KR950010182U - 반도체 코팅장비의 웨이퍼 후면 잔류 세척액 건조장치 - Google Patents

반도체 코팅장비의 웨이퍼 후면 잔류 세척액 건조장치

Info

Publication number
KR950010182U
KR950010182U KR2019930017677U KR930017677U KR950010182U KR 950010182 U KR950010182 U KR 950010182U KR 2019930017677 U KR2019930017677 U KR 2019930017677U KR 930017677 U KR930017677 U KR 930017677U KR 950010182 U KR950010182 U KR 950010182U
Authority
KR
South Korea
Prior art keywords
wafer
cleaning liquid
drying device
coating equipment
semiconductor coating
Prior art date
Application number
KR2019930017677U
Other languages
English (en)
Other versions
KR970000385Y1 (ko
Inventor
장종환
Original Assignee
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 금성일렉트론 주식회사 filed Critical 금성일렉트론 주식회사
Priority to KR2019930017677U priority Critical patent/KR970000385Y1/ko
Publication of KR950010182U publication Critical patent/KR950010182U/ko
Application granted granted Critical
Publication of KR970000385Y1 publication Critical patent/KR970000385Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019930017677U 1993-09-06 1993-09-06 반도체 코팅장비의 웨이퍼 후면 잔류 세척액 건조장치 KR970000385Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930017677U KR970000385Y1 (ko) 1993-09-06 1993-09-06 반도체 코팅장비의 웨이퍼 후면 잔류 세척액 건조장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930017677U KR970000385Y1 (ko) 1993-09-06 1993-09-06 반도체 코팅장비의 웨이퍼 후면 잔류 세척액 건조장치

Publications (2)

Publication Number Publication Date
KR950010182U true KR950010182U (ko) 1995-04-24
KR970000385Y1 KR970000385Y1 (ko) 1997-01-17

Family

ID=19362875

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930017677U KR970000385Y1 (ko) 1993-09-06 1993-09-06 반도체 코팅장비의 웨이퍼 후면 잔류 세척액 건조장치

Country Status (1)

Country Link
KR (1) KR970000385Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100886366B1 (ko) * 2007-08-08 2009-03-03 한국산업기술대학교산학협력단 소형 바이오 칩 세정 및 건조용 마이크로 스핀 프로세서장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015551B1 (ko) * 2008-07-24 2011-02-17 세크론 주식회사 프로버용 웨이퍼 로딩장치 및 이를 이용한 프로버용 웨이퍼로딩방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100886366B1 (ko) * 2007-08-08 2009-03-03 한국산업기술대학교산학협력단 소형 바이오 칩 세정 및 건조용 마이크로 스핀 프로세서장치

Also Published As

Publication number Publication date
KR970000385Y1 (ko) 1997-01-17

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Legal Events

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FPAY Annual fee payment

Payment date: 20071025

Year of fee payment: 11

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