KR920002004A - 유체 냉각식 회로 팩 조립체 - Google Patents

유체 냉각식 회로 팩 조립체 Download PDF

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Publication number
KR920002004A
KR920002004A KR1019910010049A KR910010049A KR920002004A KR 920002004 A KR920002004 A KR 920002004A KR 1019910010049 A KR1019910010049 A KR 1019910010049A KR 910010049 A KR910010049 A KR 910010049A KR 920002004 A KR920002004 A KR 920002004A
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KR
South Korea
Prior art keywords
fluid
pack assembly
circuit pack
cooled circuit
cooled
Prior art date
Application number
KR1019910010049A
Other languages
English (en)
Other versions
KR100228367B1 (ko
Inventor
아자르 카세
Original Assignee
엘. 에이취. 번바움
아메리칸 텔리폰 앤드 텔레그라프 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 엘. 에이취. 번바움, 아메리칸 텔리폰 앤드 텔레그라프 캄파니 filed Critical 엘. 에이취. 번바움
Publication of KR920002004A publication Critical patent/KR920002004A/ko
Application granted granted Critical
Publication of KR100228367B1 publication Critical patent/KR100228367B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

내용 없음

Description

유체 냉각식 회로 팩 조립체
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 실시예에 따른 유체 흐름 패턴을 포함하는 회로 팩 조립체의 측면도.
제3도는 제2도와 동일한 실시예에 따른 조립체의 부분 평면도.

Claims (8)

  1. 적어도 하나의 발열 부품이 장착되어 있는 정면 표면을 가진 제1회로 기판(20)과 ; 정면 표면과 일정한 관계로 떨어져서 반대쪽에 배치된 다른 표면(21)을 구비하는 유체 냉각식 회로 팩 조립체에 있어서, 상기 다른 표면은 상기 표면들과 사실상 평행한 방향으로 상기 부품 위로 냉각 유체의 흐름을 위한 채널을 형성하며, 어레이 형태의 구멍(26 내지 29)이 상기 다른 표면에 규정되어 채널에서 냉각 유체의 흐름이 상기 다른 표면 위의 유체가 채널 내로 끌려들어오게 구성되어 있는 것을 특징으로 하는 유체 냉각식 회로 팩 조립체.
  2. 제1항에 있어서, 상기 다른 표면은 적어도 하나의 발열 부품(23)이 장착되어 있는 제2회로 기판을 구비하는 유체 냉각식 회로 팩 조립체.
  3. 제2항에 있어서, 구멍은 폭이 적어도 0.60㎝이며, 발열 부품의 길이 만큼 뻗쳐져 있는 유체 냉각식 회로 팩 조립체.
  4. 제1항에 있어서, 구멍은 적어도 0.6㎠의 면적을 갖는 유체 냉각식 회로 팩 조립체.
  5. 제1항에 있어서, 회로 기판과 사실상 평행한 방향으로 유체를 상기 채널로 보내기 위한 수단(25)을 더 구비하는 유체 냉각식 회로 팩 조립체.
  6. 제5항에 있어서, 상기 수단은 적어도 0.75m/s의 속도로 유체 흐름을 만드는 유체 냉각식 회로 팩 조립체.
  7. 제2항에 있어서, 구멍은 냉각 유체의 흐름과 직각을 이루는 부품의 각측면과 인접하게 제2회로 기판에 배치되는 유체 냉각식 회로 팩 조립체.
  8. 제7항에 있어서, 제2회로 기판은 다수의 부품을 포함하며, 구멍은 유체 흐름의 방향과 직각을 이루는 각 부품의 각 측면과 인접하여 형성되는 유체 냉각식 회로 팩 조립체.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910010049A 1990-06-25 1991-06-18 유체 냉각식 회로 팩 조립체 KR100228367B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US542,613 1990-06-25
US07/542,613 US5121290A (en) 1990-06-25 1990-06-25 Circuit pack cooling using perforations

Publications (2)

Publication Number Publication Date
KR920002004A true KR920002004A (ko) 1992-01-30
KR100228367B1 KR100228367B1 (ko) 1999-11-01

Family

ID=24164577

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910010049A KR100228367B1 (ko) 1990-06-25 1991-06-18 유체 냉각식 회로 팩 조립체

Country Status (8)

Country Link
US (1) US5121290A (ko)
EP (1) EP0463782B1 (ko)
JP (1) JPH088425B2 (ko)
KR (1) KR100228367B1 (ko)
AU (1) AU629751B2 (ko)
CA (1) CA2041461C (ko)
DE (1) DE69102497T2 (ko)
ES (1) ES2055961T3 (ko)

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US6588497B1 (en) * 2002-04-19 2003-07-08 Georgia Tech Research Corporation System and method for thermal management by synthetic jet ejector channel cooling techniques
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US6902299B2 (en) * 2003-02-27 2005-06-07 Cantronic Systems Inc. Long distance illuminator
US20040257763A1 (en) * 2003-06-17 2004-12-23 International Business Machines Corporation Internal hard disc drive scalability using mezzanine backplane technology
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US20080151052A1 (en) * 2006-11-01 2008-06-26 Videolarm, Inc. Infrared illuminator with variable beam angle
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JP2016207928A (ja) * 2015-04-27 2016-12-08 ファナック株式会社 複数の発熱部品を冷却するヒートシンク
CN106356344B (zh) * 2016-09-08 2019-03-05 华进半导体封装先导技术研发中心有限公司 基于三维堆叠封装的风冷散热结构及制造方法
JP2020064941A (ja) * 2018-10-16 2020-04-23 住友電装株式会社 回路構造体及び電気接続箱
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Also Published As

Publication number Publication date
ES2055961T3 (es) 1994-09-01
JPH04233300A (ja) 1992-08-21
DE69102497D1 (de) 1994-07-21
KR100228367B1 (ko) 1999-11-01
DE69102497T2 (de) 1994-10-06
AU629751B2 (en) 1992-10-08
EP0463782A2 (en) 1992-01-02
CA2041461C (en) 1997-05-20
US5121290A (en) 1992-06-09
EP0463782A3 (en) 1992-05-06
JPH088425B2 (ja) 1996-01-29
EP0463782B1 (en) 1994-06-15
CA2041461A1 (en) 1991-12-26
AU7816891A (en) 1992-01-30

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