KR950034640A - 반도체 디바이스를 조작하여 테스트하기 위한 초음파 용접 플라스틱 지지 링 - Google Patents

반도체 디바이스를 조작하여 테스트하기 위한 초음파 용접 플라스틱 지지 링 Download PDF

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Publication number
KR950034640A
KR950034640A KR1019950004485A KR19950004485A KR950034640A KR 950034640 A KR950034640 A KR 950034640A KR 1019950004485 A KR1019950004485 A KR 1019950004485A KR 19950004485 A KR19950004485 A KR 19950004485A KR 950034640 A KR950034640 A KR 950034640A
Authority
KR
South Korea
Prior art keywords
support ring
lead
lead frame
plated copper
gold plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
KR1019950004485A
Other languages
English (en)
Korean (ko)
Inventor
엔. 맥렐란 로버트
엠. 치우 안토니
제이. 헌트 폴
케이. 데니스 윌리엄
Original Assignee
윌리엄 이. 힐러
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윌리엄 이. 힐러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 이. 힐러
Publication of KR950034640A publication Critical patent/KR950034640A/ko
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1019950004485A 1994-03-07 1995-03-06 반도체 디바이스를 조작하여 테스트하기 위한 초음파 용접 플라스틱 지지 링 Abandoned KR950034640A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US8/206,814 1994-03-07
US08/206,814 US5661900A (en) 1994-03-07 1994-03-07 Method of fabricating an ultrasonically welded plastic support ring

Publications (1)

Publication Number Publication Date
KR950034640A true KR950034640A (ko) 1995-12-28

Family

ID=22768088

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950004485A Abandoned KR950034640A (ko) 1994-03-07 1995-03-06 반도체 디바이스를 조작하여 테스트하기 위한 초음파 용접 플라스틱 지지 링

Country Status (5)

Country Link
US (1) US5661900A (https=)
EP (1) EP0671763A3 (https=)
JP (1) JPH07302822A (https=)
KR (1) KR950034640A (https=)
TW (1) TW269739B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6071759A (en) * 1996-07-15 2000-06-06 Matsushita Electronics Corporation Method for manufacturing semiconductor apparatus
DE19632094A1 (de) * 1996-08-08 1998-02-12 Siemens Ag Waferrahmen
JPH10303352A (ja) * 1997-04-22 1998-11-13 Toshiba Corp 半導体装置および半導体装置の製造方法
US20020011909A1 (en) * 2000-07-31 2002-01-31 Delta Electronics, Inc. Method for packing electronic device by interconnecting frame body and frame leads with insulating block and its packing structure
US9827729B2 (en) 2012-05-25 2017-11-28 Phoenix Packaging Operations, LLC Food container top with integrally formed utensil

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same
US3436810A (en) * 1967-07-17 1969-04-08 Jade Corp Method of packaging integrated circuits
US3711625A (en) * 1971-03-31 1973-01-16 Microsystems Int Ltd Plastic support means for lead frame ends
FR2476960A1 (fr) * 1980-02-26 1981-08-28 Thomson Csf Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede
JPS59149042A (ja) * 1983-02-15 1984-08-25 Hitachi Cable Ltd 半導体用リ−ドフレ−ム
US4837184A (en) * 1988-01-04 1989-06-06 Motorola Inc. Process of making an electronic device package with peripheral carrier structure of low-cost plastic
JPH03136267A (ja) * 1989-10-20 1991-06-11 Texas Instr Japan Ltd 半導体装置及びその製造方法
JPH046859A (ja) * 1990-04-24 1992-01-10 Sony Corp 樹脂封止型半導体装置
GB9018764D0 (en) * 1990-08-28 1990-10-10 Lsi Logic Europ Packaging of electronic devices
JP2516709B2 (ja) * 1990-11-27 1996-07-24 住友金属鉱山株式会社 複合リ―ドフレ―ム
US5132773A (en) * 1991-02-06 1992-07-21 Olin Corporation Carrier ring having first and second ring means with bonded surfaces
US5177591A (en) * 1991-08-20 1993-01-05 Emanuel Norbert T Multi-layered fluid soluble alignment bars
US5352633A (en) * 1992-06-02 1994-10-04 Texas Instruments Incorporated Semiconductor lead frame lead stabilization

Also Published As

Publication number Publication date
US5661900A (en) 1997-09-02
EP0671763A3 (en) 1997-04-09
JPH07302822A (ja) 1995-11-14
TW269739B (https=) 1996-02-01
EP0671763A2 (en) 1995-09-13

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PC1904 Unpaid initial registration fee

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