KR920003441A - CVD코팅된 Si를 함침한 SiC제품 및 그 제조방법 - Google Patents
CVD코팅된 Si를 함침한 SiC제품 및 그 제조방법 Download PDFInfo
- Publication number
- KR920003441A KR920003441A KR1019910011171A KR910011171A KR920003441A KR 920003441 A KR920003441 A KR 920003441A KR 1019910011171 A KR1019910011171 A KR 1019910011171A KR 910011171 A KR910011171 A KR 910011171A KR 920003441 A KR920003441 A KR 920003441A
- Authority
- KR
- South Korea
- Prior art keywords
- sic
- impregnated
- cvd
- substrate
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005229 chemical vapour deposition Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- 239000007789 gas Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 229910052736 halogen Inorganic materials 0.000 claims 1
- 150000002367 halogens Chemical class 0.000 claims 1
- 239000012433 hydrogen halide Substances 0.000 claims 1
- 229910000039 hydrogen halide Inorganic materials 0.000 claims 1
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
- C23C16/0236—Pretreatment of the material to be coated by cleaning or etching by etching with a reactive gas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Structural Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Products (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예를 표시하는 CVD 코팅된 Si를 함침한 SiC제품의 요부 개념도,
제3도는 본 발명품과 종래품과의 온도차와 굽힘강도와의 관계를 비교해 도시한 그래프도.
Claims (2)
- Si를 함clagksiC개재에 그 기재의 표면부터 두께의 2%~15%영역에서 함침된 Si를 제거하여 형성된 Si제거층과, 상기 Si제거층위에 CVD(화학증착)법에 의해 형성된 SiC막을 가지고 있는 것을 특징으로 하는 CVD 코팅된 Si를 함침한 SiC제품.
- Si를 함침한 SiC기재에서 800℃이상의 온도에서 할로겐 기체 혹은 할로겐화 수소기체를 흐르게 하거나, 또는 Si를 함침한 SiC기재를 센 초산 수용액중에 침적시키는 것에 의해, 또는 SiC를 합침한 SiC기재의 표면으로부터 두께의 2~15%영역에서 함침된 Si를 제거한 후, 그 Si제거층위에 CVD법에 의해 SiC막을 형성시킨 것을 특징으로 하는 CVD 코팅된 Si를 함침한 SiC제품의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP90-174845 | 1990-07-02 | ||
JP2174845A JPH0465376A (ja) | 1990-07-02 | 1990-07-02 | CVDコートSi含浸SiC製品及びその製造方法 |
JP2-174845 | 1990-07-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920003441A true KR920003441A (ko) | 1992-02-29 |
KR0145692B1 KR0145692B1 (ko) | 1998-11-02 |
Family
ID=15985660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910011171A KR0145692B1 (ko) | 1990-07-02 | 1991-07-02 | CVD코팅된 Si를 함침한 SiC 제품 및 그 제조방법 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0464447A1 (ko) |
JP (1) | JPH0465376A (ko) |
KR (1) | KR0145692B1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2975927B1 (ja) * | 1998-06-10 | 1999-11-10 | 助川電気工業株式会社 | 板体加熱装置 |
JPH11354526A (ja) * | 1998-06-10 | 1999-12-24 | Sukegawa Electric Co Ltd | 板体加熱装置 |
GR1006416B (el) * | 2007-01-18 | 2009-06-01 | Γεωργιος Βεκινης | Υβριδικο συστημα θερμομηχανικης προστασιας διαστημοπλοιων και εξερευνητικων ρομποτικων σκαφων |
JP2014027093A (ja) * | 2012-07-26 | 2014-02-06 | Sumitomo Electric Ind Ltd | 炭化珪素基板の製造方法 |
JP6798000B1 (ja) * | 2019-12-23 | 2020-12-09 | 株式会社フェローテックマテリアルテクノロジーズ | SiCとSiによる混合部材の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6311589A (ja) * | 1986-07-01 | 1988-01-19 | イビデン株式会社 | 耐熱性治具及びその製造方法 |
JPH0521297Y2 (ko) * | 1986-07-31 | 1993-06-01 | ||
JPH03146470A (ja) * | 1989-10-31 | 1991-06-21 | Shin Etsu Chem Co Ltd | 炭化ケイ素質材料 |
-
1990
- 1990-07-02 JP JP2174845A patent/JPH0465376A/ja active Pending
-
1991
- 1991-06-18 EP EP91109925A patent/EP0464447A1/en not_active Withdrawn
- 1991-07-02 KR KR1019910011171A patent/KR0145692B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0465376A (ja) | 1992-03-02 |
EP0464447A1 (en) | 1992-01-08 |
KR0145692B1 (ko) | 1998-11-02 |
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