KR950034587A - 기판 및 산화 갈륨 박막을 구비한 구조물 제조 공정 - Google Patents
기판 및 산화 갈륨 박막을 구비한 구조물 제조 공정 Download PDFInfo
- Publication number
- KR950034587A KR950034587A KR1019950004863A KR19950004863A KR950034587A KR 950034587 A KR950034587 A KR 950034587A KR 1019950004863 A KR1019950004863 A KR 1019950004863A KR 19950004863 A KR19950004863 A KR 19950004863A KR 950034587 A KR950034587 A KR 950034587A
- Authority
- KR
- South Korea
- Prior art keywords
- thin film
- substrate
- temperature
- semiconductor
- torr
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- H10P14/60—
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- H10D64/011—
-
- H10D64/01358—
-
- H10P14/6332—
-
- H10P14/6939—
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- H10W20/48—
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
- Semiconductor Lasers (AREA)
- Inorganic Insulating Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US217,296 | 1994-03-23 | ||
| US08/217,296 US5451548A (en) | 1994-03-23 | 1994-03-23 | Electron beam deposition of gallium oxide thin films using a single high purity crystal source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR950034587A true KR950034587A (ko) | 1995-12-28 |
Family
ID=22810461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950004863A Withdrawn KR950034587A (ko) | 1994-03-23 | 1995-03-10 | 기판 및 산화 갈륨 박막을 구비한 구조물 제조 공정 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5451548A (cg-RX-API-DMAC10.html) |
| EP (1) | EP0674344A3 (cg-RX-API-DMAC10.html) |
| JP (1) | JP3299657B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR950034587A (cg-RX-API-DMAC10.html) |
| CA (1) | CA2136581C (cg-RX-API-DMAC10.html) |
| TW (1) | TW266330B (cg-RX-API-DMAC10.html) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5550089A (en) * | 1994-03-23 | 1996-08-27 | Lucent Technologies Inc. | Gallium oxide coatings for optoelectronic devices using electron beam evaporation of a high purity single crystal Gd3 Ga5 O12 source. |
| US5962883A (en) * | 1994-03-23 | 1999-10-05 | Lucent Technologies Inc. | Article comprising an oxide layer on a GaAs-based semiconductor body |
| US5912498A (en) * | 1997-10-10 | 1999-06-15 | Lucent Technologies Inc. | Article comprising an oxide layer on GAN |
| DE4428155C2 (de) * | 1994-08-09 | 1996-12-19 | Siemens Ag | Verfahren zur Herstellung eines Gassensors |
| US5597768A (en) * | 1996-03-21 | 1997-01-28 | Motorola, Inc. | Method of forming a Ga2 O3 dielectric layer |
| US5665658A (en) * | 1996-03-21 | 1997-09-09 | Motorola | Method of forming a dielectric layer structure |
| US5903037A (en) * | 1997-02-24 | 1999-05-11 | Lucent Technologies Inc. | GaAs-based MOSFET, and method of making same |
| US6030453A (en) * | 1997-03-04 | 2000-02-29 | Motorola, Inc. | III-V epitaxial wafer production |
| US5904553A (en) * | 1997-08-25 | 1999-05-18 | Motorola, Inc. | Fabrication method for a gate quality oxide-compound semiconductor structure |
| US6025281A (en) * | 1997-12-18 | 2000-02-15 | Motorola, Inc. | Passivation of oxide-compound semiconductor interfaces |
| US6159834A (en) * | 1998-02-12 | 2000-12-12 | Motorola, Inc. | Method of forming a gate quality oxide-compound semiconductor structure |
| US5945718A (en) * | 1998-02-12 | 1999-08-31 | Motorola Inc. | Self-aligned metal-oxide-compound semiconductor device and method of fabrication |
| US6094295A (en) * | 1998-02-12 | 2000-07-25 | Motorola, Inc. | Ultraviolet transmitting oxide with metallic oxide phase and method of fabrication |
| US6495407B1 (en) | 1998-09-18 | 2002-12-17 | Agere Systems Inc. | Method of making an article comprising an oxide layer on a GaAs-based semiconductor body |
| SG85604A1 (en) * | 1998-11-06 | 2002-01-15 | Inst Materials Research & Eng | Method of selective post-growth tuning of an optical bandgap of a semi-conductor heterostructure and products produced thereof |
| US6521961B1 (en) | 2000-04-28 | 2003-02-18 | Motorola, Inc. | Semiconductor device using a barrier layer between the gate electrode and substrate and method therefor |
| US6445015B1 (en) | 2000-05-04 | 2002-09-03 | Osemi, Incorporated | Metal sulfide semiconductor transistor devices |
| US6936900B1 (en) * | 2000-05-04 | 2005-08-30 | Osemi, Inc. | Integrated transistor devices |
| US6670651B1 (en) | 2000-05-04 | 2003-12-30 | Osemi, Inc. | Metal sulfide-oxide semiconductor transistor devices |
| US6451711B1 (en) * | 2000-05-04 | 2002-09-17 | Osemi, Incorporated | Epitaxial wafer apparatus |
| US7442654B2 (en) * | 2002-01-18 | 2008-10-28 | Freescale Semiconductor, Inc. | Method of forming an oxide layer on a compound semiconductor structure |
| AU2003217189A1 (en) * | 2002-01-22 | 2003-09-02 | Massachusetts Institute Of Technology | A method of fabrication for iii-v semiconductor surface passivation |
| US7326446B2 (en) * | 2002-04-15 | 2008-02-05 | Schott Ag | Method for coating metal surfaces and substrate having a coated metal surface |
| US6989556B2 (en) * | 2002-06-06 | 2006-01-24 | Osemi, Inc. | Metal oxide compound semiconductor integrated transistor devices with a gate insulator structure |
| US7187045B2 (en) * | 2002-07-16 | 2007-03-06 | Osemi, Inc. | Junction field effect metal oxide compound semiconductor integrated transistor devices |
| JP3763021B2 (ja) * | 2003-05-26 | 2006-04-05 | 学校法人関西学院 | 電子ビーム微細加工方法 |
| US20070138506A1 (en) * | 2003-11-17 | 2007-06-21 | Braddock Walter D | Nitride metal oxide semiconductor integrated transistor devices |
| US20080282983A1 (en) * | 2003-12-09 | 2008-11-20 | Braddock Iv Walter David | High Temperature Vacuum Evaporation Apparatus |
| US7223441B2 (en) * | 2004-03-10 | 2007-05-29 | Pilkington North America, Inc. | Method for depositing gallium oxide coatings on flat glass |
| JP2007134445A (ja) * | 2005-11-09 | 2007-05-31 | Nichia Chem Ind Ltd | 窒化物半導体レーザ素子 |
| US7483212B2 (en) * | 2006-10-11 | 2009-01-27 | Rensselaer Polytechnic Institute | Optical thin film, semiconductor light emitting device having the same and methods of fabricating the same |
| JP3950473B2 (ja) * | 2006-11-06 | 2007-08-01 | シャープ株式会社 | 化合物半導体レーザ |
| US20080157073A1 (en) * | 2006-12-29 | 2008-07-03 | Walter David Braddock | Integrated Transistor Devices |
| DE102008020793A1 (de) | 2008-04-22 | 2009-11-05 | Forschungsverbund Berlin E.V. | Halbleiterbauelement, Vorprodukt und Verfahren zur Herstellung |
| KR101881729B1 (ko) * | 2010-04-16 | 2018-07-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 성막 방법 및 반도체 장치를 제작하기 위한 방법 |
| WO2011158704A1 (en) * | 2010-06-18 | 2011-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA920285A (en) * | 1970-11-30 | 1973-01-30 | L. Hartman Robert | Extending the operating life of light emitting p-n junction devices |
| US4617192A (en) * | 1982-12-21 | 1986-10-14 | At&T Bell Laboratories | Process for making optical INP devices |
| US4749255A (en) * | 1985-12-09 | 1988-06-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Coating for optical devices |
| DE4321301A1 (de) * | 1992-07-06 | 1994-01-13 | Zeiss Carl Fa | Dünne Schicht aus Galliumoxid und Herstellverfahren dafür |
-
1994
- 1994-03-23 US US08/217,296 patent/US5451548A/en not_active Expired - Lifetime
- 1994-11-22 TW TW083110877A patent/TW266330B/zh not_active IP Right Cessation
- 1994-11-24 CA CA002136581A patent/CA2136581C/en not_active Expired - Fee Related
-
1995
- 1995-03-10 KR KR1019950004863A patent/KR950034587A/ko not_active Withdrawn
- 1995-03-16 EP EP95301750A patent/EP0674344A3/en not_active Withdrawn
- 1995-03-23 JP JP06371295A patent/JP3299657B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CA2136581A1 (en) | 1995-09-24 |
| US5451548A (en) | 1995-09-19 |
| JP3299657B2 (ja) | 2002-07-08 |
| TW266330B (cg-RX-API-DMAC10.html) | 1995-12-21 |
| JPH07268609A (ja) | 1995-10-17 |
| EP0674344A3 (en) | 1996-10-16 |
| CA2136581C (en) | 1998-08-04 |
| EP0674344A2 (en) | 1995-09-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |