KR930009001A - 경화장치 - Google Patents

경화장치 Download PDF

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Publication number
KR930009001A
KR930009001A KR1019920017000A KR920017000A KR930009001A KR 930009001 A KR930009001 A KR 930009001A KR 1019920017000 A KR1019920017000 A KR 1019920017000A KR 920017000 A KR920017000 A KR 920017000A KR 930009001 A KR930009001 A KR 930009001A
Authority
KR
South Korea
Prior art keywords
wire
frame support
support wire
heater block
frame
Prior art date
Application number
KR1019920017000A
Other languages
English (en)
Other versions
KR960005548B1 (ko
Inventor
미찌오 아라이
Original Assignee
아리이 가즈오
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아리이 가즈오, 가부시끼가이샤 신가와 filed Critical 아리이 가즈오
Publication of KR930009001A publication Critical patent/KR930009001A/ko
Application granted granted Critical
Publication of KR960005548B1 publication Critical patent/KR960005548B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B9/00—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity
    • F27B9/14—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment
    • F27B9/20—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace
    • F27B9/24—Furnaces through which the charge is moved mechanically, e.g. of tunnel type; Similar furnaces in which the charge moves by gravity characterised by the path of the charge during treatment; characterised by the means by which the charge is moved during treatment the charge moving in a substantially straight path tunnel furnace being carried by a conveyor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/12—Travelling or movable supports or containers for the charge
    • F27D2003/121—Band, belt or mesh
    • F27D2003/122—Band made from longitudinal wires or bars

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

본 발명은 제조원가의 경감 및 리이드 프레임의 품종변경에 쉽게 대처할 수 있도록 하고, 히터블록(1)의 윗쪽에 리이드 프레임 운송방향으로 프레임 지지용 와이어(10)를 배열설치하고, 프레임 지지용 와이어(10)에 이 프레임 지지용 와이어(10)와 히터블록(1)의 간격을 일정하게 유지하는 와이어 이완방지용 칼라(11)를 부착하여 형성한 경화장치에 관한 것이다.

Description

경화장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명으로 형성되는 경화장치의 1실시예를 예시하는 주요부 사시도,
제2도는 제1도의 측면도,
제3도는 칩이 다이본딩된 리이드 프레임의 측면도.

Claims (3)

  1. 칩을 페이스트로 다이본딩한 리이드 프레임을 히터블록상을 택트운송하는 컨베이어로 운송하면서 가열하여 상기 페이스트를 경화시키는 경화장치에 있어서, 상기 히터블록의 윗쪽에 리이드 프레임 운송방향으로 배열 설치된 프레임 지지용 와이어와, 이 프레임 지지용 와이어와 히터블록 간격을 일정하게 하기 위하여 프레임 지지용 와이어에 부착된 와이어 이완방지용 칼라를 구비한 것을 특징으로 하는 경화장치.
  2. 제1항에 있어서, 상기 와이어 이완방지용 칼라는 상기 프레임 지지용 와이어에 미끄럼 움직임이 가능하며, 또한 마찰에 의해 걸리게 되어 있는 것을 특징으로 하는 경화장치.
  3. 제1항에 있어서, 상기 프레임 지지용 와이어는 이 프레임 지지용 와이어와 직각으로 배열 설치된 와이어 유지용 샤프트에 미끄럼 움직임이 자유롭게 설치된 와이어 유지용 칼라에 고정된 것을 특징으로 하는 경화장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019920017000A 1991-10-15 1992-09-18 경화장치 KR960005548B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3293911A JP2841136B2 (ja) 1991-10-15 1991-10-15 キュア装置
JP91-293911 1991-10-15

Publications (2)

Publication Number Publication Date
KR930009001A true KR930009001A (ko) 1993-05-22
KR960005548B1 KR960005548B1 (ko) 1996-04-26

Family

ID=17800751

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920017000A KR960005548B1 (ko) 1991-10-15 1992-09-18 경화장치

Country Status (3)

Country Link
US (1) US5267853A (ko)
JP (1) JP2841136B2 (ko)
KR (1) KR960005548B1 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2531016B2 (ja) * 1991-12-03 1996-09-04 ニチデン機械株式会社 リ―ドフレ―ム搬送装置
JPH0878443A (ja) * 1994-09-05 1996-03-22 Shinkawa Ltd キュア装置
JP3106341B2 (ja) * 1994-11-25 2000-11-06 株式会社新川 キュア装置
JP3079500B2 (ja) * 1994-11-25 2000-08-21 株式会社新川 キュア装置
US5871325A (en) * 1995-04-19 1999-02-16 Jabil Circuit, Inc. Thin support for PC board transfer system
JP3224508B2 (ja) * 1996-05-23 2001-10-29 シャープ株式会社 加熱制御装置
US6110805A (en) * 1997-12-19 2000-08-29 Micron Technology, Inc. Method and apparatus for attaching a workpiece to a workpiece support
JP2004286425A (ja) * 2003-03-06 2004-10-14 Ngk Insulators Ltd 線材を用いた搬送機構並びにそれを使用した熱処理炉及び熱処理方法
DE202005018076U1 (de) * 2005-11-18 2007-03-29 Seho Systemtechnik Gmbh Stützvorrichtung einer Transportvorrichtung einer Lötanlage
US7588139B1 (en) * 2008-08-12 2009-09-15 Campbell Iii William Arthur Conveyor assembly
DE102008041471B3 (de) * 2008-08-22 2010-03-04 Q-Cells Ag Verfahren und Vorrichtung zum Transportieren eines Substrates
KR20140028579A (ko) * 2012-08-29 2014-03-10 세메스 주식회사 기판처리장치
JP6756275B2 (ja) * 2017-01-31 2020-09-16 トヨタ自動車株式会社 フィラメントワインディング装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217090A (en) * 1978-08-22 1980-08-12 B & K Machinery International Limited Oven heating system
US4217977A (en) * 1978-09-15 1980-08-19 The Silicon Valley Group, Inc. Conveyor system
US4507078A (en) * 1983-03-28 1985-03-26 Silicon Valley Group, Inc. Wafer handling apparatus and method
JPS60169148A (ja) * 1984-02-13 1985-09-02 Dainippon Screen Mfg Co Ltd 基板の搬送方法及びその装置
JPH01133668A (ja) * 1987-11-20 1989-05-25 Kenji Kondo プリント基板の保持搬送方法およびその装置
GB8908430D0 (en) * 1989-04-14 1989-06-01 Automatic Truck Loading System Improvements in or relating to loading and unloading appartus
US5168978A (en) * 1990-10-09 1992-12-08 Cintex Of America Inc. Conveyor with transverse positioning

Also Published As

Publication number Publication date
JP2841136B2 (ja) 1998-12-24
US5267853A (en) 1993-12-07
KR960005548B1 (ko) 1996-04-26
JPH05109792A (ja) 1993-04-30

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