JPS6441232A - Bonding capillary - Google Patents

Bonding capillary

Info

Publication number
JPS6441232A
JPS6441232A JP62197796A JP19779687A JPS6441232A JP S6441232 A JPS6441232 A JP S6441232A JP 62197796 A JP62197796 A JP 62197796A JP 19779687 A JP19779687 A JP 19779687A JP S6441232 A JPS6441232 A JP S6441232A
Authority
JP
Japan
Prior art keywords
capillary
wire
ceramic sintered
conductive ceramic
electric resistivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62197796A
Other languages
Japanese (ja)
Inventor
Koichiro Nakano
Masaru Sawairi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SERAMIKO KK
JFE Engineering Corp
Original Assignee
SERAMIKO KK
NKK Corp
Nippon Kokan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SERAMIKO KK, NKK Corp, Nippon Kokan Ltd filed Critical SERAMIKO KK
Priority to JP62197796A priority Critical patent/JPS6441232A/en
Publication of JPS6441232A publication Critical patent/JPS6441232A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0104—Zirconium [Zr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent causing of static electricity and to enable discharge processing at formation by forming a bonding capillary with conductive ceramic sintered material having an electric resistivity of 10<-3> to 100<-5>OMEGA.cm. CONSTITUTION:A wire through hole 3 is provided formed in body of a capillary 2 with a bonding wire 11 inserted countinuously therethrough. The wire 11 is guided to a bonding section 13. A material which has an electric resistivity of this range generates little static electricity and therefore scarcely causes dust contamination. Body of the capillary 2 is formed of conductive ceramic sintered material which has an electric resistivity of 10<-3> to 10<-5>OMEGA.cm. As for the conductive ceramic sintered material, carbide, nitride and/or boride of at least one element of titamium or zirconium can be selectively applied.
JP62197796A 1987-08-07 1987-08-07 Bonding capillary Pending JPS6441232A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62197796A JPS6441232A (en) 1987-08-07 1987-08-07 Bonding capillary

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62197796A JPS6441232A (en) 1987-08-07 1987-08-07 Bonding capillary

Publications (1)

Publication Number Publication Date
JPS6441232A true JPS6441232A (en) 1989-02-13

Family

ID=16380494

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62197796A Pending JPS6441232A (en) 1987-08-07 1987-08-07 Bonding capillary

Country Status (1)

Country Link
JP (1) JPS6441232A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268941A (en) * 1988-09-05 1990-03-08 Shinagawa Refract Co Ltd Wire-bonding capillary
JPH06314721A (en) * 1993-04-28 1994-11-08 Kyocera Corp Capillary for wire bonding
DE10162473A1 (en) * 2001-12-19 2003-07-10 Fag Kugelfischer Ag & Co Kg Rolling bearing in deep drilling device has alternating ceramic bearing balls and small steel separating balls

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0268941A (en) * 1988-09-05 1990-03-08 Shinagawa Refract Co Ltd Wire-bonding capillary
JPH06314721A (en) * 1993-04-28 1994-11-08 Kyocera Corp Capillary for wire bonding
DE10162473A1 (en) * 2001-12-19 2003-07-10 Fag Kugelfischer Ag & Co Kg Rolling bearing in deep drilling device has alternating ceramic bearing balls and small steel separating balls
DE10162473B4 (en) * 2001-12-19 2005-12-01 Fag Kugelfischer Ag & Co. Ohg Rolling bearings in deep drilling equipment

Similar Documents

Publication Publication Date Title
KR950034652A (en) An electrostatic chuck
AU554733B2 (en) Improvements in silicon carbide whisker composites
DE3687817D1 (en) SILICON CARBIDE INTERCARBUS WITH HIGH ELECTRIC RESISTANCE.
DE3477374D1 (en) Sintered silicon carbide/graphite/carbon composite ceramic body having ultrafine grain microstructure
IT8421480A0 (en) FLUOROPOLYETERS CONTAINING TERMINAL GROUPS EQUIPPED WITH ANCHOR PROPERTIES.
IT8520927A0 (en) CERAMIC MATERIAL WITH IMPROVED RESISTANCE PROPERTIES AND PROCEDURE FOR PREPARING IT.
KR870008493A (en) Mold for optical substrate molding
EP0587119A3 (en) High thermal conductive silicon nitride sintered body and method of producing the same.
SE8602750D0 (en) Laminated ceramic sinter body
DE3572469D1 (en) High toughness silicon nitride sintered body and process for producing the same
EP0159186A3 (en) Method manufacturing high-strength sintered silicon carbide articles
CA2046629A1 (en) Long lasting electrical discharge machine wire guide
KR970703214A (en) Cutting Insert with a Threaded Central Aperture
DE3576683D1 (en) CERAMIC MOLDED BODY.
EP0367562A3 (en) Electrically conductive silicone compositions
JPS6441232A (en) Bonding capillary
EP0195353A3 (en) Hollow ceramic fibers
Knehans et al. Effect of grain size on the crack resistance curves of Al 2 O 3 bend specimens
JPS57196772A (en) Manufacture of sintered silicon carbide ceramic formed body
DE3579427D1 (en) REDUCTION RESISTANT SEMICONDUCTOR PORCELAIN WITH POSITIVE TEMPERATURE COEFFICIENT OF THE RESISTANCE.
ZA854003B (en) Sintered silicon carbide/carbon composite ceramic body having ultrafine grain microstructure
EP0914022A3 (en) Aluminum nitride heater
DE3777913D1 (en) CERAMIC COMPOSITION WITH IMPROVED ELECTRICAL AND MECHANICAL PROPERTIES.
AUPP798898A0 (en) Electrically conductive ceramics
JPS54144411A (en) Alphaasilicon carbide sintered ceramic body having isometric micro structure