KR950009624B1 - 방열부를 갖는 반도체장치 및 그 제조방법 - Google Patents

방열부를 갖는 반도체장치 및 그 제조방법 Download PDF

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Publication number
KR950009624B1
KR950009624B1 KR1019920004516A KR920004516A KR950009624B1 KR 950009624 B1 KR950009624 B1 KR 950009624B1 KR 1019920004516 A KR1019920004516 A KR 1019920004516A KR 920004516 A KR920004516 A KR 920004516A KR 950009624 B1 KR950009624 B1 KR 950009624B1
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KR
South Korea
Prior art keywords
resin
semiconductor device
stage
heat dissipation
package portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019920004516A
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English (en)
Korean (ko)
Other versions
KR920018912A (ko
Inventor
미찌오 소노
준이찌 가사이
Original Assignee
후지쓰 가부시끼가이샤
세끼자와 다다시
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 후지쓰 가부시끼가이샤, 세끼자와 다다시 filed Critical 후지쓰 가부시끼가이샤
Publication of KR920018912A publication Critical patent/KR920018912A/ko
Application granted granted Critical
Publication of KR950009624B1 publication Critical patent/KR950009624B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019920004516A 1991-03-20 1992-03-19 방열부를 갖는 반도체장치 및 그 제조방법 Expired - Fee Related KR950009624B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3057314A JPH04291948A (ja) 1991-03-20 1991-03-20 半導体装置及びその製造方法及び放熱フィン
JP91-057314 1991-03-20

Publications (2)

Publication Number Publication Date
KR920018912A KR920018912A (ko) 1992-10-22
KR950009624B1 true KR950009624B1 (ko) 1995-08-25

Family

ID=13052109

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920004516A Expired - Fee Related KR950009624B1 (ko) 1991-03-20 1992-03-19 방열부를 갖는 반도체장치 및 그 제조방법

Country Status (5)

Country Link
US (2) US5296740A (enExample)
EP (1) EP0506509B1 (enExample)
JP (1) JPH04291948A (enExample)
KR (1) KR950009624B1 (enExample)
DE (1) DE69222340T2 (enExample)

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JPH04291948A (ja) * 1991-03-20 1992-10-16 Fujitsu Ltd 半導体装置及びその製造方法及び放熱フィン
JPH0677354A (ja) * 1992-08-24 1994-03-18 Hitachi Ltd 半導体装置
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5880403A (en) 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
JPH0722722A (ja) * 1993-07-05 1995-01-24 Mitsubishi Electric Corp 樹脂成形タイプの電子回路装置
US5783134A (en) * 1994-01-13 1998-07-21 Citizen Watch Co., Ltd. Method of resin-sealing semiconductor device
US6261508B1 (en) * 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
DE4419060A1 (de) * 1994-05-31 1995-12-07 Siemens Ag Einrichtung zum Kühlen eines IC
JP3487524B2 (ja) * 1994-12-20 2004-01-19 株式会社ルネサステクノロジ 半導体装置及びその製造方法
US6208513B1 (en) 1995-01-17 2001-03-27 Compaq Computer Corporation Independently mounted cooling fins for a low-stress semiconductor package
US6339875B1 (en) 1996-04-08 2002-01-22 Heat Technology, Inc. Method for removing heat from an integrated circuit
TW392315B (en) * 1996-12-03 2000-06-01 Nippon Electric Co Boards mounting with chips, mounting structure of chips, and manufacturing method for boards mounting with chips
JP2907186B2 (ja) * 1997-05-19 1999-06-21 日本電気株式会社 半導体装置、その製造方法
KR100343221B1 (ko) * 1999-11-09 2002-07-10 윤종용 미세구조의 냉각핀을 가지는 냉각장치
US6377219B2 (en) 2000-01-11 2002-04-23 Cool Options, Inc. Composite molded antenna assembly
US6680015B2 (en) * 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
US6368899B1 (en) * 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6851869B2 (en) * 2000-08-04 2005-02-08 Cool Options, Inc. Highly thermally conductive electronic connector
US7273769B1 (en) * 2000-08-16 2007-09-25 Micron Technology, Inc. Method and apparatus for removing encapsulating material from a packaged microelectronic device
US6585925B2 (en) 2000-12-27 2003-07-01 Intel Corporation Process for forming molded heat dissipation devices
US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
US6756005B2 (en) * 2001-08-24 2004-06-29 Cool Shield, Inc. Method for making a thermally conductive article having an integrated surface and articles produced therefrom
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
CA2464153A1 (en) * 2003-04-14 2004-10-14 Integral Technologies, Inc. Low cost lighting circuits manufactured from conductive loaded resin-based materials
US20040218363A1 (en) * 2003-04-30 2004-11-04 Wong Marvin Glenn Application specific heat-dissipating apparatus that provides electrical isolation for components
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
EP1668698A1 (de) * 2003-09-29 2006-06-14 Siemens Aktiengesellschaft Plastisch verformbarer kühlkörper für elektrische und/oder elektronische bauelemente
DE10352705A1 (de) * 2003-11-12 2005-06-23 Diehl Bgt Defence Gmbh & Co. Kg Schaltungsanordnung
CN100405587C (zh) * 2003-11-22 2008-07-23 鸿富锦精密工业（深圳）有限公司 散热器及其制备方法
JP5165207B2 (ja) 2006-03-29 2013-03-21 オンセミコンダクター・トレーディング・リミテッド 半導体装置の製造方法
US20080047141A1 (en) * 2006-08-08 2008-02-28 Inventec Corporation Method for fabricating supporting column of heat sink
US7468886B2 (en) * 2007-03-05 2008-12-23 International Business Machines Corporation Method and structure to improve thermal dissipation from semiconductor devices
JP5096782B2 (ja) * 2007-04-19 2012-12-12 ルネサスエレクトロニクス株式会社 半導体装置
JP2009188720A (ja) * 2008-02-06 2009-08-20 Panasonic Corp 固体撮像装置およびその製造方法
DE102009045063C5 (de) 2009-09-28 2017-06-01 Infineon Technologies Ag Leistungshalbleitermodul mit angespritztem Kühlkörper, Leistungshalbleitermodulsystem und Verfahren zur Herstellung eines Leistungshalbleitermoduls
JP5523299B2 (ja) * 2010-12-20 2014-06-18 株式会社日立製作所 パワーモジュール
KR20130026062A (ko) * 2011-09-05 2013-03-13 삼성전자주식회사 인쇄회로기판 조립체 및 그 제조방법
US9263412B2 (en) 2012-03-09 2016-02-16 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging methods and packaged semiconductor devices
US20130234317A1 (en) * 2012-03-09 2013-09-12 Taiwan Semiconductor Manufacturing Company, Ltd. Packaging Methods and Packaged Semiconductor Devices
DE102012222679A1 (de) * 2012-12-10 2014-06-12 Robert Bosch Gmbh Verfahren zur Herstellung eines Schaltmoduls und eines zugehörigen Gittermoduls sowie ein zugehöriges Gittermodul und korrespondierende elektronische Baugruppe
US11604035B2 (en) * 2013-09-29 2023-03-14 Huawei Technologies Co., Ltd. Support plateheat dissipation apparatus
DE102015120100B4 (de) * 2015-11-19 2023-12-07 Danfoss Silicon Power Gmbh Elektronisches Modul, Verfahren zur Herstellung eines elektronischen Moduls und Zusammenstellung von übereinandergestapelten elektronischen Modulen
JP7039908B2 (ja) * 2017-09-26 2022-03-23 株式会社デンソー 半導体装置

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JPS5588358A (en) * 1978-12-27 1980-07-04 Hitachi Ltd Resin-sealed semiconductor device
JPS58100447A (ja) * 1981-12-11 1983-06-15 Hitachi Ltd 樹脂封止型半導体装置およびその製造方法
US4835598A (en) * 1985-06-13 1989-05-30 Matsushita Electric Works, Ltd. Wiring board
US5108955A (en) * 1988-10-27 1992-04-28 Citizen Watch Co., Ltd. Method of making a resin encapsulated pin grid array with integral heatsink
US5179039A (en) * 1988-02-05 1993-01-12 Citizen Watch Co., Ltd. Method of making a resin encapsulated pin grid array with integral heatsink
US4884631A (en) * 1988-03-17 1989-12-05 California Institute Of Technology Forced air heat sink apparatus
US5151777A (en) * 1989-03-03 1992-09-29 Delco Electronics Corporation Interface device for thermally coupling an integrated circuit to a heat sink
US5057903A (en) * 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
US5147821A (en) * 1990-09-28 1992-09-15 Motorola, Inc. Method for making a thermally enhanced semiconductor device by holding a leadframe against a heatsink through vacuum suction in a molding operation
IT1247649B (it) * 1990-10-31 1994-12-28 Sgs Thomson Microelectronics Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo
US5254500A (en) * 1991-02-05 1993-10-19 Advanced Micro Devices, Inc. Method for making an integrally molded semiconductor device heat sink
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US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block

Also Published As

Publication number Publication date
EP0506509A2 (en) 1992-09-30
DE69222340D1 (de) 1997-10-30
EP0506509B1 (en) 1997-09-24
EP0506509A3 (enExample) 1995-02-01
KR920018912A (ko) 1992-10-22
JPH04291948A (ja) 1992-10-16
US5424251A (en) 1995-06-13
US5296740A (en) 1994-03-22
DE69222340T2 (de) 1998-01-29

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