KR950021389U - 반도체 웨이퍼의 파티클 제거장치 - Google Patents

반도체 웨이퍼의 파티클 제거장치

Info

Publication number
KR950021389U
KR950021389U KR2019930028200U KR930028200U KR950021389U KR 950021389 U KR950021389 U KR 950021389U KR 2019930028200 U KR2019930028200 U KR 2019930028200U KR 930028200 U KR930028200 U KR 930028200U KR 950021389 U KR950021389 U KR 950021389U
Authority
KR
South Korea
Prior art keywords
semiconductor wafer
removal device
particle removal
wafer particle
semiconductor
Prior art date
Application number
KR2019930028200U
Other languages
English (en)
Other versions
KR200158118Y1 (ko
Inventor
김춘환
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019930028200U priority Critical patent/KR200158118Y1/ko
Publication of KR950021389U publication Critical patent/KR950021389U/ko
Application granted granted Critical
Publication of KR200158118Y1 publication Critical patent/KR200158118Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019930028200U 1993-12-17 1993-12-17 반도체 웨이퍼의 파티클 제거장치 KR200158118Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930028200U KR200158118Y1 (ko) 1993-12-17 1993-12-17 반도체 웨이퍼의 파티클 제거장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930028200U KR200158118Y1 (ko) 1993-12-17 1993-12-17 반도체 웨이퍼의 파티클 제거장치

Publications (2)

Publication Number Publication Date
KR950021389U true KR950021389U (ko) 1995-07-28
KR200158118Y1 KR200158118Y1 (ko) 1999-10-15

Family

ID=19371407

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930028200U KR200158118Y1 (ko) 1993-12-17 1993-12-17 반도체 웨이퍼의 파티클 제거장치

Country Status (1)

Country Link
KR (1) KR200158118Y1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790273B1 (ko) * 2003-12-12 2007-12-31 동부일렉트로닉스 주식회사 펜슬 스펀지 클리닝 장치 및 그 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100790273B1 (ko) * 2003-12-12 2007-12-31 동부일렉트로닉스 주식회사 펜슬 스펀지 클리닝 장치 및 그 방법

Also Published As

Publication number Publication date
KR200158118Y1 (ko) 1999-10-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20050621

Year of fee payment: 7

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