KR930022571A - 전하 전송장치 및 고체 촬상장치 - Google Patents

전하 전송장치 및 고체 촬상장치 Download PDF

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Publication number
KR930022571A
KR930022571A KR1019920005608A KR920005608A KR930022571A KR 930022571 A KR930022571 A KR 930022571A KR 1019920005608 A KR1019920005608 A KR 1019920005608A KR 920005608 A KR920005608 A KR 920005608A KR 930022571 A KR930022571 A KR 930022571A
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KR
South Korea
Prior art keywords
channel region
charge transfer
charge
semiconductor substrate
transferred
Prior art date
Application number
KR1019920005608A
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English (en)
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KR960002645B1 (ko
Inventor
우야신지
이서규
Original Assignee
문정환
금성일렉트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 문정환, 금성일렉트론 주식회사 filed Critical 문정환
Priority to KR1019920005608A priority Critical patent/KR960002645B1/ko
Priority to TW082102306A priority patent/TW218055B/zh
Priority to US08/040,072 priority patent/US5359213A/en
Priority to DE4310915A priority patent/DE4310915B4/de
Priority to JP09843093A priority patent/JP3589472B2/ja
Publication of KR930022571A publication Critical patent/KR930022571A/ko
Application granted granted Critical
Publication of KR960002645B1 publication Critical patent/KR960002645B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1062—Channel region of field-effect devices of charge coupled devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14831—Area CCD imagers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

본 발명은 높은 S/N비로 신호전하를 전송하고 암전류가 없는 고체 촬상장치 및 복수종의 광검출소자를 가진 고체 촬상장치에 관한 것으로, 매몰 채널 CCD의 채널 영역 표면에 매몰 채널 영역과는 반대로 도전성을 갖는 채널 영역에 형성하고 매몰채널CCD와 표면 채널 CCD가 적층된 2중구조의 전하 전송 경로를 갖는 전하 전송장치를 실현하여 이루어진다.

Description

전하 전송장치 및 고체 촬상장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 CCD의 채널-포텐셜을 나타낸 도면.
제2도는 본 발명에 따른 CCD의 단면도.
제3도는 본 발명에 따른 CCD의 평면도.
제4도는 제3도의 a-a단면도, 제5도의 b-b단면도.

Claims (3)

  1. CCD를 전하전송으로 이용하는 전하전송 장치에 있어서, 반도체 기판상 혹은 반도체 기판 표면에 형성된 웰층내에 상기 반도체 기판 혹은 상기 웰층의 도전성과 반대의 도전성 매몰 채널 영역을 갖고, 상기 매몰 채널영역의 표면에 상기 매몰 채널 영역과는 반대의 도전성 표면 채널 영역을 갖고, 상기 매몰 채널영역을 이용하여 전송된 전하를 읽어내어 상기 표면 채널 영역으로 전송된 전하를 배출하도록 하는 수단을 가진 것을 특징으로 하는 전하전송 장치.
  2. CCD의 게이트 전극을 통과하여 입사하는 빛에 따라 발생하는 전하를 축적하고 전송하는 기능을 가진 고체 촬상장치에 있어서, 상기 전하전송 장치를 광 검출과 전하전송에 병용하고 상기 매몰 채널 영역을 이용하여 전송된 전하와 표면 채널 영역으로 전송된 전하를 독립적으로 읽어내는 것을 특징으로 하는 고체 촬상장치.
  3. 반도체 기판상 혹은 반도체 기판에 전기적으로 접속된 영역에 다른 분광 감도특성을 갖는 복수종의 광검출소자를 갖고 상기 복수종의 광검출소자로 부터 출력된 신호 전하가 전하전송장치에 의해 각각 독립적으로 전송되고, 각각 독립적으로 읽혀지는 것을 특징으로 하는 고체 촬상장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920005608A 1992-04-03 1992-04-03 전하 전송장치 및 고체 촬상장치 KR960002645B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1019920005608A KR960002645B1 (ko) 1992-04-03 1992-04-03 전하 전송장치 및 고체 촬상장치
TW082102306A TW218055B (ko) 1992-04-03 1993-03-26
US08/040,072 US5359213A (en) 1992-04-03 1993-03-30 Charge transfer device and solid state image sensor using the same
DE4310915A DE4310915B4 (de) 1992-04-03 1993-04-02 Festkörperbildsensor mit hohem Signal-Rauschverhältnis
JP09843093A JP3589472B2 (ja) 1992-04-03 1993-04-02 電荷転送装置および固体撮像素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920005608A KR960002645B1 (ko) 1992-04-03 1992-04-03 전하 전송장치 및 고체 촬상장치

Publications (2)

Publication Number Publication Date
KR930022571A true KR930022571A (ko) 1993-11-24
KR960002645B1 KR960002645B1 (ko) 1996-02-24

Family

ID=19331361

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920005608A KR960002645B1 (ko) 1992-04-03 1992-04-03 전하 전송장치 및 고체 촬상장치

Country Status (5)

Country Link
US (1) US5359213A (ko)
JP (1) JP3589472B2 (ko)
KR (1) KR960002645B1 (ko)
DE (1) DE4310915B4 (ko)
TW (1) TW218055B (ko)

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US5492852A (en) * 1993-10-07 1996-02-20 Nec Corporation Method for fabricating a solid imaging device having improved smear and breakdown voltage characteristics
US5625210A (en) * 1995-04-13 1997-04-29 Eastman Kodak Company Active pixel sensor integrated with a pinned photodiode
KR0172854B1 (ko) * 1995-08-02 1999-02-01 문정환 씨씨디 고체촬상소자 및 그의 신호처리방법
AU6899896A (en) * 1995-08-21 1997-03-27 Starcam Systems, Inc. High-speed high-resolution multi-frame real-time digital camera
US6320617B1 (en) 1995-11-07 2001-11-20 Eastman Kodak Company CMOS active pixel sensor using a pinned photo diode
US6297070B1 (en) 1996-12-20 2001-10-02 Eastman Kodak Company Active pixel sensor integrated with a pinned photodiode
US5903021A (en) * 1997-01-17 1999-05-11 Eastman Kodak Company Partially pinned photodiode for solid state image sensors
US5963251A (en) * 1997-02-03 1999-10-05 Trw Inc. Frame transfer readout correction
US6492694B2 (en) 1998-02-27 2002-12-10 Micron Technology, Inc. Highly conductive composite polysilicon gate for CMOS integrated circuits
JP2001156284A (ja) * 1999-11-25 2001-06-08 Sanyo Electric Co Ltd 固体撮像素子及びその製造方法
US20070131992A1 (en) * 2005-12-13 2007-06-14 Dialog Semiconductor Gmbh Multiple photosensor pixel image sensor
US20080136933A1 (en) * 2006-12-11 2008-06-12 Digital Imaging Systems Gmbh Apparatus for controlling operation of a multiple photosensor pixel image sensor
US20100094340A1 (en) * 2008-10-15 2010-04-15 Tyco Healthcare Group Lp Coating compositions

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SU535604A1 (ru) * 1974-08-09 1976-11-15 Предприятие П/Я В-2892 Регистр сдвига на приборах с зар довой св зью
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JPS58138187A (ja) * 1982-02-12 1983-08-16 Toshiba Corp 固体イメ−ジセンサ
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DD247327A1 (de) * 1986-03-31 1987-07-01 Werk Fernsehelektronik Veb Ueberlaufanordnung fuer ladungssammelnde halbleitergebiete
JP2822393B2 (ja) * 1988-07-30 1998-11-11 ソニー株式会社 固体撮像装置及びその駆動方法
JPH0278278A (ja) * 1988-09-13 1990-03-19 Nec Corp 赤外線センサ
KR920007355B1 (ko) * 1990-05-11 1992-08-31 금성일렉트론 주식회사 Ccd영상 소자의 구조 및 제조방법

Also Published As

Publication number Publication date
US5359213A (en) 1994-10-25
JP3589472B2 (ja) 2004-11-17
TW218055B (ko) 1993-12-21
KR960002645B1 (ko) 1996-02-24
JPH06151808A (ja) 1994-05-31
DE4310915B4 (de) 2006-08-24
DE4310915A1 (de) 1993-10-07

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