EP0258365A1 - Electrical contact surface coating - Google Patents

Electrical contact surface coating

Info

Publication number
EP0258365A1
EP0258365A1 EP87901534A EP87901534A EP0258365A1 EP 0258365 A1 EP0258365 A1 EP 0258365A1 EP 87901534 A EP87901534 A EP 87901534A EP 87901534 A EP87901534 A EP 87901534A EP 0258365 A1 EP0258365 A1 EP 0258365A1
Authority
EP
European Patent Office
Prior art keywords
nickel
layer
gold
surface coating
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP87901534A
Other languages
German (de)
French (fr)
Inventor
John William Souter
Michael Charles Nottingham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AB Electronic Components Ltd
Original Assignee
Plessey Overseas Ltd
AB Electronic Components Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Overseas Ltd, AB Electronic Components Ltd filed Critical Plessey Overseas Ltd
Publication of EP0258365A1 publication Critical patent/EP0258365A1/en
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/623Porosity of the layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials

Definitions

  • This invention relates to an electrical contact surface coating. It relates particularly to a process for providing a surface coating on an electrical contact body which will have good corrosion and wear resistance properties.
  • contact bodies which are capable of making good electrical contact with one another and will be able to do this even after the contact surfaces have been exposed to atmospheric conditions likely to cause surface corrosion of the bodies.
  • the products of any surface corrosion are likely to include the formation of an electrically insulating film on the contact body and the occurence of this will cause an unacceptably high electrical resistance between a pair of the contact surfaces.
  • the contact bodies may need to be brought into contact with one another very many times over the lifetime of the equipment so that the contact-making surface will need to be resistant to mechanical wear.
  • a process for forming an electrically conductive surface coating on an electrical contact body comprising the steps of depositing upon the body surface in sequence (a) a nickel layer, (b) a first gold layer, (c) a palladium/nickel alloy layer which may be an alloy containing nickel up to a proportion of 50% by weight, and (d) a second gold layer.
  • the separate layers are laid down by an electro-deposition process such as electroplating.
  • the nickel layer may be laid down so as to give a deposit of pure, soft, low stress nickel.
  • the relevant plating bath should be free of organic impurities and traces of metals other than nickel.
  • the first gold layer may be deposited from a conventional commercially available gold plating solution. A gold thickness of between 0.05 to 0.1 micrometres is laid down.
  • the palladium/nickel alloy layer may be deposited from a conventional commercial electroplating solution. The composition of the layer is satisfactory with palladium in the range of 50 to 100% by weight, balance nickel.
  • the second gold layer may be a pure gold metal or one containing metal hardening additives, such as cobalt, nickel
  • One preferred composition for the second gold layer is similar to that used for the said first gold layer.
  • the invention also comprises an electrical contact body when manufactured with an electrically conductive surface coating having layers deposited in sequence of nickel, gold, palladium/nickel alloy and gold.
  • the electrical contact body may be intended for use in applications such as electrical and electronic connector contacts, sliding contacts for electrical slip-rings and for printed circuit boards.
  • an electrical contact body 1 after suitable cleaning and possibly a surface smoothing treatment is passed through a first electroplating bath 2 where it is given a coating of a pure, soft, low stress nickel deposit.
  • the nickel plating solution composition should be free of organic impurities and traces of metals other than nickel.
  • the nickel plating solution may have been given a preliminary carbon treatment to remove organic impurities and been subject to a low current plating-out stage to remove any metal
  • the nickel plating solution should therefore preferably contain only nickel salts and possibly an additive such as boric acid.
  • the thickness of nickel deposited is within the range of 0.5 to 3.0 micrometres.
  • the contact body After deposition of the nickel layer, the contact body is washed and it is then passed through a second electroplating bath 3 for the formation of a gold layer.
  • the gold plating solution was a conventional commercial gold plating solution and a thickness of gold of between 0.05 and 0.1 micrometres was formed.
  • One gold plating solution that was found to be particularly suitable was that produced by Degussa (West Germany) under the name of "Auruna 553 Solution".
  • the object of the nickel coating followed by the gold coating was partly to promote the formation of a low porosity coating in the palladium/nickel alloy layer that was to be applied subsequently and thus the gold enhanced the eventual corrosion resistance.
  • the nickel and gold coatings served to reduce the possibility of a chemical contamination of the palladium/nickel electroplating solution used in the next stage by the accidental dissolution of metals such as copper, zinc or lead from the substrate material.
  • the contact body 1 is washed and it is then passed through a third electroplating bath 4 for the formation of a palladium/nickel alloy layer.
  • the palladium/nickel alloy deposition bath was a commercially available bath selected from a group comprising: Degussa (West Germany) - "Palladium Nickel 462 Solution”, Englehard Industries - “Palnic Solution”, Lea Ronal - “Pallamet 30 Solution” and Sel-Rex (Oxymetal Industries) - "Palladex Solution”.
  • the conditions of deposition used were those recommended by the supplier of the relevant electroplating solution.
  • the composition of the palladium/nickel alloy layer was found to be satisfactory with palladium in the range of 50 to 100% by weight, balance nickel.
  • the contact body is washed and it is then passed through a fourth electroplating bath 5 to be given a thin plating of gold.
  • the object of this step was to give a satisfactory wear resistance to the completed contact body and the type of gold deposit laid down was not found to be critical.
  • the type of gold used may be either a pure gold metal or one containing metal-hardening additives, such as cobalt, nickel or iron in an amount of approximately 0.2 to 0.5% by weight.
  • a particularly suitable gold deposition bath 5 for the second gold layer is a similar bath to that used for the first gold layer.
  • the coating was found to have improved corrosion resistance and good wear resistance properties as compared with an electrical contact body having a conventional surface coating.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Contacts (AREA)

Abstract

Procédé permettant de former un revêtement de surface électriquement conducteur sur un corps de contact électrique, consistant à déposer sur la surface du corps (1), l'une après l'autre, a) une couche de nickel (2), b) une première couche d'or (3), c) une couche en alliage de palladium/nickel (4) pouvant être un alliage contenant du nickel jusqu'à une proportion de 50% en poids, et d) une deuxième couche d'or (5). Toutes les couches peuvent être déposées par un procédé de dépôt galvanique. Le revêtement de surface résultant possède d'excellentes propriétés de résistance à la corrosion et à l'usure.A method of forming an electrically conductive surface coating on an electrical contact body, comprising depositing on the surface of the body (1), one after the other, a) a layer of nickel (2), b) a first layer of gold (3), c) a layer of palladium / nickel alloy (4) which may be an alloy containing nickel up to a proportion of 50% by weight, and d) a second layer of gold ( 5). All layers can be deposited by a galvanic deposition process. The resulting surface coating has excellent corrosion and wear resistance properties.

Description

ELECTRICAL CONTACT SURFACE COATING
This invention relates to an electrical contact surface coating. It relates particularly to a process for providing a surface coating on an electrical contact body which will have good corrosion and wear resistance properties. In the construction of electrical connectors for linking the separate parts of electrical equipment it is necessary to provide contact bodies which are capable of making good electrical contact with one another and will be able to do this even after the contact surfaces have been exposed to atmospheric conditions likely to cause surface corrosion of the bodies. The products of any surface corrosion are likely to include the formation of an electrically insulating film on the contact body and the occurence of this will cause an unacceptably high electrical resistance between a pair of the contact surfaces. In addition the contact bodies may need to be brought into contact with one another very many times over the lifetime of the equipment so that the contact-making surface will need to be resistant to mechanical wear. Some of these problems can be reduced by the use of gold as the contact surface coating. Whilst gold generally has good corrosion resistance, use of this element can lead to an increased cost of manufacture of the contact-making
SUBSTITUTE SHEET bodies. The provision of an alternative suitable coating material would therefore be advantageous.
According to the invention, there is provided a process for forming an electrically conductive surface coating on an electrical contact body, the process comprising the steps of depositing upon the body surface in sequence (a) a nickel layer, (b) a first gold layer, (c) a palladium/nickel alloy layer which may be an alloy containing nickel up to a proportion of 50% by weight, and (d) a second gold layer. Preferably, the separate layers are laid down by an electro-deposition process such as electroplating.
The nickel layer may be laid down so as to give a deposit of pure, soft, low stress nickel. The relevant plating bath should be free of organic impurities and traces of metals other than nickel.
The first gold layer may be deposited from a conventional commercially available gold plating solution. A gold thickness of between 0.05 to 0.1 micrometres is laid down. The palladium/nickel alloy layer may be deposited from a conventional commercial electroplating solution. The composition of the layer is satisfactory with palladium in the range of 50 to 100% by weight, balance nickel.
The second gold layer may be a pure gold metal or one containing metal hardening additives, such as cobalt, nickel
Qϊ IR^T- " ι-~~-~--> "--- v-— ------ or iron in amounts of approximately 0.2 to 0.5% by weight. One preferred composition for the second gold layer is similar to that used for the said first gold layer.
The invention also comprises an electrical contact body when manufactured with an electrically conductive surface coating having layers deposited in sequence of nickel, gold, palladium/nickel alloy and gold. The electrical contact body may be intended for use in applications such as electrical and electronic connector contacts, sliding contacts for electrical slip-rings and for printed circuit boards.
By way of example, a particular "embodiment of the invention will now be described with reference to the accompanying drawing, the single fgure of which shows a flow chart of the surface deposition process.
As shown in the drawing, an electrical contact body 1 after suitable cleaning and possibly a surface smoothing treatment is passed through a first electroplating bath 2 where it is given a coating of a pure, soft, low stress nickel deposit. The nickel plating solution composition should be free of organic impurities and traces of metals other than nickel. In order to achieve this, the nickel plating solution may have been given a preliminary carbon treatment to remove organic impurities and been subject to a low current plating-out stage to remove any metal
SUBSTITUTE SHEET impurities.
The nickel plating solution should therefore preferably contain only nickel salts and possibly an additive such as boric acid. The thickness of nickel deposited is within the range of 0.5 to 3.0 micrometres.
After deposition of the nickel layer, the contact body is washed and it is then passed through a second electroplating bath 3 for the formation of a gold layer. The gold plating solution was a conventional commercial gold plating solution and a thickness of gold of between 0.05 and 0.1 micrometres was formed.
One gold plating solution that was found to be particularly suitable was that produced by Degussa (West Germany) under the name of "Auruna 553 Solution". The object of the nickel coating followed by the gold coating was partly to promote the formation of a low porosity coating in the palladium/nickel alloy layer that was to be applied subsequently and thus the gold enhanced the eventual corrosion resistance. In addition, the nickel and gold coatings served to reduce the possibility of a chemical contamination of the palladium/nickel electroplating solution used in the next stage by the accidental dissolution of metals such as copper, zinc or lead from the substrate material. After deposition of the gold layer, the contact body 1 is washed and it is then passed through a third electroplating bath 4 for the formation of a palladium/nickel alloy layer. The palladium/nickel alloy deposition bath was a commercially available bath selected from a group comprising: Degussa (West Germany) - "Palladium Nickel 462 Solution", Englehard Industries - "Palnic Solution", Lea Ronal - "Pallamet 30 Solution" and Sel-Rex (Oxymetal Industries) - "Palladex Solution". The conditions of deposition used were those recommended by the supplier of the relevant electroplating solution.
The composition of the palladium/nickel alloy layer was found to be satisfactory with palladium in the range of 50 to 100% by weight, balance nickel.
After deposition of the alloy layer, the contact body is washed and it is then passed through a fourth electroplating bath 5 to be given a thin plating of gold. The object of this step was to give a satisfactory wear resistance to the completed contact body and the type of gold deposit laid down was not found to be critical. The type of gold used may be either a pure gold metal or one containing metal-hardening additives, such as cobalt, nickel or iron in an amount of approximately 0.2 to 0.5% by weight.
A particularly suitable gold deposition bath 5 for the second gold layer is a similar bath to that used for the first gold layer.
After removing the plated contact body from the final bath and washing and drying the body, it was able to be tested to determine the wear and corrosion resistance of the resulting multi-layer surface coating.
As a result of the testing processes carried out, the coating was found to have improved corrosion resistance and good wear resistance properties as compared with an electrical contact body having a conventional surface coating.
The method of application of the electroplated layers to the contact body was found to be able to be carried out by any suitable electroplating technique such as barrel plating, vat plating or selective plating. The foregoing description of an embodiment of the invention has been given by way of example only and a number of modifications may be made without departing from the scope of the invention as defined in the appended claims . For instance, instead of the electrical contact surface coating being laid down by an electrodeposition process, it might be possible to use a suitable alternative process such as an 'inlaid coating where'the materials required for the different surface coatings are rolled into contact with one another.

Claims

CLAIMS :
1. A process for providing an electrically conductive surface coating on an electrical contact body, the process comprising the steps of depositing upon the body surface in sequence, (a) a nickel layer, (b) a first gold layer, (c) a palladium/nickel alloy layer which may be an alloy containing nickel up to a proportion of 50% by weight, and (d) a second gold layer.
2. A process as claimed in Claim 1, in which at least one of the safd layers is deposited by an electrodeposition process.
3. A process as claimed in Claim 1 or 2, in which the said nickel layer is a deposit of a pure, soft, low stress nickel coating.
4. A process as claimed in any one of Claims 1 to 3, in which the said first gold layer has a thickness of between
0.05 to 0.1 micrometres.
5. A process as clai d in any one of Claims 1 to 4, in which the said palladium/nickel alloy layer has a composition with palladium in the range of 50 to 100% by weight, balance nickel.
6. A process as claimed in any one of Claims 1 to 5, in which the said second gold layer is of a pure gold metal or a gold containing metal hardening additives such as cobalt, nickel or iron.
7. A process for providing an electrical conductive surface coating on an electrically contact body substantially as hereinbefore described with reference to the accompanying drawing.
8. An electrical contact body including a surface coating, when manufactured by a process as claimed in any one of Claims 1 to 7.
' "
EP87901534A 1986-02-17 1987-02-17 Electrical contact surface coating Ceased EP0258365A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8603900A GB2186597B (en) 1986-02-17 1986-02-17 Electrical contact surface coating
GB8603900 1986-02-17

Publications (1)

Publication Number Publication Date
EP0258365A1 true EP0258365A1 (en) 1988-03-09

Family

ID=10593200

Family Applications (1)

Application Number Title Priority Date Filing Date
EP87901534A Ceased EP0258365A1 (en) 1986-02-17 1987-02-17 Electrical contact surface coating

Country Status (3)

Country Link
EP (1) EP0258365A1 (en)
GB (1) GB2186597B (en)
WO (1) WO1987005057A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3605425A1 (en) * 1986-02-20 1987-08-27 Standard Elektrik Lorenz Ag THICK FILM CIRCUIT AND A METHOD FOR THEIR PRODUCTION
US4895771A (en) * 1988-06-14 1990-01-23 Ab Electronic Components Limited Electrical contact surface coating
JPH0359972A (en) * 1989-07-27 1991-03-14 Yazaki Corp Electrical contact
JPH07109830B2 (en) * 1990-10-22 1995-11-22 インターナショナル・ビジネス・マシーンズ・コーポレイション Improving barriers in thin film stacks
DE4431847C5 (en) * 1994-09-07 2011-01-27 Atotech Deutschland Gmbh Substrate with bondable coating
TW340139B (en) * 1995-09-16 1998-09-11 Moon Sung-Soo Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
DE102005047799A1 (en) * 2005-10-05 2007-05-24 W.C. Heraeus Gmbh Slip ring body for continuous power transmission
US7432202B2 (en) 2005-12-28 2008-10-07 Intel Corporation Method of substrate manufacture that decreases the package resistance
US8652649B2 (en) * 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
CN107250430A (en) * 2016-02-16 2017-10-13 思力柯集团 Product and method including laminated coating
EP4121285A4 (en) * 2020-03-18 2024-03-20 Xtalic Corporation Nanostructured palladium-based alloys and related methods

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60248892A (en) * 1984-05-24 1985-12-09 Electroplating Eng Of Japan Co High-purity palladium-nickel alloy plating liquid and method thereof and alloy coated parts thereof and gold or gold alloy coated parts thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO8705057A1 *

Also Published As

Publication number Publication date
GB2186597A (en) 1987-08-19
GB8603900D0 (en) 1986-03-26
WO1987005057A1 (en) 1987-08-27
GB2186597B (en) 1990-04-04

Similar Documents

Publication Publication Date Title
KR102537039B1 (en) Structure of tin-plated formed copper terminal material and terminal and wire termination
EP1257004B1 (en) Metal article with multilayer coating
US6335107B1 (en) Metal article coated with multilayer surface finish for porosity reduction
JP2726434B2 (en) Sn or Sn alloy coating material
CN102066614B (en) Composite material for electrical/electronic component and electrical/electronic component using the same
EP0214667B1 (en) Palladium and palladium alloy composite electrodeposits and method for their production
KR102537040B1 (en) Manufacturing method of copper terminal material with tin plating
EP0258365A1 (en) Electrical contact surface coating
US4895771A (en) Electrical contact surface coating
JP4714945B2 (en) Manufacturing method of product made of magnesium or magnesium alloy
Raub et al. The electrodeposition of gold by pulse plating: Improvements in the properties of deposits
JP2670348B2 (en) Sn or Sn alloy coating material
JP4805409B2 (en) Composite material for electric and electronic parts and electric and electronic parts using the same
US4360411A (en) Aluminum electrical contacts and method of making same
Cohen et al. Development of silver‐palladium alloy plating for electrical contact applications
CA1331325C (en) Electric power connectors
JP2010090400A (en) Electroconductive material and method for manufacturing the same
JPH0119000B2 (en)
Zhang et al. A novel electrolyte for the high speed electrodeposition of bright pure tin at elevated temperatures
JPH04165096A (en) Lead wire for electronic parts
JP2020143307A (en) Silver plated material, and method of producing the same
US3807971A (en) Deposition of non-porous and durable tin-gold surface layers in microinch thicknesses
US3790451A (en) Electrodeposition of copper from sulfur-free cyanide electrolytes using periodic reverse current
Begum et al. A study of defects generation on Ni–Co substrate during electroplating and its minimisation through proper cleaning
JP7121291B2 (en) Coupling cable and method for manufacturing coupling cable

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR NL

17P Request for examination filed

Effective date: 19880224

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: AB ELECTRONIC COMPONENTS LIMITED

17Q First examination report despatched

Effective date: 19881207

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 19910211

RIN1 Information on inventor provided before grant (corrected)

Inventor name: NOTTINGHAM, MICHAEL, CHARLES

Inventor name: SOUTER, JOHN, WILLIAM