KR950005126A - 땝납 직전의 인쇄 회로를 제조하는 방법 - Google Patents
땝납 직전의 인쇄 회로를 제조하는 방법 Download PDFInfo
- Publication number
- KR950005126A KR950005126A KR1019940015742A KR19940015742A KR950005126A KR 950005126 A KR950005126 A KR 950005126A KR 1019940015742 A KR1019940015742 A KR 1019940015742A KR 19940015742 A KR19940015742 A KR 19940015742A KR 950005126 A KR950005126 A KR 950005126A
- Authority
- KR
- South Korea
- Prior art keywords
- compound
- printed circuit
- solder resist
- screen
- resist screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000005476 soldering Methods 0.000 title claims 4
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 229910000679 solder Inorganic materials 0.000 claims abstract 12
- -1 organosilyl compound Chemical class 0.000 claims abstract 4
- 150000001875 compounds Chemical class 0.000 claims 12
- 238000010438 heat treatment Methods 0.000 claims 5
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 3
- 239000007864 aqueous solution Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 229920006037 cross link polymer Polymers 0.000 claims 2
- 238000004132 cross linking Methods 0.000 claims 2
- 239000003999 initiator Substances 0.000 claims 2
- 239000001023 inorganic pigment Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000002491 polymer binding agent Substances 0.000 claims 2
- 239000003505 polymerization initiator Substances 0.000 claims 2
- 238000006116 polymerization reaction Methods 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 2
- 238000006884 silylation reaction Methods 0.000 claims 2
- 229920003176 water-insoluble polymer Polymers 0.000 claims 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000002118 epoxides Chemical class 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 claims 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract 2
- 238000009825 accumulation Methods 0.000 abstract 1
- 239000011324 bead Substances 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
- G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE?4323064.4 | 1993-07-10 | ||
| DE4323064A DE4323064A1 (de) | 1993-07-10 | 1993-07-10 | Verfahren zur Herstellung einer lötbereiten gedruckten Schaltung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR950005126A true KR950005126A (ko) | 1995-02-18 |
Family
ID=6492446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019940015742A Ceased KR950005126A (ko) | 1993-07-10 | 1994-07-01 | 땝납 직전의 인쇄 회로를 제조하는 방법 |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0633717A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPH07307555A (cg-RX-API-DMAC7.html) |
| KR (1) | KR950005126A (cg-RX-API-DMAC7.html) |
| CN (1) | CN1111898A (cg-RX-API-DMAC7.html) |
| CA (1) | CA2127634A1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE4323064A1 (cg-RX-API-DMAC7.html) |
| MX (1) | MX9404928A (cg-RX-API-DMAC7.html) |
| TW (1) | TW245878B (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011083791A1 (de) | 2011-09-29 | 2013-04-04 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Lötverbindung |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62263645A (ja) * | 1986-05-06 | 1987-11-16 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 電気的接点構造とその形成方法 |
| DE4142735A1 (de) * | 1991-12-21 | 1993-06-24 | Hoechst Ag | Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstoppmaske |
-
1993
- 1993-07-10 DE DE4323064A patent/DE4323064A1/de not_active Withdrawn
-
1994
- 1994-06-15 EP EP94109156A patent/EP0633717A1/de not_active Withdrawn
- 1994-06-17 TW TW083105520A patent/TW245878B/zh active
- 1994-06-29 MX MX9404928A patent/MX9404928A/es unknown
- 1994-07-01 KR KR1019940015742A patent/KR950005126A/ko not_active Ceased
- 1994-07-08 CA CA002127634A patent/CA2127634A1/en not_active Abandoned
- 1994-07-08 JP JP6156895A patent/JPH07307555A/ja active Pending
- 1994-07-11 CN CN94107553A patent/CN1111898A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07307555A (ja) | 1995-11-21 |
| MX9404928A (es) | 1995-01-31 |
| CA2127634A1 (en) | 1995-01-11 |
| TW245878B (cg-RX-API-DMAC7.html) | 1995-04-21 |
| DE4323064A1 (de) | 1995-01-12 |
| CN1111898A (zh) | 1995-11-15 |
| EP0633717A1 (de) | 1995-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19940701 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19940813 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19940701 Comment text: Patent Application |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19971224 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 19980326 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 19971224 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |