KR930002870B1 - 분할형 미끄럼 베어링반제품의 표면처리방법 및 장치 - Google Patents

분할형 미끄럼 베어링반제품의 표면처리방법 및 장치 Download PDF

Info

Publication number
KR930002870B1
KR930002870B1 KR1019900018871A KR900018871A KR930002870B1 KR 930002870 B1 KR930002870 B1 KR 930002870B1 KR 1019900018871 A KR1019900018871 A KR 1019900018871A KR 900018871 A KR900018871 A KR 900018871A KR 930002870 B1 KR930002870 B1 KR 930002870B1
Authority
KR
South Korea
Prior art keywords
bearing
plating
semi
split
semifinished product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019900018871A
Other languages
English (en)
Korean (ko)
Other versions
KR910009966A (ko
Inventor
타다시 다나까
마사아끼 사까모도
모토무 와다
히데오 이시가와
Original Assignee
다이도 메탈 고교 가부시기가이샤
이이지마 요시오
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이도 메탈 고교 가부시기가이샤, 이이지마 요시오 filed Critical 다이도 메탈 고교 가부시기가이샤
Publication of KR910009966A publication Critical patent/KR910009966A/ko
Application granted granted Critical
Publication of KR930002870B1 publication Critical patent/KR930002870B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/10—Bearings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Sliding-Contact Bearings (AREA)
KR1019900018871A 1989-11-30 1990-11-21 분할형 미끄럼 베어링반제품의 표면처리방법 및 장치 Expired - Fee Related KR930002870B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-309197 1989-11-30
JP1309197A JPH0781199B2 (ja) 1989-11-30 1989-11-30 半割型すべり軸受中間製品の表面処理方法およびその装置

Publications (2)

Publication Number Publication Date
KR910009966A KR910009966A (ko) 1991-06-28
KR930002870B1 true KR930002870B1 (ko) 1993-04-12

Family

ID=17990097

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900018871A Expired - Fee Related KR930002870B1 (ko) 1989-11-30 1990-11-21 분할형 미끄럼 베어링반제품의 표면처리방법 및 장치

Country Status (5)

Country Link
US (1) US5141626A (enExample)
JP (1) JPH0781199B2 (enExample)
KR (1) KR930002870B1 (enExample)
DE (1) DE4038108A1 (enExample)
GB (1) GB2241708B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101418885B1 (ko) * 2012-10-08 2014-07-25 주식회사 에이피테크이십일 자동차 부싱의 도금용 외부케이스를 이용한 도금장치

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR930005013B1 (ko) * 1990-03-16 1993-06-11 다이도 메탈 고오교오 가부시기가이샤 이분할 슬라이딩 베어링의 표면 처리방법 및 장치
USD357058S (en) 1994-02-24 1995-04-04 Vortex Corporation Water purification unit
GB9812586D0 (en) 1998-06-12 1998-08-12 Glacier Vandervell Ltd Method and apparatus for electroplating
US20050006245A1 (en) * 2003-07-08 2005-01-13 Applied Materials, Inc. Multiple-step electrodeposition process for direct copper plating on barrier metals
US20070125657A1 (en) * 2003-07-08 2007-06-07 Zhi-Wen Sun Method of direct plating of copper on a substrate structure
US20060283716A1 (en) * 2003-07-08 2006-12-21 Hooman Hafezi Method of direct plating of copper on a ruthenium alloy
US20050085031A1 (en) * 2003-10-15 2005-04-21 Applied Materials, Inc. Heterogeneous activation layers formed by ionic and electroless reactions used for IC interconnect capping layers
US20050095830A1 (en) * 2003-10-17 2005-05-05 Applied Materials, Inc. Selective self-initiating electroless capping of copper with cobalt-containing alloys
US7205233B2 (en) * 2003-11-07 2007-04-17 Applied Materials, Inc. Method for forming CoWRe alloys by electroless deposition
US20050161338A1 (en) * 2004-01-26 2005-07-28 Applied Materials, Inc. Electroless cobalt alloy deposition process
US20050170650A1 (en) * 2004-01-26 2005-08-04 Hongbin Fang Electroless palladium nitrate activation prior to cobalt-alloy deposition
US7514353B2 (en) * 2005-03-18 2009-04-07 Applied Materials, Inc. Contact metallization scheme using a barrier layer over a silicide layer
US7651934B2 (en) 2005-03-18 2010-01-26 Applied Materials, Inc. Process for electroless copper deposition
US7659203B2 (en) 2005-03-18 2010-02-09 Applied Materials, Inc. Electroless deposition process on a silicon contact
US20070071888A1 (en) * 2005-09-21 2007-03-29 Arulkumar Shanmugasundram Method and apparatus for forming device features in an integrated electroless deposition system
DE102010000853A1 (de) * 2010-01-13 2011-07-14 Federal-Mogul Wiesbaden GmbH, 65201 Halter zur galvanischen Beschichtung von Gleitlagern und Werkzeug mit einem Halter
CN103173843B (zh) * 2012-12-13 2015-12-23 苏州赛斯德工程设备有限公司 电镀用钛挂具

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2500206A (en) * 1946-06-29 1950-03-14 Cleveland Graphite Bronze Co Apparatus for plating
US2697690A (en) * 1948-12-22 1954-12-21 Federal Mogul Corp Electroplating rack
US2727858A (en) * 1952-04-07 1955-12-20 Gen Motors Corp Plating fixture
GB733212A (en) * 1953-01-16 1955-07-06 Glacier Co Ltd Improvements in or relating to plain bearings
US2944945A (en) * 1955-07-29 1960-07-12 Gen Motors Corp Electroplating
US3226308A (en) * 1961-06-15 1965-12-28 Clevite Corp Electrochemical treating method and apparatus
US3282824A (en) * 1962-12-17 1966-11-01 Federal Mogul Bower Bearings Dual sided plating rack
DE1239160B (de) * 1963-05-04 1967-04-20 Karl Schmidt Ges Mit Beschraen Vorrichtung zum Galvanisieren ringfoermiger Koerper
CH525286A (fr) * 1970-05-20 1972-07-15 Sel Rex Corp Machine pour placage sélectif
GB1343814A (en) * 1971-04-20 1974-01-16 Vandervell Products Ltd Plating boxes for holding a stack of semi-cylindrical bearing liners during electro-plating
US3835017A (en) * 1972-12-22 1974-09-10 Buckbee Mears Co Reusable shields for selective electrodeposition
GB1422497A (en) * 1974-03-05 1976-01-28 Cannon Electric Great Britain Electro-plating
DE2454624A1 (de) * 1974-11-18 1976-05-20 Glyco Metall Werke Einbaumagazin fuer eine galvanikaufnahme zum elektroplattieren von halbzylindrischen gegenstaenden
DE2454625C2 (de) * 1974-11-18 1983-12-29 Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden Aufnahme- und Haltevorrichtung aus Kunststoff zur Erzeugung gleichmäßiger Dicke von galvanisch niedergeschlagenen metallischen Schichten
JPS5462929A (en) * 1977-10-28 1979-05-21 Sumitomo Electric Ind Ltd Surface treating method for aluminum and aluminum alloy
US4259166A (en) * 1980-03-31 1981-03-31 Rca Corporation Shield for plating substrate
US4399019A (en) * 1981-07-21 1983-08-16 Imperial Clevite Inc. Ultra-high current density electroplating cell
US4599147A (en) * 1984-07-11 1986-07-08 Federal-Mogul Corporation Method for making improved split bearings having masked relief areas
US4643816A (en) * 1985-05-09 1987-02-17 Burlington Industries, Inc. Plating using a non-conductive shroud and a false bottom
JPH0815582B2 (ja) * 1987-02-28 1996-02-21 本田技研工業株式会社 車体の表面処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101418885B1 (ko) * 2012-10-08 2014-07-25 주식회사 에이피테크이십일 자동차 부싱의 도금용 외부케이스를 이용한 도금장치

Also Published As

Publication number Publication date
KR910009966A (ko) 1991-06-28
GB2241708A (en) 1991-09-11
GB2241708B (en) 1994-08-17
US5141626A (en) 1992-08-25
GB9026055D0 (en) 1991-01-16
JPH03170696A (ja) 1991-07-24
DE4038108C2 (enExample) 1993-02-11
DE4038108A1 (de) 1991-06-06
JPH0781199B2 (ja) 1995-08-30

Similar Documents

Publication Publication Date Title
KR930002870B1 (ko) 분할형 미끄럼 베어링반제품의 표면처리방법 및 장치
US5200048A (en) Electroplating apparatus for plating half bearings
US5049221A (en) Process for producing a copper-clad laminate
US4790902A (en) Method of producing conductor circuit boards
DE112015001081B4 (de) Zinnplattiertes Produkt und Verfahren zum Herstellen desselben
JP4642120B2 (ja) 電解金属箔製造装置並びに電解金属箔製造装置に用いる薄板状不溶性金属電極の製造方法及びその電解金属箔製造装置を用いて得られた電解金属箔
DE69213060T2 (de) Elektrolytische Zelle-Anode
EP2295618A1 (en) Composite material for electrical/electronic component and electrical/electronic component using the same
JP2001335991A (ja) 金属めっき装置
CN107614759A (zh) Sn镀材及其制造方法
Srivastava et al. Electrodeposition of binary alloys: an account of recent developments
US8158269B2 (en) Composite material for electrical/electronic part and electrical/electronic part using the same
EP0258365A1 (en) Electrical contact surface coating
EP0209016A1 (de) Einrichtung zur elektrolytischen Oberflächenbehandlung von schüttfähigem Gut
US3751354A (en) Electroplating cell including magnetic means to couple concave workpieces to a plating rack
US2758962A (en) Method of electroplating and apparatus therefor
CN213680938U (zh) 一种用于提高电镀膜层均匀性的加工装置
Radanyi et al. Whisker formation on galvanic tin surface layer
CN218321695U (zh) 电镀装置及电镀系统
DE10042002B4 (de) Vorrichtung zur galvanischen Abscheidung eines Werkstoffes und deren Verwendung
EP4647526A2 (en) Aluminum alloy bus bar and method of manufacturing aluminum alloy bus bar
CN222349158U (zh) 一种金属加工电镀装置
Budaragin et al. Selection of Electrolyte Composition for Bright Nickel Plating of Resistive Element Contact Pads
Morris Electroplating in the plain bearing industry
Ali et al. Characterization of Cu-Ag multilayers deposited on brass substrate using electroplating technique

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20030326

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20040413

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20040413

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000