KR950701560A - 레이저 가공 방법 및 그 장치(laser beam machining method and appa-ratus therefor) - Google Patents
레이저 가공 방법 및 그 장치(laser beam machining method and appa-ratus therefor)Info
- Publication number
- KR950701560A KR950701560A KR1019940704225A KR19940704225A KR950701560A KR 950701560 A KR950701560 A KR 950701560A KR 1019940704225 A KR1019940704225 A KR 1019940704225A KR 19940704225 A KR19940704225 A KR 19940704225A KR 950701560 A KR950701560 A KR 950701560A
- Authority
- KR
- South Korea
- Prior art keywords
- machining
- point
- processing
- end point
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000003754 machining Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims description 8
- 238000003672 processing method Methods 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 abstract 2
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims (4)
- 레이저 빔을 워크피스에 조사하여 레이저 가공을 행하는 레이저 가공 방법에 있어서, 가공 개시점과 가공 종료점이 일치하는 형상의 가공을 행하는 경우, 상기 가공 종료점을 상기 가공 개시점의 근처로 설정하여 레이저 가공을 행하는 것을 특징으로 하는 레이저 가공방법.
- 제1항에 있어서, 상기 가공 종료점 직전에 가공 조건을 변화시키는 것을 특징으로 하는 레이저 가공방법.
- 레이저 빔을 워크피스에 조사하여 레이저 가공을 행하는 레이저 가공 장치에 있어서, 가공 개시점과 가공 종료점이 일치하는 형상의 가공을 행하는 경우, 상기 가공 종료점을 상기 가공 개시점의 근처로 설정하여 얻어진 가공 궤적에 기초하여 가공을 행하는 레이저 가공 수단을 갖는 것을 특징으로 하는 레이저 가공장치.
- 제3항에 있어서, 상기 가공 종료점 직전에 가공 조건을 변화시켜서 가공을 행하는 가공 조건 변경 수단을 갖는 것을 특징으로 하는 레이저 가공장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP93-065816 | 1993-03-25 | ||
JP5065816A JPH06269967A (ja) | 1993-03-25 | 1993-03-25 | レーザ加工方法及びその装置 |
PCT/JP1994/000443 WO1994021417A1 (en) | 1993-03-25 | 1994-03-17 | Laser beam machining method and apparatus therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
KR950701560A true KR950701560A (ko) | 1995-04-28 |
Family
ID=13297933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940704225A Ceased KR950701560A (ko) | 1993-03-25 | 1994-03-17 | 레이저 가공 방법 및 그 장치(laser beam machining method and appa-ratus therefor) |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0646434A1 (ko) |
JP (1) | JPH06269967A (ko) |
KR (1) | KR950701560A (ko) |
WO (1) | WO1994021417A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190015290A (ko) * | 2016-06-10 | 2019-02-13 | 닛토덴코 가부시키가이샤 | 필름의 오려내기 방법 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012115899A (ja) * | 2010-11-09 | 2012-06-21 | Amada Co Ltd | レーザ切断加工方法及びレーザ加工装置 |
JP6018744B2 (ja) | 2011-11-02 | 2016-11-02 | 日酸Tanaka株式会社 | レーザ切断方法及びレーザ切断装置 |
CN102489884A (zh) * | 2011-12-02 | 2012-06-13 | 深圳光韵达光电科技股份有限公司 | 一种激光切割圆孔或椭圆孔的方法 |
DE102015211403B4 (de) * | 2015-06-22 | 2022-01-27 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zum Reduzieren von Ansatzmarken beim Laserschneiden von Werkstückteilen |
CN107283069B (zh) * | 2016-04-01 | 2019-04-12 | 大族激光科技产业集团股份有限公司 | 一种激光切割的收刀工艺 |
DE102018126106A1 (de) | 2018-10-19 | 2020-04-23 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zur Bestimmung eines Freischnittpunkts beim Trennen eines Werkstückteils von einem Restteil und Programmiereinrichtung hierfür |
DE102020131869A1 (de) * | 2020-12-01 | 2022-06-02 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laserschneidverfahren zum Ausschneiden eines Werkstückteils |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59144588A (ja) * | 1983-02-07 | 1984-08-18 | Amada Co Ltd | レ−ザ加工による積層金型の製作方法 |
JPS63104793A (ja) * | 1986-10-20 | 1988-05-10 | Canon Inc | レ−ザ切断方法 |
JP2518432B2 (ja) * | 1990-01-17 | 1996-07-24 | 三菱電機株式会社 | 鉄系厚板材のレ―ザ切断法 |
-
1993
- 1993-03-25 JP JP5065816A patent/JPH06269967A/ja not_active Withdrawn
-
1994
- 1994-03-17 KR KR1019940704225A patent/KR950701560A/ko not_active Ceased
- 1994-03-17 EP EP94910044A patent/EP0646434A1/en not_active Withdrawn
- 1994-03-17 WO PCT/JP1994/000443 patent/WO1994021417A1/ja not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190015290A (ko) * | 2016-06-10 | 2019-02-13 | 닛토덴코 가부시키가이샤 | 필름의 오려내기 방법 |
Also Published As
Publication number | Publication date |
---|---|
WO1994021417A1 (en) | 1994-09-29 |
EP0646434A1 (en) | 1995-04-05 |
JPH06269967A (ja) | 1994-09-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0105 | International application |
Patent event date: 19941124 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19941124 Comment text: Request for Examination of Application |
|
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19971121 Patent event code: PE09021S01D |
|
E601 | Decision to refuse application | ||
PE0601 | Decision on rejection of patent |
Patent event date: 19980327 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19971121 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |