KR950034652A - 정전척 - Google Patents

정전척 Download PDF

Info

Publication number
KR950034652A
KR950034652A KR1019950001027A KR19950001027A KR950034652A KR 950034652 A KR950034652 A KR 950034652A KR 1019950001027 A KR1019950001027 A KR 1019950001027A KR 19950001027 A KR19950001027 A KR 19950001027A KR 950034652 A KR950034652 A KR 950034652A
Authority
KR
South Korea
Prior art keywords
electrostatic chuck
titanium
less
insulating dielectric
nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1019950001027A
Other languages
English (en)
Korean (ko)
Inventor
히로시 모기
켄이치 아라이
신지 코지마
요시히로 쿠보타
Original Assignee
카나가와 치히로
신에쭈카가쿠코오교오 카부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 카나가와 치히로, 신에쭈카가쿠코오교오 카부시키가이샤 filed Critical 카나가와 치히로
Publication of KR950034652A publication Critical patent/KR950034652A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
KR1019950001027A 1994-04-26 1995-01-21 정전척 Ceased KR950034652A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP94-88390 1994-04-26
JP8839094A JPH07297265A (ja) 1994-04-26 1994-04-26 静電チャック

Publications (1)

Publication Number Publication Date
KR950034652A true KR950034652A (ko) 1995-12-28

Family

ID=13941474

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950001027A Ceased KR950034652A (ko) 1994-04-26 1995-01-21 정전척

Country Status (3)

Country Link
JP (1) JPH07297265A (https=)
KR (1) KR950034652A (https=)
TW (1) TW287314B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100522976B1 (ko) * 2000-06-07 2005-10-19 스미토모 오사카 세멘토 가부시키가이샤 정전 척

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09260474A (ja) * 1996-03-22 1997-10-03 Sony Corp 静電チャックおよびウエハステージ
CN1127750C (zh) 1996-12-27 2003-11-12 佳能株式会社 减少电荷的薄膜,图象形成装置及其制造方法
JP4236292B2 (ja) * 1997-03-06 2009-03-11 日本碍子株式会社 ウエハー吸着装置およびその製造方法
JPH11209182A (ja) * 1998-01-22 1999-08-03 Sumitomo Metal Ind Ltd プラズマ耐食部材
JPH11214491A (ja) * 1998-01-22 1999-08-06 Toshiba Ceramics Co Ltd ウエハ保持装置及びその製造方法
WO1999059201A1 (en) * 1998-05-11 1999-11-18 Applied Materials Inc Polished ceramic chuck for low backside particles in semiconductor plasma processing
EP1120829A4 (en) 1999-08-10 2009-05-27 Ibiden Co Ltd Semiconductor production device ceramic plate
JP4529690B2 (ja) * 2000-01-20 2010-08-25 住友電気工業株式会社 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置
JP2002057207A (ja) * 2000-01-20 2002-02-22 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置
JP4272786B2 (ja) * 2000-01-21 2009-06-03 トーカロ株式会社 静電チャック部材およびその製造方法
TWI254403B (en) 2000-05-19 2006-05-01 Ngk Insulators Ltd Electrostatic clamper, and electrostatic attracting structures
JP3693895B2 (ja) 2000-07-24 2005-09-14 住友大阪セメント株式会社 可撓性フィルムの静電吸着装置、可撓性フィルムの静電吸着方法、可撓性フィルムの表面処理方法
KR20020064508A (ko) * 2001-02-02 2002-08-09 삼성전자 주식회사 정전 척
JP4493251B2 (ja) 2001-12-04 2010-06-30 Ｔｏｔｏ株式会社 静電チャックモジュールおよび基板処理装置
DE10232080B4 (de) * 2002-07-15 2015-10-01 Integrated Dynamics Engineering Gmbh Elektrostatischer Greifer und Verfahren zu dessen Herstellung
US20070065678A1 (en) * 2003-10-09 2007-03-22 Ko Kyung-Hyun Electro-static chuck with non-sintered aln and a method of preparing the same
JP2007150351A (ja) * 2007-02-15 2007-06-14 Toto Ltd 静電チャック
JP5270310B2 (ja) * 2008-11-13 2013-08-21 東京エレクトロン株式会社 静電チャック及び基板処理装置
JP2010177698A (ja) * 2010-04-12 2010-08-12 Fujitsu Semiconductor Ltd 静電チャックの製造方法
JP2010166086A (ja) * 2010-04-12 2010-07-29 Fujitsu Semiconductor Ltd 静電チャックを用いた半導体製造装置
JP6038698B2 (ja) 2013-03-22 2016-12-07 日本碍子株式会社 セラミックス部材及び半導体製造装置用部材
KR101787931B1 (ko) 2013-11-29 2017-10-18 가부시끼가이샤 도시바 플라즈마 장치용 부품 및 그 제조 방법
WO2016042957A1 (ja) 2014-09-16 2016-03-24 日本碍子株式会社 セラミック構造体、基板保持装置用部材及びセラミック構造体の製法
WO2019163757A1 (ja) * 2018-02-20 2019-08-29 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
WO2020261992A1 (ja) 2019-06-28 2020-12-30 日本碍子株式会社 ウエハ載置台
WO2022014410A1 (ja) * 2020-07-13 2022-01-20 京セラ株式会社 試料保持具
CN119208237B (zh) * 2024-09-27 2025-07-18 广东精瓷新材料有限公司 一种高介电高击穿强度的静电卡盘及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100522976B1 (ko) * 2000-06-07 2005-10-19 스미토모 오사카 세멘토 가부시키가이샤 정전 척

Also Published As

Publication number Publication date
JPH07297265A (ja) 1995-11-10
TW287314B (https=) 1996-10-01

Similar Documents

Publication Publication Date Title
KR950034652A (ko) 정전척
KR890001180A (ko) 세라믹 패키지
KR910700533A (ko) 절연 전선
CA2403897A1 (en) Surface treated electrically conductive metal element and method of forming same
EP1435654A3 (en) Electrostatic chuck
MY116937A (en) Monolithic ceramic capacitor
CA2232425A1 (en) Functionally gradient material and its use in a semiconductor circuit substrate
EP2495732A3 (en) Conductive fine particles, method for plating fine particles, and substrate structure
DE3888261D1 (de) Beschichteter Verbundkörper aus hochschmelzenden Metallen.
EP1117273A3 (en) Ceramic heater
KR850006165A (ko) 세라믹 소결체
MY124033A (en) Multi layer ceramic electronic parts having pillar-likeceramic portions
KR970067544A (ko) 질화 규소 회로 기판 및 그 제조 방법
DE69801626D1 (de) Sinterkörper aus Aluminiumnitrid, elektronisches Funktionsmaterial und elektrostatische Einspannvorrichtung
EP1038853A3 (en) Ceramic sinter and wear resistant member and electronic member using thereof
ATE210820T1 (de) Sensorbauelement
CA2251875A1 (en) Aluminum nitride heater
ES2135666T3 (es) Elemento deslizante y procedimiento para su fabricacion.
EP1041586A3 (en) Chip thermistor
DE69923789D1 (de) Elektrisch leitende keramikschichten
SE9901827D0 (sv) Motståndselement
EP2272812A3 (en) Silicon carbide ceramic components having oxide layer
KR870009803A (ko) 방전가공기의 와이어 전극용 전원장치
JPS6441232A (en) Bonding capillary
EP0165584A3 (en) Sliding contact material

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000