KR920006677B1 - 자동납땜방법 및 장치 - Google Patents

자동납땜방법 및 장치 Download PDF

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Publication number
KR920006677B1
KR920006677B1 KR1019870015357A KR870015357A KR920006677B1 KR 920006677 B1 KR920006677 B1 KR 920006677B1 KR 1019870015357 A KR1019870015357 A KR 1019870015357A KR 870015357 A KR870015357 A KR 870015357A KR 920006677 B1 KR920006677 B1 KR 920006677B1
Authority
KR
South Korea
Prior art keywords
substrate
molten solder
soldering
solder
small nozzles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019870015357A
Other languages
English (en)
Korean (ko)
Other versions
KR890009521A (ko
Inventor
센이치 요코다
Original Assignee
요코다 기카이 가부시기가이샤
센이치 요코다
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 요코다 기카이 가부시기가이샤, 센이치 요코다 filed Critical 요코다 기카이 가부시기가이샤
Publication of KR890009521A publication Critical patent/KR890009521A/ko
Application granted granted Critical
Publication of KR920006677B1 publication Critical patent/KR920006677B1/ko
Expired legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0607Solder feeding devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1019870015357A 1987-12-14 1987-12-30 자동납땜방법 및 장치 Expired KR920006677B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62315837A JPH01157764A (ja) 1987-12-14 1987-12-14 自動半田付け方法及び装置
JP62-315837 1987-12-16

Publications (2)

Publication Number Publication Date
KR890009521A KR890009521A (ko) 1989-08-02
KR920006677B1 true KR920006677B1 (ko) 1992-08-14

Family

ID=18070171

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870015357A Expired KR920006677B1 (ko) 1987-12-14 1987-12-30 자동납땜방법 및 장치

Country Status (2)

Country Link
JP (1) JPH01157764A (enrdf_load_stackoverflow)
KR (1) KR920006677B1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3547377B2 (ja) * 1999-11-01 2004-07-28 松下電器産業株式会社 半田噴流装置および半田付け方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5858795A (ja) * 1981-10-03 1983-04-07 石井 銀弥 プリント基板のはんだ付け方法
JP2549618B2 (ja) * 1985-05-18 1996-10-30 株式会社東芝 噴流式半田付け装置
JPH0168163U (enrdf_load_stackoverflow) * 1987-10-22 1989-05-02

Also Published As

Publication number Publication date
JPH01157764A (ja) 1989-06-21
KR890009521A (ko) 1989-08-02
JPH0469510B2 (enrdf_load_stackoverflow) 1992-11-06

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19871230

A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19880203

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19871230

Comment text: Patent Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19900921

Patent event code: PE09021S01D

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

Comment text: Decision on Publication of Application

Patent event code: PG16051S01I

Patent event date: 19920713

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19921116

NORF Unpaid initial registration fee
PC1904 Unpaid initial registration fee