KR930010774B1 - 방사선감수성 조성물, 이를 사용하여 제조한 기록물질, 및 내열성 기록 양각 상의 제조방법 - Google Patents
방사선감수성 조성물, 이를 사용하여 제조한 기록물질, 및 내열성 기록 양각 상의 제조방법 Download PDFInfo
- Publication number
- KR930010774B1 KR930010774B1 KR1019850008740A KR850008740A KR930010774B1 KR 930010774 B1 KR930010774 B1 KR 930010774B1 KR 1019850008740 A KR1019850008740 A KR 1019850008740A KR 850008740 A KR850008740 A KR 850008740A KR 930010774 B1 KR930010774 B1 KR 930010774B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- acid
- unit
- radiosensitive
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Heat Sensitive Colour Forming Recording (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843442756 DE3442756A1 (de) | 1984-11-23 | 1984-11-23 | Strahlungsempfindliches gemisch, daraus hergestelltes aufzeichnungsmaterial und verfahren zur herstellung von waermebestaendigen reliefaufzeichnungen |
| DEP3442756.2 | 1984-11-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR860004334A KR860004334A (ko) | 1986-06-20 |
| KR930010774B1 true KR930010774B1 (ko) | 1993-11-10 |
Family
ID=6250989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019850008740A Expired - Fee Related KR930010774B1 (ko) | 1984-11-23 | 1985-11-22 | 방사선감수성 조성물, 이를 사용하여 제조한 기록물질, 및 내열성 기록 양각 상의 제조방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4699867A (https=) |
| EP (1) | EP0184044B1 (https=) |
| JP (1) | JPS61143747A (https=) |
| KR (1) | KR930010774B1 (https=) |
| AT (1) | ATE71747T1 (https=) |
| DE (2) | DE3442756A1 (https=) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3528929A1 (de) * | 1985-08-13 | 1987-02-26 | Hoechst Ag | Strahlungsempfindliches gemisch, dieses enthaltendes strahlungsempfindliches aufzeichnungsmaterial und verfahren zur herstellung von reliefbildern |
| EP0265387B1 (en) * | 1986-10-23 | 1995-11-15 | Ciba-Geigy Ag | Method of forming images |
| DE3787369T2 (de) * | 1986-11-26 | 1994-01-13 | Konishiroku Photo Ind | Farbbilddarstellungsmaterial und verfahren zur herstellung gefärbter bilder. |
| JPH06105355B2 (ja) * | 1986-12-15 | 1994-12-21 | 富士写真フイルム株式会社 | 感光性組成物 |
| JPS63303343A (ja) * | 1987-06-03 | 1988-12-09 | Konica Corp | 感光性組成物及び感光性平版印刷版 |
| DE3852559T2 (de) * | 1987-03-12 | 1995-05-24 | Konishiroku Photo Ind | Lichtempfindliche positive Flachdruckplatte. |
| DE3711264A1 (de) * | 1987-04-03 | 1988-10-13 | Hoechst Ag | Lichtempfindliches gemisch und hieraus hergestelltes lichtempfindliches kopiermaterial |
| DE3716848A1 (de) * | 1987-05-20 | 1988-12-01 | Hoechst Ag | Verfahren zur bebilderung lichtempfindlichen materials |
| US5081001A (en) * | 1987-05-22 | 1992-01-14 | Hoechst Celanese Corporation | Blocked monomer and polymers therefrom for use as photoresists |
| US4962171A (en) * | 1987-05-22 | 1990-10-09 | Hoechst Celanese Corporation | Blocked monomer and polymers therefrom for use as photoresists |
| US4810613A (en) * | 1987-05-22 | 1989-03-07 | Hoechst Celanese Corporation | Blocked monomer and polymers therefrom for use as photoresists |
| US5177172A (en) * | 1988-05-31 | 1993-01-05 | Ocg Microelectronic Materials, Inc. | Selected methylol-substituted trihydroxybenzophenones and their use in phenolic resin compositions |
| US5002851A (en) * | 1988-05-31 | 1991-03-26 | Olin Hunt Specialty Products, Inc. | Light sensitive composition with o-quinone diazide and phenolic novolak resin made using methylol substituted trihydroxybenzophenone as reactant |
| US5239122A (en) * | 1988-05-31 | 1993-08-24 | Ocg Microelectronic Materials, Inc. | Selected methylol-substituted trihydroxybenzophenones and their use in phenolic resin compositions |
| US5254440A (en) * | 1988-05-31 | 1993-10-19 | Ocg Microelectronic Materials, Inc. | Selected methylol-substituted trihydroxybenzophenones and their use in phenolic resin compositions and processes of forming resist images |
| DE3820699A1 (de) * | 1988-06-18 | 1989-12-21 | Hoechst Ag | Strahlungsempfindliches gemisch und hieraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial |
| DE3907953A1 (de) * | 1989-03-11 | 1990-09-13 | Hoechst Ag | Strahlungshaertbares gemisch und daraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial fuer hochenergetische strahlung |
| DE3907954A1 (de) * | 1989-03-11 | 1990-09-13 | Hoechst Ag | Positiv arbeitendes strahlungsempfindliches gemisch und daraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial fuer hochenergetische strahlung |
| DE4002397A1 (de) * | 1990-01-27 | 1991-08-01 | Hoechst Ag | Strahlungsempfindliches gemisch und hieraus hergestelltes strahlungsempfindliches aufzeichnungsmaterial |
| DE4003025A1 (de) * | 1990-02-02 | 1991-08-08 | Hoechst Ag | Strahlungsempfindliches gemisch, hiermit hergestelltes strahlungsempfindliches aufzeichnungsmaterial und verfahren zur herstellung von reliefaufzeichnungen |
| US5403695A (en) * | 1991-04-30 | 1995-04-04 | Kabushiki Kaisha Toshiba | Resist for forming patterns comprising an acid generating compound and a polymer having acid decomposable groups |
| KR950002875B1 (ko) * | 1991-07-08 | 1995-03-27 | 가부시키가이샤 도시바 | 감광성 조성물 |
| DE19507618A1 (de) * | 1995-03-04 | 1996-09-05 | Hoechst Ag | Polymere und diese enthaltendes lichtempfindliches Gemisch |
| DE19803564A1 (de) | 1998-01-30 | 1999-08-05 | Agfa Gevaert Ag | Polymere mit Einheiten aus N-substituiertem Maleimid und deren Verwendung in strahlungsempfindlichen Gemischen |
| JP4213366B2 (ja) | 2001-06-12 | 2009-01-21 | Azエレクトロニックマテリアルズ株式会社 | 厚膜レジストパターンの形成方法 |
| DE10204114A1 (de) * | 2002-02-01 | 2003-08-14 | Basf Coatings Ag | Thermisch und mit aktinischer Strahlung härtbares Stoffgemisch, Verfahren zu seiner Herstellung und seine Verwendung |
| US20080305435A1 (en) * | 2007-06-05 | 2008-12-11 | Yasushi Miyamoto | Method of making lithographic printing plate substrate and imageable elements |
| JP5417422B2 (ja) * | 2010-12-13 | 2014-02-12 | 富士フイルム株式会社 | ポジ型感光性樹脂組成物 |
| CN102540726B (zh) * | 2010-12-13 | 2016-07-06 | 富士胶片株式会社 | 正型感光性树脂组成物、硬化膜及其形成方法、层间绝缘膜以及显示装置 |
| JP5593405B2 (ja) * | 2012-02-28 | 2014-09-24 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機el表示装置および液晶表示装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1447913C3 (de) * | 1964-10-15 | 1979-08-09 | Hoechst Ag, 6000 Frankfurt | Verfahren zur Herstellung von Druckformen |
| US3637384A (en) * | 1969-02-17 | 1972-01-25 | Gaf Corp | Positive-working diazo-oxide terpolymer photoresists |
| US3900325A (en) * | 1972-06-12 | 1975-08-19 | Shipley Co | Light sensitive quinone diazide composition with n-3-oxohydrocarbon substituted acrylamide |
| US4164421A (en) * | 1972-12-09 | 1979-08-14 | Fuji Photo Film Co., Ltd. | Photocurable composition containing an o-quinonodiazide for printing plate |
| DE3039926A1 (de) * | 1980-10-23 | 1982-05-27 | Hoechst Ag, 6000 Frankfurt | Lichtempfindliches gemisch, daraus hergestelltes lichtempfindliches kopiermaterial und verfahren zur herstellung einer druckform aus dem kopiermaterial |
| US4439516A (en) * | 1982-03-15 | 1984-03-27 | Shipley Company Inc. | High temperature positive diazo photoresist processing using polyvinyl phenol |
| DE3231147A1 (de) * | 1982-08-21 | 1984-02-23 | Basf Ag, 6700 Ludwigshafen | Positiv arbeitendes verfahren zur herstellung von reliefbildern oder resistmustern |
| DE3323343A1 (de) * | 1983-06-29 | 1985-01-10 | Hoechst Ag, 6230 Frankfurt | Lichtempfindliches gemisch und daraus hergestelltes kopiermaterial |
| DE3325022A1 (de) * | 1983-07-11 | 1985-01-24 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung negativer kopien mittels eines materials auf basis von 1,2-chinondiaziden |
| DE3329443A1 (de) * | 1983-08-16 | 1985-03-07 | Hoechst Ag, 6230 Frankfurt | Durch strahlung polymerisierbares gemisch und daraus hergestelltes kopiermaterial |
| DE3406927A1 (de) * | 1984-02-25 | 1985-08-29 | Hoechst Ag, 6230 Frankfurt | Strahlungsempfindliches gemisch auf basis von saeurespaltbaren verbindungen |
-
1984
- 1984-11-23 DE DE19843442756 patent/DE3442756A1/de not_active Withdrawn
-
1985
- 1985-11-14 DE DE8585114454T patent/DE3585213D1/de not_active Expired - Fee Related
- 1985-11-14 AT AT85114454T patent/ATE71747T1/de not_active IP Right Cessation
- 1985-11-14 EP EP85114454A patent/EP0184044B1/de not_active Expired - Lifetime
- 1985-11-22 KR KR1019850008740A patent/KR930010774B1/ko not_active Expired - Fee Related
- 1985-11-22 JP JP60261633A patent/JPS61143747A/ja active Granted
- 1985-11-22 US US06/800,965 patent/US4699867A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US4699867A (en) | 1987-10-13 |
| DE3442756A1 (de) | 1986-05-28 |
| EP0184044B1 (de) | 1992-01-15 |
| DE3585213D1 (de) | 1992-02-27 |
| KR860004334A (ko) | 1986-06-20 |
| JPH0588834B2 (https=) | 1993-12-24 |
| JPS61143747A (ja) | 1986-07-01 |
| EP0184044A3 (en) | 1988-01-13 |
| ATE71747T1 (de) | 1992-02-15 |
| EP0184044A2 (de) | 1986-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR930010774B1 (ko) | 방사선감수성 조성물, 이를 사용하여 제조한 기록물질, 및 내열성 기록 양각 상의 제조방법 | |
| US4678737A (en) | Radiation-sensitive composition and recording material based on compounds which can be split by acid | |
| US4910119A (en) | Polymeric compounds and radiation-sensitive mixture containing them | |
| JP3235771B2 (ja) | 橋かけポリマー | |
| KR0150441B1 (ko) | 방사선경화성조성물, 이로부터 제조된 방사선경화성기록물질 및 이에의한 고 에너지방사기록법 | |
| EP0605124A2 (en) | Radiation-sensitive resist composition | |
| JPS6313031A (ja) | 感放射線記録材料 | |
| JP2002083687A (ja) | El表示素子の隔壁形成用感放射線性樹脂組成物、隔壁およびel表示素子 | |
| JP3001329B2 (ja) | ネガ型放射感応性混合物、およびこの混合物を使用して製造した放射感応性記録材料 | |
| JP2666852B2 (ja) | ポジ型感放射線混合物、ポジ型感放射線記録材料及びその製法 | |
| JP2683055B2 (ja) | ポジ型感放射線性混合物、ポジ型感放射線性記録材料および該記録材料の製造法 | |
| JPH04213459A (ja) | 照射感応性混合物、その混合物を使用して製造する照射感応性記録材料およびレリーフ複写の製作方法 | |
| KR0161965B1 (ko) | 방사선-감수성 혼합물 및 이로부터 제조된 방사선-감수성복사물질 | |
| US5275908A (en) | Radiation-sensitive mixture and recording material comprising as a binder a copolymer having hydroxybenzyl(meth)acrylate groups or derivatives thereof | |
| US5292626A (en) | Developer composition for irradiated, radiation-sensitive positive-working, negative-working and reversible reprographic layers | |
| CN1160597C (zh) | 用于正性光刻胶的混合溶剂体系 | |
| CN1875323B (zh) | 厚膜或超厚膜响应的化学放大型光敏树脂组合物 | |
| WO2021005140A1 (en) | Photoresist remover compositions | |
| CN1227637A (zh) | 含2,4-二硝基-1-萘酚的正性光刻胶组合物 | |
| JP4000407B2 (ja) | 酸に不安定な保護基を有するフェノール樹脂 | |
| JP3066068B2 (ja) | 陽画フォトレジスト組成物 | |
| JPH11153858A (ja) | 可視光感光性組成物及びパターンの製造方法 | |
| JPH02248955A (ja) | フォトレジスト組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| G160 | Decision to publish patent application | ||
| PG1605 | Publication of application before grant of patent |
St.27 status event code: A-2-2-Q10-Q13-nap-PG1605 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| FPAY | Annual fee payment |
Payment date: 19961023 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| LAPS | Lapse due to unpaid annual fee | ||
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 19971111 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 19971111 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |