KR950001297B1 - 큐어(cure)장치 - Google Patents

큐어(cure)장치 Download PDF

Info

Publication number
KR950001297B1
KR950001297B1 KR1019910006137A KR910006137A KR950001297B1 KR 950001297 B1 KR950001297 B1 KR 950001297B1 KR 1019910006137 A KR1019910006137 A KR 1019910006137A KR 910006137 A KR910006137 A KR 910006137A KR 950001297 B1 KR950001297 B1 KR 950001297B1
Authority
KR
South Korea
Prior art keywords
hot gas
gas supply
supply chamber
workpiece
heat block
Prior art date
Application number
KR1019910006137A
Other languages
English (en)
Korean (ko)
Other versions
KR910019182A (ko
Inventor
미쯔오 아라이
Original Assignee
가부시끼가이샤 신가와
아라이 가즈오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 신가와, 아라이 가즈오 filed Critical 가부시끼가이샤 신가와
Publication of KR910019182A publication Critical patent/KR910019182A/ko
Application granted granted Critical
Publication of KR950001297B1 publication Critical patent/KR950001297B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
KR1019910006137A 1990-04-23 1991-04-17 큐어(cure)장치 KR950001297B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2-105301 1990-04-23
JP2105301A JP2668739B2 (ja) 1990-04-23 1990-04-23 キュア装置

Publications (2)

Publication Number Publication Date
KR910019182A KR910019182A (ko) 1991-11-30
KR950001297B1 true KR950001297B1 (ko) 1995-02-15

Family

ID=14403873

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910006137A KR950001297B1 (ko) 1990-04-23 1991-04-17 큐어(cure)장치

Country Status (2)

Country Link
JP (1) JP2668739B2 (ja)
KR (1) KR950001297B1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2365117B (en) * 2000-07-28 2005-02-16 Planer Products Ltd Method of and apparatus for heating a substrate

Also Published As

Publication number Publication date
JP2668739B2 (ja) 1997-10-27
KR910019182A (ko) 1991-11-30
JPH045838A (ja) 1992-01-09

Similar Documents

Publication Publication Date Title
US5440101A (en) Continuous oven with a plurality of heating zones
JPH0739483Y2 (ja) リフロー炉
US5405074A (en) Reflow soldering apparatus
JPH10258357A (ja) ガス雰囲気形成装置およびガス雰囲気はんだ付け装置
JP2731665B2 (ja) リフローはんだ付け装置
KR950001297B1 (ko) 큐어(cure)장치
JPH0864949A (ja) 温度制御された非酸化性雰囲気中で部品を印刷回路板にウエーブはんだ付けするための方法
US5154604A (en) Curing apparatus
JP2000139718A (ja) エア流処理装置
JP2000146401A (ja) 冷却装置
KR950009621B1 (ko) 본딩장치
CZ300348B6 (cs) Rozvadec plynu a zarízení pro pájení plošných soucástí s tímto rozvadecem
JPH02303674A (ja) 加熱方法及びその装置
JP2668737B2 (ja) キュア装置
JP2000015432A (ja) チャンバ内雰囲気の封止方法およびその装置
JPH05343331A (ja) Ｃｖｄ装置
JPH0731540Y2 (ja) 加熱硬化装置
JP2998603B2 (ja) チップのボンディング装置
JP3495205B2 (ja) 加熱装置
JP3758783B2 (ja) キュア装置
JP2835980B2 (ja) キュア装置
JPH0749150B2 (ja) 基板加熱装置
KR20240041754A (ko) 리플로우 솔더링 머신
JPS57178351A (en) Cooling unit for semiconductor integrated circuit device
JPH0481269A (ja) リフロー炉およびそれに用いる面吹出し型ヒータ

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20010111

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee