * | 2006-02-03 | 2012-05-30 | 安格斯公司 | 吸震的基底容器 |
JP4799266B2 (ja) * | 2006-05-18 | 2011-10-26 | コバレントマテリアル株式会社 | 半導体装置の製造方法、半導体基板の製造方法および半導体基板 |
US20090200250A1 (en) * | 2008-02-07 | 2009-08-13 | Multimetrixs, Llc | Cleanliness-improved wafer container |
US20090208669A1 (en) * | 2008-02-15 | 2009-08-20 | Multimetrixs. Llc | Apparatus and method for application of a thin barrier layer onto inner surfaces of wafer containers |
US20090217950A1 (en) * | 2008-03-03 | 2009-09-03 | Multimetrixs, Llc | Method and apparatus for foam-assisted wafer cleaning |
EP3186827A4 (en) * | 2014-08-28 | 2018-04-25 | Entegris, Inc. | Substrate container |
CN110620077B (zh) * | 2019-08-22 | 2022-04-05 | 武汉华星光电半导体显示技术有限公司 | 载台和传送装置 |
US20220357650A1 (en) * | 2021-05-07 | 2022-11-10 | Entegris, Inc. | Metal plating with lubricant |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4669612A (en) * | 1985-02-20 | 1987-06-02 | Empak Inc. | Disk processing cassette |
US5253755A (en) | 1991-03-20 | 1993-10-19 | Fluoroware, Inc. | Cushioned cover for disk container |
JP3177003B2 (ja) * | 1992-07-31 | 2001-06-18 | 住友金属工業株式会社 | 半導体ウェーハの輸送用容器 |
-
1995
- 1995-06-16 EP EP19950401424 patent/EP0692817B1/en not_active Expired - Lifetime
- 1995-06-16 DE DE1995600752 patent/DE69500752T2/de not_active Expired - Fee Related
- 1995-07-13 JP JP17771995A patent/JPH0888266A/ja active Pending
- 1995-07-14 CN CN95106483A patent/CN1121645A/zh active Pending
- 1995-07-15 KR KR1019950020892A patent/KR100343421B1/ko not_active IP Right Cessation
-
1996
- 1996-01-11 US US08/584,093 patent/US5780127A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100431654B1 (ko) * | 2001-07-26 | 2004-05-17 | 삼성전자주식회사 | 반도체 장치의 알루미늄막 증착방법 |
Also Published As
Publication number | Publication date |
---|---|
DE69500752D1 (de) | 1997-10-30 |
JPH0888266A (ja) | 1996-04-02 |
EP0692817B1 (en) | 1997-09-24 |
CN1121645A (zh) | 1996-05-01 |
EP0692817A1 (en) | 1996-01-17 |
DE69500752T2 (de) | 1998-03-12 |
KR100343421B1 (ko) | 2002-12-02 |
US5780127A (en) | 1998-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR960005927A (ko) | 웨이퍼 캐리어 | |
US6776289B1 (en) | Wafer container with minimal contact | |
US10326262B2 (en) | Electrical connection box | |
KR970706625A (ko) | 전기 커넥터 및 전기 커넥터용 접점 유지 장치(contact retention device for an electrical connector) | |
KR910007190A (ko) | 전기 커넥터 | |
ATE106163T1 (de) | Batterie und batteriebehälter-anordnung. | |
GB2205199A (en) | Noise absorber for absorbing electrically generated noise | |
KR950034990A (ko) | 일체형 커넥터 및 하우징을 갖는 모터 | |
US5368500A (en) | Closure for electric plug | |
US5484309A (en) | Electrical receptacle assembly with interference fitting and latching parts | |
US4815596A (en) | Dip carrier | |
KR960002468A (ko) | 웨이퍼 수납 박스내의 웨이퍼 배스킷 | |
KR840007788A (ko) | 자기 테이프 카세트 | |
KR930005291A (ko) | 칩 캐리어 소켓 어셈블리 | |
KR890010971A (ko) | 다극회로 차단기의 아크소호실 장치 | |
MY116369A (en) | Mbe system and semiconductor device fabricated, using same | |
US4866574A (en) | Packaging of electrical components | |
US5133452A (en) | IC package storage container | |
US6283783B1 (en) | Female receptacle with retaining device | |
US4626050A (en) | Kit box having a housing and flexible bins | |
US20040042165A1 (en) | Electronic component support structure | |
KR960019889A (ko) | 합성수지 매틸배선박스 | |
JP2002145382A (ja) | Ic固定収納トレー | |
KR870000781Y1 (ko) | 집적회로소자(集積回路 子)의 수장(收藏) 케이스 | |
JPS60213099A (ja) | 印刷回路板用保管具 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20050620 Year of fee payment: 4 |
|
LAPS | Lapse due to unpaid annual fee |