KR950009146B1 - 개선된 금속 가공용 다이 성형구 및 그 성형구를 이용한 가공편의 가공 방법 - Google Patents
개선된 금속 가공용 다이 성형구 및 그 성형구를 이용한 가공편의 가공 방법 Download PDFInfo
- Publication number
- KR950009146B1 KR950009146B1 KR1019920002014A KR920002014A KR950009146B1 KR 950009146 B1 KR950009146 B1 KR 950009146B1 KR 1019920002014 A KR1019920002014 A KR 1019920002014A KR 920002014 A KR920002014 A KR 920002014A KR 950009146 B1 KR950009146 B1 KR 950009146B1
- Authority
- KR
- South Korea
- Prior art keywords
- die
- substrate
- coating
- predetermined shape
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/20—Making tools by operations not covered by a single other subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
- B21J13/00—Details of machines for forging, pressing, or hammering
- B21J13/02—Dies or mountings therefor
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/0427—Coating with only one layer of a composition containing a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Metallurgy (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Physical Vapour Deposition (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US654,868 | 1991-02-12 | ||
| US07/654,868 US5143747A (en) | 1991-02-12 | 1991-02-12 | Die improved tooling for metal working |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR920016160A KR920016160A (ko) | 1992-09-24 |
| KR950009146B1 true KR950009146B1 (ko) | 1995-08-16 |
Family
ID=24626570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019920002014A Expired - Fee Related KR950009146B1 (ko) | 1991-02-12 | 1992-02-12 | 개선된 금속 가공용 다이 성형구 및 그 성형구를 이용한 가공편의 가공 방법 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5143747A (https=) |
| EP (2) | EP0694353A2 (https=) |
| JP (2) | JPH0557378A (https=) |
| KR (1) | KR950009146B1 (https=) |
| CA (1) | CA2060952C (https=) |
| DE (1) | DE69218481T2 (https=) |
| IL (1) | IL100911A (https=) |
| MX (1) | MX9200610A (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL100910A (en) * | 1991-02-12 | 1994-10-07 | Hughes Aircraft Co | Assessment of the degree of wear of objects |
| CA2130167C (en) * | 1993-08-27 | 1999-07-20 | Jesse N. Matossian | Nondestructive determination of plasma processing treatment |
| AU2207897A (en) * | 1996-03-11 | 1997-10-01 | Eli Lilly And Company | Methods of treating or preventing interstitial cystitis |
| FR2797039B1 (fr) | 1999-07-27 | 2001-10-12 | Ziepack | Echangeur de chaleur en module d'echange s'y rapportant |
| DE10155233A1 (de) * | 2001-11-09 | 2003-05-22 | Volkswagen Ag | Werkzeug aus Kunststoff |
| DE112009002023T5 (de) * | 2008-08-19 | 2011-06-30 | Lintec Corp. | Geformter Gegenstand, Verfahren zur Herstellung desselben, elektronisches Vorrichtungsteil und elektronische Vorrichtung |
| WO2010067857A1 (ja) * | 2008-12-12 | 2010-06-17 | リンテック株式会社 | 積層体、その製造方法、電子デバイス部材および電子デバイス |
| TWI491500B (zh) * | 2009-02-16 | 2015-07-11 | Lintec Corp | A manufacturing method of a laminated body, a structure for an electronic device, and an electronic device |
| JP5379530B2 (ja) | 2009-03-26 | 2013-12-25 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材および電子デバイス |
| JP5704610B2 (ja) | 2009-05-22 | 2015-04-22 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材および電子デバイス |
| JP5697230B2 (ja) | 2010-03-31 | 2015-04-08 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材及び電子デバイス |
| WO2012023389A1 (ja) | 2010-08-20 | 2012-02-23 | リンテック株式会社 | 成形体、その製造方法、電子デバイス用部材及び電子デバイス |
| TWI457235B (zh) | 2010-09-21 | 2014-10-21 | Lintec Corp | A gas barrier film, a manufacturing method thereof, an electronic device element, and an electronic device |
| TWI535561B (zh) | 2010-09-21 | 2016-06-01 | 琳得科股份有限公司 | A molded body, a manufacturing method thereof, an electronic device element, and an electronic device |
| JP2018524201A (ja) * | 2015-05-19 | 2018-08-30 | コーニング インコーポレイテッド | シートをキャリアと結合するための物品および方法 |
| US11905201B2 (en) | 2015-06-26 | 2024-02-20 | Corning Incorporated | Methods and articles including a sheet and a carrier |
| TW202216444A (zh) | 2016-08-30 | 2022-05-01 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
| TWI810161B (zh) | 2016-08-31 | 2023-08-01 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
| CN111372772A (zh) | 2017-08-18 | 2020-07-03 | 康宁股份有限公司 | 使用聚阳离子聚合物的临时结合 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137168B2 (https=) * | 1972-12-29 | 1976-10-14 | ||
| GB1555802A (en) * | 1976-01-28 | 1979-11-14 | Atomic Energy Authority Uk | Metalworking tool elements |
| DE3112225C2 (de) * | 1981-03-27 | 1983-12-29 | Bayerische Motoren Werke AG, 8000 München | Verfahren zum Herstellen von Formwerkzeugen |
| JPS5887818A (ja) * | 1981-11-19 | 1983-05-25 | Mitsubishi Electric Corp | 薄膜形成法 |
| US4446169A (en) * | 1982-09-16 | 1984-05-01 | Westinghouse Electric Corp. | Method for making silicon carbide coatings |
| US4623400A (en) * | 1985-02-22 | 1986-11-18 | Procedyne Corp. | Hard surface coatings for metals in fluidized beds |
| GB8619775D0 (en) * | 1986-08-14 | 1986-09-24 | Millspin Ltd | Ion beam dosimetry |
| US4764394A (en) * | 1987-01-20 | 1988-08-16 | Wisconsin Alumni Research Foundation | Method and apparatus for plasma source ion implantation |
| JPH01306559A (ja) * | 1988-06-01 | 1989-12-11 | Ryobi Ltd | 窒化層を有する金属基複合材 |
| JPH0280557A (ja) * | 1988-09-17 | 1990-03-20 | Sumitomo Metal Ind Ltd | Zn−Al系超塑性合金製金型の製造方法 |
| DE3907857C1 (en) * | 1989-03-10 | 1990-05-23 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De | Method for preparing a layer of amorphous silicon carbide |
| JPH02303637A (ja) * | 1989-05-18 | 1990-12-17 | Agency Of Ind Science & Technol | 成形用金型およびその製法 |
-
1991
- 1991-02-12 US US07/654,868 patent/US5143747A/en not_active Expired - Lifetime
-
1992
- 1992-02-10 IL IL10091192A patent/IL100911A/en not_active IP Right Cessation
- 1992-02-10 CA CA002060952A patent/CA2060952C/en not_active Expired - Fee Related
- 1992-02-11 EP EP95115734A patent/EP0694353A2/en not_active Withdrawn
- 1992-02-11 DE DE69218481T patent/DE69218481T2/de not_active Expired - Fee Related
- 1992-02-11 EP EP92102234A patent/EP0499197B1/en not_active Expired - Lifetime
- 1992-02-12 KR KR1019920002014A patent/KR950009146B1/ko not_active Expired - Fee Related
- 1992-02-12 JP JP4025456A patent/JPH0557378A/ja active Pending
- 1992-02-12 MX MX9200610A patent/MX9200610A/es unknown
-
1995
- 1995-08-22 JP JP7213794A patent/JPH0857560A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR920016160A (ko) | 1992-09-24 |
| EP0499197A3 (en) | 1993-06-23 |
| DE69218481D1 (de) | 1997-04-30 |
| EP0694353A3 (https=) | 1996-03-06 |
| US5143747A (en) | 1992-09-01 |
| MX9200610A (es) | 1992-08-01 |
| JPH0557378A (ja) | 1993-03-09 |
| CA2060952C (en) | 1999-10-05 |
| EP0694353A2 (en) | 1996-01-31 |
| EP0499197B1 (en) | 1997-03-26 |
| IL100911A (en) | 1996-10-31 |
| EP0499197A2 (en) | 1992-08-19 |
| CA2060952A1 (en) | 1992-08-13 |
| IL100911A0 (en) | 1992-11-15 |
| JPH0857560A (ja) | 1996-03-05 |
| DE69218481T2 (de) | 1997-10-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
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| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
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| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
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| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
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| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
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| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 19980817 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
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